Gizhil Electronic’s ceramic copper-clad substrate grinding fluid / DPC polishing slurry / DBC grinding fluid typically involves two processes: coarse polishing and fine polishing. Depending on the customer’s requirements for workpiece polishing and surface roughness, different DPC grinding fluids or fine polishing slurries are selected.
The coarse polishing process for ceramic copper-clad DPC/DBC substrates primarily focuses on rapid thickness reduction and improved polishing efficiency. For DPC substrates requiring higher quality, a secondary fine polishing step is necessary to remove surface defects and imperfections. After using Gizhil Electronic’s ceramic copper-clad substrate grinding fluid / fine polishing slurry, the surface roughness (Ra) of DPC/DBC substrates can achieve values below 0.003 μm.
Choosing Gizhil Electronic’s ceramic copper-clad substrate grinding fluid / DPC polishing slurry / DBC grinding fluid enables effective results at different stages of coarse and fine polishing for ceramic substrates. After Gizhil’s CMP polishing, the comparison of workpieces is as follows:
