{"id":1764,"date":"2026-04-07T15:54:55","date_gmt":"2026-04-07T07:54:55","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=1764"},"modified":"2026-04-07T16:32:15","modified_gmt":"2026-04-07T08:32:15","slug":"cmp-pad-materials-polyurethane-vs-other-options","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/de\/blog\/cmp-pad-materials-polyurethane-vs-other-options\/","title":{"rendered":"CMP Pad Materials: Polyurethane vs. All Other Options \u2014 A Complete Comparison"},"content":{"rendered":"<!-- ============================================================\r\n     CLUSTER 3 \u2014 CMP Pad Materials: Polyurethane vs Other Options\r\n     Jizhi Electronic Technology Co., Ltd.\r\n     jeez-semicon.com  |  April 2026\r\n     Paste into WordPress Gutenberg \u2192 Custom HTML block\r\n     URL: \/blog\/CMP-Pad-Materials-Polyurethane-vs-Other-Options\r\n     ============================================================ -->\r\n<p><style>\r\n@import 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16px;font-size:15px;color:#3a4255;line-height:1.75}\r\n\r\n@media(max-width:640px){\r\n  .jz-hero{padding:36px 24px 32px}\r\n  .jz-cta-banner{padding:32px 22px}\r\n  .jz-related{padding:24px 18px}\r\n  .jz-btn-outline{margin-left:0;margin-top:10px;display:inline-block}\r\n}\r\n<\/style><\/p>\r\n<div class=\"jz-art\"><!-- Back to Pillar --> <a class=\"jz-back\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Polishing-Pads-The-Complete-Guide\/\" target=\"_blank\" rel=\"noopener\">Back to CMP Polishing Pads: The Complete Guide<\/a> <!-- Hero -->\r\n<div class=\"jz-hero\">\r\n<div class=\"jz-hero-kicker\">Jizhi Electronic Technology \u2014 Materials Series<\/div>\r\n<p class=\"jz-hero-lead\">An in-depth, property-by-property comparison of every major CMP polishing pad material \u2014 polyurethane foam, soft felt composites, fixed-abrasive pads, poreless polymer films, and next-generation alternatives \u2014 with guidance on matching material to application.<\/p>\r\n<div class=\"jz-hero-meta\">\ud83d\udcc5 April 2026\u23f1 17 min read\ud83c\udfed Jizhi Electronic Technology Co., Ltd.<\/div>\r\n<\/div>\r\n<!-- Tags -->\r\n<div class=\"jz-tags\"><span class=\"jz-tag\">CMP Pad Materials<\/span> <span class=\"jz-tag\">Polyurethane CMP Pad<\/span> <span class=\"jz-tag\">Fixed-Abrasive Pad<\/span> <span class=\"jz-tag\">Poreless CMP Pad<\/span> <span class=\"jz-tag\">Non-Woven Pad<\/span> <span class=\"jz-tag\">Pad Chemistry<\/span> <span class=\"jz-tag\">CMP Consumables<\/span><\/div>\r\n<!-- Trust bar -->\r\n<div class=\"jz-trust\">\r\n<div class=\"jz-trust-badge\">R&amp;D<br \/>Verified<\/div>\r\n<div class=\"jz-trust-text\"><strong>Written by Jizhi Electronic Technology Co., Ltd.<\/strong> \u2014 CMP pad manufacturer with proprietary polyurethane formulation capabilities. Our in-house materials laboratory characterizes pore structure, polymer morphology, and mechanical properties from every production lot. April 2026.<\/div>\r\n<\/div>\r\n<!-- TOC -->\r\n<div class=\"jz-toc\">\r\n<div class=\"jz-toc-title\">\ud83d\udccb Inhaltsverzeichnis<\/div>\r\n<ol>\r\n<li><a href=\"#why-materials-matter\">Why Pad Material Is the Foundation<\/a><\/li>\r\n<li><a href=\"#polyurethane-filled\">Polyurethane (Filled \/ Porous) \u2014 The Industry Standard<\/a><\/li>\r\n<li><a href=\"#polyurethane-soft\">Soft Polyurethane Foam \u2014 Cu BEOL Specialist<\/a><\/li>\r\n<li><a href=\"#nonwoven-fiber\">Non-Woven Fiber Composites \u2014 Legacy and Substrate Work<\/a><\/li>\r\n<li><a href=\"#fixed-abrasive\">Fixed-Abrasive Pads \u2014 High-Hardness Applications<\/a><\/li>\r\n<li><a href=\"#poreless\">Poreless Polymer Films \u2014 Next-Generation Architecture<\/a><\/li>\r\n<li><a href=\"#master-comparison\">Master Comparison: All Materials Side by Side<\/a><\/li>\r\n<li><a href=\"#selection-decision\">Material Selection Decision Framework<\/a><\/li>\r\n<li><a href=\"#chemistry-deep-dive\">Polyurethane Chemistry Deep Dive<\/a><\/li>\r\n<li><a href=\"#faq\">FAQ<\/a><\/li>\r\n<\/ol>\r\n<\/div>\r\n<!-- Intro -->\r\n<p>The choice of pad material is the single most consequential design decision in CMP polishing pad engineering. It determines the hardness ceiling and floor achievable by formulation, the slurry retention mechanism available, the chemical compatibility with aggressive slurry systems, and the thermal stability at process temperatures. Every other pad design variable \u2014 groove geometry, pore size distribution, backing layer \u2014 operates within the envelope set by the base material.