Worin besteht der Hauptunterschied zwischen einem CMP-Finish-Pad und Grob-/Zwischenpolierpads? Wie sollten sie ausgewählt werden?
CMP finishing pads (Final Pads) are specifically designed for ultra-precise surface finishing. Their key characteristics include:
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Finer surface structure: Porosity < 10% with higher groove density for nanoscale material removal control (< 50 nm/min)
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Optimized elastic modulus (typically < 500 MPa): Buffers pressure through flexible contact to avoid surface damage
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Enhanced chemical compatibility: Surface-treated for alkaline/oxidative slurries
Selection Guide: -
Rough polishing stage: Use high-hardness pads (> 1 GPa) for rapid removal
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Finishing stage: Must use finishing pads to ensure surface roughness Ra < 0.5 nm
Jizhi Electronics offers complete pad portfolio solutions with intelligent process parameter matching.
