CMP (Chemical Mechanical Polishing) is currently the only technology used in modern industrial manufacturing for surface polishing of workpieces and global planarization of wafer surfaces in integrated circuit manufacturing. The CMP process achieves surface polishing through chemical and mechanical actions. It is widely applied in integrated circuit technology, wafer chip planarization, aerospace materials, the metal industry, and mirror polishing of materials in the optoelectronic industry. Schematic Diagram of Jizhi Electronics CMP Polishing Process Based on the type of material being polished, CMP can be divided into three main categories: (1) Substrates: Primarily silicon materials. (2) Metals: Including Al/Cu metal interconnect ...