<\/p>\r\n<p>Yet pad material selection is poorly documented in publicly available literature. Suppliers typically describe their pads by product family name \u2014 IC1000, Politex, Trizact \u2014 rather than by material class, making cross-supplier comparisons difficult. This article provides the systematic, material-class-level analysis that fab engineers and procurement teams need. If you are new to CMP pads and want context before this deep dive, start with: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/What-Is-a-CMP-Polishing-Pad-The-Ultimate-Guide\/\" target=\"_blank\" rel=\"noopener\">What Is a CMP Polishing Pad? The Ultimate Guide<\/a>.<\/p>\r\n<div class=\"jz-stats\">\r\n<div class=\"jz-stat\">\r\n<div class=\"jz-stat-num\">&gt;60%<\/div>\r\n<div class=\"jz-stat-label\">Market share of filled polyurethane pads in volume production CMP<\/div>\r\n<\/div>\r\n<div class=\"jz-stat\">\r\n<div class=\"jz-stat-num\">30\u201370<\/div>\r\n<div class=\"jz-stat-label\">Shore D hardness range achievable in polyurethane CMP pads by formulation<\/div>\r\n<\/div>\r\n<div class=\"jz-stat\">\r\n<div class=\"jz-stat-num\">20\u201380 \u00b5m<\/div>\r\n<div class=\"jz-stat-label\">Typical pore diameter range in commercial filled-PU pads<\/div>\r\n<\/div>\r\n<div class=\"jz-stat\">\r\n<div class=\"jz-stat-num\">80\u2013120\u00b0C<\/div>\r\n<div class=\"jz-stat-label\">Glass transition temperature (Tg) range of production PU pad matrices<\/div>\r\n<\/div>\r\n<\/div>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 1 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"why-materials-matter\">1. Why Pad Material Is the Foundation of Everything Else<\/h2>\r\n<p>Before examining each material class, it is worth establishing precisely which properties are material-determined versus design-determined in a CMP pad. This distinction clarifies why material selection must come first in pad engineering.<\/p>\r\n<div class=\"jz-two-col\">\r\n<div class=\"jz-col-box\">\r\n<h4>\ud83d\udd29 Material-Determined Properties<\/h4>\r\n<ul>\r\n<li>Bulk hardness range (Shore A\/D)<\/li>\r\n<li>Glass transition temperature (Tg) \u2014 thermal ceiling<\/li>\r\n<li>Chemical resistance to slurry reagents (oxidizers, pH extremes)<\/li>\r\n<li>Elastic modulus and creep behavior under sustained load<\/li>\r\n<li>Inherent porosity type (open-cell, closed-cell, poreless)<\/li>\r\n<li>Surface wettability with aqueous slurries<\/li>\r\n<li>Maximum operating temperature before property degradation<\/li>\r\n<\/ul>\r\n<\/div>\r\n<div class=\"jz-col-box\">\r\n<h4>\ud83d\udd27 Design-Determined Properties (Within Material Envelope)<\/h4>\r\n<ul>\r\n<li>Precise hardness value (via formulation within material range)<\/li>\r\n<li>Pore size and density (via microsphere selection and loading)<\/li>\r\n<li>Groove geometry (machined post-curing)<\/li>\r\n<li>Pad thickness (set by casting process)<\/li>\r\n<li>Backing layer type and PSA specification<\/li>\r\n<li>Surface texture after conditioning (conditioner-dependent)<\/li>\r\n<\/ul>\r\n<\/div>\r\n<\/div>\r\n<p>This framework explains why a soft polyurethane pad, no matter how expertly formulated, cannot be made as hard as a fixed-abrasive diamond pad \u2014 the material ceiling is absolute. Similarly, a non-woven fiber pad cannot be made poreless by design modification; its intrinsic fibrous structure defines its slurry retention mechanism. Understanding these constraints prevents engineers from trying to push a material beyond its inherent capability.<\/p>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 2 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"polyurethane-filled\">2. Filled Polyurethane (Porous Hard Pad) \u2014 The Industry Standard<\/h2>\r\n<p>Filled, closed-cell polyurethane foam is by far the dominant CMP pad material in high-volume semiconductor manufacturing. It is the reference material against which all alternatives are benchmarked. Understanding its structure, chemistry, and property range in depth is essential context for evaluating alternatives. For how this material functions during polishing, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/How-CMP-Polishing-Pads-Work\/\" target=\"_blank\" rel=\"noopener\">How CMP Polishing Pads Work<\/a>.