Functions and Efficacy of Diamond Suspension (Specialized for CMP Polishing)

In fields such as semiconductor manufacturing, precision optics, and hard alloy processing, the ultra-precision polishing of material surfaces directly determines product performance and reliability. Leveraging advanced R&D capabilities and mature process technology, Jizhi Electronics introduces its high-performance series of diamond polishing/grinding slurries, providing efficient and stable polishing solutions for high-hardness materials.

Jizhi Electronics’ diamond suspension products (grinding slurry/polishing slurry) cater to various polishing needs and are classified as follows based on material characteristics and process requirements:

1. Classification by Crystal Structure

• Monocrystalline Diamond Polishing Slurry: Features a single crystal structure and uniform cutting force, suitable for high-precision surface polishing and reducing sub-surface damage.

• Polycrystalline Diamond Polishing Slurry: Composed of multi-directional crystal grains, it offers a high material removal rate and is suitable for efficient rough and intermediate polishing.

• Polycrystalline-like Diamond Polishing Slurry: Combines the advantages of both monocrystalline and polycrystalline types, balancing cutting efficiency and surface quality, ideal for transitional polishing stages.

2. Classification by Solvent Medium

• Water-based Diamond Grinding Slurry: Environmentally friendly and easy to clean, suitable for polishing precision electronic components like semiconductor silicon wafers and silicon carbide (SiC) wafers.

• Oil-based Diamond Grinding Slurry: Offers better lubricity, suitable for prolonged stable grinding of high-hardness materials like hard alloys and ceramics.

3. Classification by Particle Size Specification

Jizhi Electronics provides diamond polishing slurries in various particle sizes such as 1μm, 3μm, 6μm, 7μm, and 9μm to meet the needs of different polishing stages:

• Rough Polishing (6μm~9μm): Rapid material removal for improved processing efficiency.

• Intermediate Polishing (3μm~6μm): Balances cutting force and surface quality.

• Fine Polishing (1μm~3μm): Achieves an ultra-smooth surface and reduces roughness.

Application Compatibility of Jizhi Electronics Diamond Grinding/Polishing Slurry:

① Semiconductor Industry: Planarization polishing of silicon wafers, silicon carbide (SiC), and gallium nitride (GaN) wafers.
② Hard Alloys & Precision Ceramics: Ultra-precision machining of tools, bearings, ceramic substrates, etc.
③ Optical Components: High-finish polishing of sapphire, optical glass, etc.

Jizhi Electronics Provides Customized CMP Polishing/Grinding Solutions

We offer personalized CMP polishing slurry formulations tailored to different materials (e.g., SiC, tungsten steel, ceramics) and customer requirements, optimizing polishing efficiency and surface quality.

Jizhi Electronics, with deep expertise in the polishing materials field, utilizes high-purity diamond micropowder, advanced dispersion technology, and customized formulations to provide efficient, stable, and cost-effective polishing solutions for the semiconductor, precision optics, and hard alloy industries.

If you are seeking CMP polishing optimization solutions for high-hardness materials, please feel free to contact us for customized product recommendations and technical support!