Gizhil Electronic’s silicon carbide fine polishing slurry is suitable for the surface planarization of SiC silicon carbide wafer substrates during precision machining. The slurry used for wafer polishing exhibits high polishing efficiency and low surface roughness. After polishing with Gizhil Electronic’s SiC substrate polishing slurry, the wafer surface is free from defects such as scratches and haze, ensuring excellent flatness of the silicon carbide wafers. Developed by Gizhil Electronic, this silicon carbide polishing slurry offers a high dilution ratio and easy post-polishing cleaning, making it widely applicable in the manufacturing of semiconductor integrated circuit substrates.
Gizhil Electronic’s SiC slurry for wafer polishing features excellent fluidity and dispersibility, along with advantages such as resistance to crystallization, easy cleaning, and high polishing efficiency. It meets the fine polishing requirements for silicon carbide wafers and can also be customized as a chemical mechanical polishing slurry for silicon wafers (Si wafers) based on customer-specific processes.