<\/p>\r\n<div class=\"jz-mat-grid\">\r\n<div class=\"jz-mat-card\">\r\n<div class=\"jz-mat-header jz-mat-header-pu\">\r\n<div class=\"jz-mat-icon\">\ud83d\udd37<\/div>\r\n<div>\r\n<div class=\"jz-mat-name\">Filled Polyurethane<\/div>\r\n<div class=\"jz-mat-sub\">Closed-cell PU foam \u00b7 IC1000 type<\/div>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jz-mat-body\">\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">H\u00e4rte<\/span><span class=\"jz-mat-val green\">Shore D 55\u201365<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Pore type<\/span><span class=\"jz-mat-val\">Closed-cell, 20\u201350 \u00b5m<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Tg (glass transition)<\/span><span class=\"jz-mat-val\">90\u2013120\u00b0C<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Chemische Best\u00e4ndigkeit<\/span><span class=\"jz-mat-val green\">Ausgezeichnet<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Planarization eff.<\/span><span class=\"jz-mat-val green\">Hoch<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Defect risk<\/span><span class=\"jz-mat-val amber\">M\u00e4\u00dfig<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Cost index<\/span><span class=\"jz-mat-val green\">1.0\u00d7 (baseline)<\/span><\/div>\r\n<div class=\"jz-mat-desc\">The workhorse of semiconductor CMP. Tunable hardness, proven lot-to-lot consistency, compatible with all major slurry chemistries. Best for oxide ILD, W plug, STI, and all front-end-of-line steps.<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<h3>Polyurethane Synthesis and the Hardness Knob<\/h3>\r\n<p>Polyurethane is synthesized by the condensation reaction of a polyfunctional isocyanate with a polyol. The ratio of isocyanate groups to hydroxyl groups (the NCO\/OH index) is the primary lever controlling cross-link density and therefore hardness. A higher NCO\/OH index yields a more tightly cross-linked network, a higher Young&#8217;s modulus, and a higher Shore D hardness. The polyol backbone type \u2014 polyether, polyester, or polycarbonate \u2014 governs hydrolytic stability, low-temperature flexibility, and chemical resistance.<\/p>\r\n<div class=\"jz-callout info\">\r\n<div class=\"jz-callout-icon\">\ud83d\udd2c<\/div>\r\n<div class=\"jz-callout-body\"><strong>Jizhi&#8217;s Proprietary PU Formulation Chemistry<\/strong> Jizhi Electronic Technology formulates its hard polyurethane CMP pads using a polycarbonate-diol polyol backbone, which provides superior hydrolytic resistance compared to conventional polyether-based matrices \u2014 critical for stability under the alkaline pH conditions used in oxide and tungsten CMP slurries. Our NCO\/OH index is controlled to \u00b10.8% per production batch, producing pad hardness variation of less than \u00b11.5 Shore D points lot-to-lot. This consistency directly translates to batch-to-batch removal rate repeatability of &lt;4% coefficient of variation.<\/div>\r\n<\/div>\r\n<h3>The Role of Hollow Microspheres<\/h3>\r\n<p>The pore structure in filled PU CMP pads is created by dispersing hollow polymeric microspheres (typically expanded acrylonitrile or polyvinylidene chloride shells, 20\u201350 \u00b5m in diameter) into the PU precursor mixture before curing. The microspheres remain intact during curing, forming a closed-cell architecture rather than the open-cell foam of a conventional sponge. Key microsphere parameters and their process effects:<\/p>\r\n<div class=\"jz-table-wrap\">\r\n<table class=\"jz-table\">\r\n<thead>\r\n<tr>\r\n<th>Microsphere Parameter<\/th>\r\n<th>Effect on Pad Properties<\/th>\r\n<th>Effect on CMP Process<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td><strong>Mean diameter (\u00b5m) \u2191<\/strong><\/td>\r\n<td>Larger pores, lower effective bulk density, lower hardness<\/td>\r\n<td>Higher slurry reservoir capacity; slightly lower contact area<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Size distribution (CV%) \u2191<\/strong><\/td>\r\n<td>Wider variation in local surface texture after conditioning<\/td>\r\n<td>Higher within-pad MRR non-uniformity; wider removal rate distribution<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Loading (volume fraction) \u2191<\/strong><\/td>\r\n<td>Lower effective hardness; higher compressibility<\/td>\r\n<td>Better wafer conformance; lower planarization efficiency<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Shell wall thickness \u2191<\/strong><\/td>\r\n<td>Stiffer microspheres; higher effective bulk modulus<\/td>\r\n<td>More