Life assessment requires comprehensive monitoring of the following indicators:

Smart Monitoring Solution: We offer optional embedded sensor pads that transmit real-time pressure/temperature data to customer MES systems. Professional surface topography analysis is recommended after every 500 polishing cycles.

Three special requirements must be met:

• Low-stress polishing: Elastic substrate modulus must match GaN’s brittle nature (fracture toughness < 2 MPa·m¹/²) to prevent micro-cracks

• Resistance to strong alkaline environments: PTFE-modified polyurethane enables stable operation > 200 hours in KOH-based slurries with pH > 12

• Enhanced thermal management: Thermal conductivity > 0.5 W/m·K for rapid dissipation of localized friction heat (GaN is temperature-sensitive)
  Jizhi Electronics’ GaN-specific pad series has been validated in 6-inch wafer mass production, with warpage control < 50 µm.

Improvement can be quantified through three key metrics:

1. TTV Improvement: Proprietary porous elastic layer design controls wafer total thickness variation to < 0.3 µm (40% improvement over conventional pads)

2. Removal Rate Uniformity: Micro-channel technology improves within-wafer non-uniformity (WIWNU) to > 95%

3. Defect Control: Flexible fiber surface structure reduces scratch defect density to < 0.05 counts/cm²
   We offer free process audit services to provide customers with benchmark comparison reports.