Depending on the specific semiconductor industry processes, CMP (Chemical Mechanical Polishing) slurries can be categorized into dielectric layer CMP slurries, barrier layer CMP slurries, copper CMP slurries, silicon CMP slurries, tungsten CMP slurries, TSV (Through-Silicon Via) CMP slurries, shallow trench isolation CMP slurries, and others.
SiC CMP slurry is one of the essential materials required in the semiconductor wafer manufacturing process. It plays a crucial role in the polishing of silicon carbide material workpieces. Factors such as the type of slurry, particle dispersion, particle size, physicochemical properties, and stability are closely related to the polishing outcome.
In recent years, driven by advancements in technologies such as artificial intelligence, 5G, and data centers, the application areas of silicon carbide substrates have continued to expand, and the market size has grown steadily. This, in turn, has led to an increasing demand for CMP slurries in the market.