consistent pore exposure after conditioning; fewer debris fragments<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 3 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"polyurethane-soft\">3. Soft Polyurethane Foam \u2014 The Cu BEOL and Low-k Specialist<\/h2>\r\n<div class=\"jz-mat-grid\">\r\n<div class=\"jz-mat-card\">\r\n<div class=\"jz-mat-header jz-mat-header-soft\">\r\n<div class=\"jz-mat-icon\">\ud83d\udd39<\/div>\r\n<div>\r\n<div class=\"jz-mat-name\">Soft Polyurethane Foam<\/div>\r\n<div class=\"jz-mat-sub\">Open-cell or low-density PU \u00b7 Politex \/ subpad type<\/div>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jz-mat-body\">\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">H\u00e4rte<\/span><span class=\"jz-mat-val amber\">Shore D 28\u201345<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Pore type<\/span><span class=\"jz-mat-val\">Open-cell or large closed-cell<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Tg (glass transition)<\/span><span class=\"jz-mat-val\">55\u201380\u00b0C<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Chemische Best\u00e4ndigkeit<\/span><span class=\"jz-mat-val amber\">M\u00e4\u00dfig<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Planarization eff.<\/span><span class=\"jz-mat-val red\">Low\u2013Moderate<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Defect risk<\/span><span class=\"jz-mat-val green\">Niedrig<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Cost index<\/span><span class=\"jz-mat-val green\">0.8\u20131.1\u00d7<\/span><\/div>\r\n<div class=\"jz-mat-desc\">Engineered for within-wafer uniformity and gentle, low-defect finishing. Preferred as a subpad beneath a hard top pad in stacked configurations, and as the primary pad for Cu BEOL and ultra-thin low-k dielectric CMP.<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<p>Soft polyurethane pads use a lower NCO\/OH index and higher microsphere loading than hard pads, yielding a more open, compliant polymer network. The lower Young&#8217;s modulus \u2014 typically 10\u201360 MPa versus 200\u2013500 MPa for hard PU \u2014 means that under applied down-force, the pad surface conforms to wafer-scale topography rather than bridging over it. This conformance delivers two benefits:<\/p>\r\n<ul>\r\n<li><strong>Improved edge-center uniformity:<\/strong> The compliant pad accommodates wafer bow and warp (common in 300 mm wafers post-stress-inducing deposition steps), distributing contact pressure more evenly from center to edge.<\/li>\r\n<li><strong>Lower shear stress on fragile films:<\/strong> The reduced contact stiffness lowers peak shear forces at the pad-wafer interface \u2014 critical for protecting porous low-k dielectrics (k &lt; 2.5), which can delaminate or crack under the shear forces generated by hard pads at standard process pressures.<\/li>\r\n<\/ul>\r\n<p>The trade-off is reduced planarization efficiency. A soft pad that conforms to topography cannot preferentially remove from high points \u2014 it removes everywhere. For the detailed hard-versus-soft selection framework with application mapping, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/Hard-vs-Soft-CMP-Polishing-Pads-Selection-Guide\/\" target=\"_blank\" rel=\"noopener\">Hard vs. Soft CMP Polishing Pads: Selection Guide<\/a>.<\/p>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 4 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"nonwoven-fiber\">4. Non-Woven Fiber Composites \u2014 Legacy Oxide and Substrate Applications<\/h2>\r\n<div class=\"jz-mat-grid\">\r\n<div class=\"jz-mat-card\">\r\n<div class=\"jz-mat-header jz-mat-header-fiber\">\r\n<div class=\"jz-mat-icon\">\ud83d\udfe2<\/div>\r\n<div>\r\n<div class=\"jz-mat-name\">Non-Woven Fiber Composite<\/div>\r\n<div class=\"jz-mat-sub\">Felt \/ fiber-PU composite \u00b7 Suba type<\/div>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jz-mat-body\">\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">H\u00e4rte<\/span><span class=\"jz-mat-val\">Shore A 50\u201375<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Pore type<\/span><span class=\"jz-mat-val\">Open inter-fiber channels<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Tg<\/span><span class=\"jz-mat-val\">Fiber-dependent (&gt;150\u00b0C)<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Chemische Best\u00e4ndigkeit<\/span><span class=\"jz-mat-val amber\">Moderate (fiber swelling risk)<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Slurry retention<\/span><span class=\"jz-mat-val green\">Sehr hoch<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Defect risk<\/span><span class=\"jz-mat-val amber\">Moderate\u2013High (fiber debris)<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Cost index<\/span><span class=\"jz-mat-val green\">0.5\u20130.75\u00d7<\/span><\/div>\r\n<div class=\"jz-mat-desc\">The original CMP pad material class. High slurry uptake and low cost make it useful for substrate lapping and legacy oxide steps. Fiber debris and poor uniformity limit its use at advanced nodes below 28 nm.