Ultra-precision polishing technology in the photovoltaic and semiconductor industry
The function of CMP polishing liquid for glass hard disks
JEEZ CMP chemical mechanical polishing slurry for glass hard disk is specially designed for glass discs, glass hard disks, optical storage media and semiconductor-grade glass substrates. It provides a polishing solution with nanometer-level planarization and ultra-low surface roughness (Ra < 0.5nm). This product uses high-purity cerium oxide (CeO2) and customized SiO2 colloidal abrasives, combined with an exclusive chemical etching formula, to achieve efficient and low-defect polishing of glass discs, meeting the needs of high-end applications such as optical storage (such as Microsoft Project Silica) and semiconductor packaging (such as 2.5D/3D IC interposers).
Product Features
- Ultra-precision surface treatment
Atomic-level smoothness: AFM surface roughness detection ensures that the data layer of the glass disc is free from interference in reading and writing.
- High material removal rate (MRR) and selectivity
MRR ≥ 500 nm/min (quartz glass), while suppressing dishing < 1%.
Intelligent pH regulation optimizes the chemical reaction rate on the glass surface and reduces mechanical damage.
- Environmental protection and stability
Heavy metal-free formula, compliant with the EU RoHS standard, and the waste liquid is easy to handle.
It has good suspension stability, uniform particle dispersion, and completely avoids agglomeration and scratching.
- Full-scenario compatibility
Compatible with 8-12-inch glass substrates, and supports integration with CMP equipment (such as AMAT, Ebara, and HHS).
