Why Choose CMP Over Electrochemical Polishing for 3C Product Mirror Polishing? In the 3C industry (mobile phones, laptops, smart wearables, etc.), electrochemical polishing is gradually being replaced by CMP (Chemical Mechanical Polishing) due to issues like edge over-etching and material limitations. Through the mechano-chemical synergy of its nanoscale SiO2 polishing slurry, Jizhi Electronics achieves: ① Nanoscale Precision: Surface roughness Ra < 2nm, meeting optical-grade mirror requirements. ② Complex Structure Adaptability: Suitable for irregular parts like aluminum alloy mid-frames and stainless steel buttons. ③ Efficiency Improvement: Reduces processing time by 30% compared to traditional methods. In-depth Analysis of the Pitting Problem with Silica Polishing Slurry Customer-reported pitting ...

In fields such as semiconductor manufacturing, precision optics, and hard alloy processing, the ultra-precision polishing of material surfaces directly determines product performance and reliability. Leveraging advanced R&D capabilities and mature process technology, Jizhi Electronics introduces its high-performance series of diamond polishing/grinding slurries, providing efficient and stable polishing solutions for high-hardness materials. Jizhi Electronics' diamond suspension products (grinding slurry/polishing slurry) cater to various polishing needs and are classified as follows based on material characteristics and process requirements: 1. Classification by Crystal Structure Monocrystalline Diamond Polishing Slurry: Features a single crystal structure and uniform cutting force, suitable for high-precision surface polishing and reducing ...

I. CMP Polishing Technology: A Key Process in Semiconductor Manufacturing Chemical Mechanical Planarization (CMP) is one of the core processes in semiconductor silicon wafer manufacturing, directly impacting chip performance and yield. During wafer processing, CMP achieves atomic-level surface planarization (roughness <0.2nm) through the synergistic action of chemical corrosion and mechanical grinding, meeting the ultra-clean and ultra-flat surface requirements of advanced process nodes. Three Core Functions of Jizhi Electronics CMP Polishing Slurry ① Efficient Polishing: Nanoscale abrasives (e.g., colloidal SiO2) precisely remove surface protrusions, improving wafer flatness and reducing micro-scratches. ② Lubrication and Protection: Special additives reduce the coefficient of friction (<0.05), minimizing equipment wear ...

In the global planarization stage of wafer manufacturing, Chemical Mechanical Polishing (CMP) is a critical process. As a core consumable, CMP polishing slurry directly determines key wafer surface metrics such as flatness and defect rate, impacting the final chip performance and yield. Based on the core advantages and selection criteria of CMP polishing slurries, Jizhi Electronics provides practical reference for semiconductor manufacturing enterprises. I. Four Core Characteristics of CMP Polishing Slurry CMP polishing slurry is formulated from components like abrasives, oxidizers, and chelating agents, requiring a balance between "chemical corrosion" and "mechanical grinding." Its core characteristics can be summarized as ...