<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<p>Non-woven fiber composite pads consist of a mat of synthetic fibers (polyester, nylon, or polyaramid) bonded by a PU impregnant that fills the inter-fiber spaces. The fibrous architecture creates a highly open, interconnected pore network with extremely high slurry uptake \u2014 the pad behaves almost like a sponge, absorbing and releasing slurry readily. This makes fiber pads forgiving of slurry flow interruptions and effective at maintaining a continuously replenished slurry film across a large contact area.<\/p>\r\n<p>The limitations of fiber pads are significant for advanced semiconductor applications. Individual fibers can break or shed during polishing, generating particles that contaminate the wafer surface and cause scratch defects. Fiber pads also exhibit highly anisotropic mechanical properties \u2014 their response differs depending on the orientation of fiber compression relative to the polishing direction \u2014 creating a directionality in removal rate that is difficult to control. For these reasons, fiber composite pads are rarely used for CMP steps at nodes below 28 nm, where defect density requirements are too stringent. They remain relevant for substrate lapping (SiC, sapphire, glass), back-side grinding support, and cost-sensitive mature-node production.<\/p>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 5 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"fixed-abrasive\">5. Fixed-Abrasive Pads \u2014 The Ultra-Hard Material Specialist<\/h2>\r\n<div class=\"jz-mat-grid\">\r\n<div class=\"jz-mat-card\">\r\n<div class=\"jz-mat-header jz-mat-header-fixed\">\r\n<div class=\"jz-mat-icon\">\ud83d\udc8e<\/div>\r\n<div>\r\n<div class=\"jz-mat-name\">Fixed-Abrasive Pad<\/div>\r\n<div class=\"jz-mat-sub\">Diamond or ceria embedded in binder matrix<\/div>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jz-mat-body\">\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">H\u00e4rte<\/span><span class=\"jz-mat-val\">Binder-dependent (very hard)<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Abrasive<\/span><span class=\"jz-mat-val\">Diamond (SiC\/GaN) \/ ceria (oxide)<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Slurry requirement<\/span><span class=\"jz-mat-val green\">Chemistry only (no abrasive)<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">MRR on hard materials<\/span><span class=\"jz-mat-val green\">Sehr hoch<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Sub-surface damage<\/span><span class=\"jz-mat-val red\">High without care<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Cost index<\/span><span class=\"jz-mat-val red\">3\u20138\u00d7<\/span><\/div>\r\n<div class=\"jz-mat-desc\">Abrasive particles permanently embedded in the pad surface. Eliminates slurry abrasive cost and enables polishing of ultra-hard materials (SiC, GaN, sapphire) that cannot be efficiently processed with free-abrasive slurry alone.<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<p>Fixed-abrasive pads differ fundamentally from all other pad types: they do not rely on free-abrasive particles delivered by the slurry for mechanical removal. Instead, abrasive particles \u2014 most commonly diamond for ultra-hard substrates, or ceria for optical oxide polishing \u2014 are permanently bonded into the pad surface during manufacturing. Only a chemical conditioning solution (without abrasive) needs to be dispensed during polishing.