3C Product Mirror Polishing Solution: Pitting-Free SiO2 Silica Polishing Slurry
Why Choose CMP Over Electrochemical Polishing for 3C Product Mirror Polishing?
In the 3C industry (mobile phones, laptops, smart wearables, etc.), electrochemical polishing is gradually being replaced by CMP (Chemical Mechanical Polishing) due to issues like edge over-etching and material limitations. Through the mechano-chemical synergy of its nanoscale SiO2 polishing slurry, Jizhi Electronics achieves:
① Nanoscale Precision: Surface roughness Ra < 2nm, meeting optical-grade mirror requirements.
② Complex Structure Adaptability: Suitable for irregular parts like aluminum alloy mid-frames and stainless steel buttons.
③ Efficiency Improvement: Reduces processing time by 30% compared to traditional methods.
In-depth Analysis of the Pitting Problem with Silica Polishing Slurry
Customer-reported pitting issues often stem from:
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Silica Sol Corrosion: Na+, Cl- ions in low-purity slurry triggering electrochemical corrosion of metals.
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Process Defects: Residual scratches > 0.1μm from previous rough polishing stages being amplified during fine polishing.
Jizhi Electronics Solution
① High-Purity Ammonia-Stabilized Silica Sol: Metal impurities < 1ppm, with precise pH control (8-10).
② Surface Modification Technology: Abrasives coated with silane coupling agents reduce direct contact corrosion.
③ Process Package Support: Provides complete parameter sets from rough polishing (Ra 50nm → 10nm) to fine polishing (Ra → 2nm).
Technical Advantages of Jizhi Electronics Silica Polishing Slurry
| Technical Indicator | Industry Standard Product | Jizhi Electronics Solution |
|---|---|---|
| Abrasive Particle Size | 50-200nm (wide distribution) | 10-150nm (D50 ±5nm) |
| Metal Impurities | > 10ppm | < 1ppm (ICP-MS certified) |
| Corrosion Test | Oxidation appears after 48 hours | No corrosion after 96 hours (ASTM B117) |
Jizhi Electronics provides high-precision, non-corrosive SiO2 polishing slurry/CMP polishing pads to solve the pitting problem in 3C product mirror polishing. Our nanoscale abrasives (10-150nm) achieve surface precision of Ra < 2nm. With 25 years of CMP process technology expertise, we empower polishing upgrades for semiconductors, metals, and silicon wafers! For further technical exchange, you can contact the Jizhi Electronics technical team to obtain the “3C Product CMP Polishing White Paper” and industry solutions.