<\/p>\r\n<h3>Where Fixed-Abrasive Pads Are Essential<\/h3>\r\n<p>For silicon carbide (SiC) substrates, with a Mohs hardness of 9.5, conventional free-abrasive CMP processes deliver removal rates below 50 \u00c5\/min \u2014 commercially unviable for 150 mm or 200 mm wafer production. Diamond-embedded fixed-abrasive pads, combined with oxidizing chemistry, can deliver SiC removal rates of 500\u20132,000 \u00c5\/min, making them the primary material removal tool in SiC substrate preparation. For the complete picture of SiC polishing pad requirements, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/SiC-CMP-Polishing-Pads-for-Third-Generation-Semiconductors\/\" target=\"_blank\" rel=\"noopener\">SiC CMP Polishing Pads for Third-Generation Semiconductors<\/a>.<\/p>\r\n<div class=\"jz-callout warn\">\r\n<div class=\"jz-callout-icon\">\u26a0\ufe0f<\/div>\r\n<div class=\"jz-callout-body\"><strong>Fixed-Abrasive Pads and Sub-Surface Damage Risk<\/strong> The high cutting efficiency of diamond-embedded pads comes with a corresponding risk of sub-surface crystal damage in the wafer. For power device SiC, where the active device layer can be as thin as 5\u201310 \u00b5m from the polished surface, sub-surface cracks extending even 500 nm below the surface can cause threshold voltage shifts and breakdown voltage degradation in finished devices. Diamond grit size selection, binder compliance, and down-force control are critical variables that must be tightly optimized. Fixed-abrasive pads for device-layer SiC typically use sub-micron diamond (0.1\u20130.5 \u00b5m) in a compliant polymer binder, not the coarser diamond used in substrate lapping.<\/div>\r\n<\/div>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 6 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"poreless\">6. Poreless Polymer Films \u2014 The Next-Generation Architecture<\/h2>\r\n<div class=\"jz-mat-grid\">\r\n<div class=\"jz-mat-card\">\r\n<div class=\"jz-mat-header jz-mat-header-poreless\">\r\n<div class=\"jz-mat-icon\">\u26a1<\/div>\r\n<div>\r\n<div class=\"jz-mat-name\">Poreless Polymer Film<\/div>\r\n<div class=\"jz-mat-sub\">Near-zero porosity PU or thermoplastic<\/div>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jz-mat-body\">\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">H\u00e4rte<\/span><span class=\"jz-mat-val\">Shore D 60\u201372<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Pore type<\/span><span class=\"jz-mat-val green\">Near-zero (groove-only transport)<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Tg<\/span><span class=\"jz-mat-val\">100\u2013140\u00b0C<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Chemische Best\u00e4ndigkeit<\/span><span class=\"jz-mat-val green\">Ausgezeichnet<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Defect density<\/span><span class=\"jz-mat-val green\">Very low<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Lot-to-lot variation<\/span><span class=\"jz-mat-val green\">Very low<\/span><\/div>\r\n<div class=\"jz-mat-row\"><span class=\"jz-mat-key\">Cost index<\/span><span class=\"jz-mat-val red\">2\u20133.5\u00d7<\/span><\/div>\r\n<div class=\"jz-mat-desc\">The frontier of CMP pad technology. Eliminates pore-derived debris and lot-to-lot variation in slurry uptake. Mandates precise, stable slurry delivery. Preferred at advanced nodes \u22647 nm and for EUV-layer planarization.<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<p>Poreless pads represent a fundamentally different engineering philosophy from conventional porous PU pads. By eliminating the microsphere-derived pore network entirely, poreless pads remove the two main sources of variability in conventional pads: lot-to-lot variation in pore size distribution, and pad-borne particle contamination from pore debris.<\/p>\r\n<p>Slurry transport in a poreless pad relies exclusively on the groove network \u2014 there is no internal reservoir to buffer against slurry flow fluctuations. This demands more precise process control of slurry flow rate, but in return delivers exceptional surface cleanliness and highly consistent removal rates across a pad&#8217;s lifetime. For a quantitative comparison of poreless versus porous performance trade-offs, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/Poreless-CMP-Pads-vs-Porous-Structure\/\" target=\"_blank\" rel=\"noopener\">Poreless CMP Pads vs. Porous Structure<\/a>.<\/p>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 7 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"master-comparison\">7. Master Comparison: All Pad Material Classes Side by Side<\/h2>\r\n<div class=\"jz-table-wrap\">\r\n<table class=\"jz-table\">\r\n<thead>\r\n<tr>\r\n<th>Eigentum<\/th>\r\n<th>Filled PU (Hard)<\/th>\r\n<th>Soft PU Foam<\/th>\r\n<th>Non-Woven Fiber<\/th>\r\n<th>Fixed-Abrasive<\/th>\r\n<th>Poreless Film<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td><strong>H\u00e4rte<\/strong><\/td>\r\n<td class=\"best\">Shore D 55\u201365<\/td>\r\n<td class=\"mid\">Shore D 28\u201345<\/td>\r\n<td class=\"mid\">Shore A 50\u201375<\/td>\r\n<td>Binder-set<\/td>\r\n<td class=\"best\">Shore D 60\u201372<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Planarization efficiency<\/strong><\/td>\r\n<td class=\"best\">Hoch<\/td>\r\n<td class=\"poor\">Low\u2013Mid<\/td>\r\n<td class=\"mid\">M\u00e4\u00dfig<\/td>\r\n<td class=\"best\">Hoch<\/td>\r\n<td class=\"best\">Hoch<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Within-wafer uniformity<\/strong><\/td>\r\n<td class=\"mid\">M\u00e4\u00dfig<\/td>\r\n<td class=\"best\">Hoch<\/td>\r\n<td class=\"mid\">M\u00e4\u00dfig<\/td>\r\n<td class=\"mid\">M\u00e4\u00dfig<\/td>\r\n<td class=\"best\">Hoch<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Defect density risk<\/strong><\/td>\r\n<td class=\"mid\">M\u00e4\u00dfig<\/td>\r\n<td class=\"best\">Niedrig<\/td>\r\n<td class=\"poor\">Moderate\u2013High<\/td>\r\n<td class=\"poor\">High (if unoptimized)<\/td>\r\n<td class=\"best\">Very low<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Slurry retention<\/strong><\/td>\r\n<td class=\"best\">Good (closed-cell pores)<\/td>\r\n<td class=\"best\">Good (open-cell pores)<\/td>\r\n<td class=\"best\">Excellent (inter-fiber)<\/td>\r\n<td>N\/A (no slurry abrasive)<\/td>\r\n<td class=\"poor\">Low (groove-only)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Chemische Best\u00e4ndigkeit<\/strong><\/td>\r\n<td class=\"best\">Ausgezeichnet<\/td>\r\n<td class=\"mid\">M\u00e4\u00dfig<\/td>\r\n<td class=\"mid\">Moderate (fiber swelling)<\/td>\r\n<td class=\"best\">Excellent (inorganic abrasive)<\/td>\r\n<td class=\"best\">Ausgezeichnet<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Lot-to-lot consistency<\/strong><\/td>\r\n<td class=\"mid\">Good (pore CV &lt;15%)<\/td>\r\n<td class=\"mid\">M\u00e4\u00dfig<\/td>\r\n<td class=\"poor\">Variable<\/td>\r\n<td class=\"mid\">Gut<\/td>\r\n<td class=\"best\">Excellent (&lt;3% Kp CV)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Thermal stability<\/strong><\/td>\r\n<td class=\"best\">Good (Tg 90\u2013120\u00b0C)<\/td>\r\n<td class=\"mid\">Moderate (Tg 55\u201380\u00b0C)<\/td>\r\n<td class=\"best\">High (&gt;150\u00b0C fiber)<\/td>\r\n<td class=\"best\">Hoch<\/td>\r\n<td class=\"best\">Excellent (Tg 100\u2013140\u00b0C)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Advanced node suitability<\/strong><\/td>\r\n<td class=\"best\">\u226428 nm (with stacking)<\/td>\r\n<td class=\"best\">Cu\/low-k at all nodes<\/td>\r\n<td class=\"poor\">\u226545 nm only<\/td>\r\n<td class=\"best\">SiC, GaN, sapphire<\/td>\r\n<td class=\"best\">\u22647 nm, EUV-layer<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Relative Kosten<\/strong><\/td>\r\n<td class=\"best\">1.0\u00d7 (baseline)<\/td>\r\n<td class=\"best\">0.8\u20131.1\u00d7<\/td>\r\n<td class=\"best\">0.5\u20130.75\u00d7<\/td>\r\n<td class=\"poor\">3\u20138\u00d7<\/td>\r\n<td class=\"poor\">2\u20133.5\u00d7<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<!-- Property score visualization -->\r\n<h3>Key Property Profiles \u2014 Visual Comparison for Hard PU vs. Soft PU vs. Poreless<\/h3>\r\n<div class=\"jz-score-table\">\r\n<div style=\"display: grid; grid-template-columns: 1fr 1fr 1fr; gap: 32px; margin: 20px 0;\">\r\n<div>\r\n<div style=\"font-size: 13px; font-weight: bold; color: #0b3d91; margin-bottom: 14px; font-family: 'IBM Plex Mono',monospace;\">HARD PU (Filled)<\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Planarization eff.<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 90%; background: #0b3d91;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">9\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Uniformity<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 60%; background: #0b3d91;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">6\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Low defect risk<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 55%; background: #0b3d91;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">5.5\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Consistency<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 72%; background: #0b3d91;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">7\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Cost efficiency<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 85%; background: #0b3d91;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">8.5\/10<\/span><\/div>\r\n<\/div>\r\n<div>\r\n<div style=\"font-size: 13px; font-weight: bold; color: #0078b0; margin-bottom: 14px; font-family: 'IBM Plex Mono',monospace;\">SOFT PU (Foam)<\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Planarization eff.<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 35%; background: #0078b0;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">3.5\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Uniformity<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 90%; background: #0078b0;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">9\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Low defect risk<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 85%; background: #0078b0;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">8.5\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Consistency<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 65%; background: #0078b0;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">6.5\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Cost efficiency<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 82%; background: #0078b0;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">8\/10<\/span><\/div>\r\n<\/div>\r\n<div>\r\n<div style=\"font-size: 13px; font-weight: bold; color: #1d5a8e; margin-bottom: 14px; font-family: 'IBM Plex Mono',monospace;\">PORELESS FILM<\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Planarization eff.<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 88%; background: #1d5a8e;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">8.8\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Uniformity<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 92%; background: #1d5a8e;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">9.2\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Low defect risk<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 95%; background: #1d5a8e;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">9.5\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Consistency<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 96%; background: #1d5a8e;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">9.6\/10<\/span><\/div>\r\n<div class=\"jz-score-row\"><span class=\"jz-score-label\">Cost efficiency<\/span>\r\n<div class=\"jz-score-bar-wrap\">\r\n<div class=\"jz-score-bar\" style=\"width: 38%; background: #1d5a8e;\">\u00a0<\/div>\r\n<\/div>\r\n<span class=\"jz-score-val\">3.8\/10<\/span><\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 8 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"selection-decision\">8. Material Selection Decision Framework<\/h2>\r\n<p>With the material classes fully characterized, the practical question is: which material is right for a specific CMP step? The following framework provides a systematic selection path based on three primary criteria \u2014 target film, node requirement, and defect budget.<\/p>\r\n<div class=\"jz-steps\">\r\n<div class=\"jz-step\">\r\n<div class=\"jz-step-num\">1<\/div>\r\n<div class=\"jz-step-body\">\r\n<h4>Identify the Target Film and Its Hardness<\/h4>\r\n<p>SiO\u2082, low-k dielectric, Cu, W, barrier nitride, or compound semiconductor (SiC, GaN)? Ultra-hard materials (Mohs &gt;8) require fixed-abrasive or specialty hard-PU pads. Standard IC films (SiO\u2082, Cu, W) can be addressed with conventional PU systems. The target film hardness narrows the candidate material list immediately.<\/p>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jz-step\">\r\n<div class=\"jz-step-num\">2<\/div>\r\n<div class=\"jz-step-body\">\r\n<h4>Define the Primary Process Priority: Planarization vs. Uniformity<\/h4>\r\n<p>If the primary need is step-height reduction (e.g., shallow trench isolation, pre-metal dielectric planarization), hard PU or poreless film is indicated. If the primary need is within-wafer uniformity on a film with low incoming topography (e.g., final Cu overburden clearing, low-k inter-layer), soft PU or a stacked configuration is preferred. These two objectives are in direct tension \u2014 the material choice determines which side of the trade-off you land on.<\/p>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jz-step\">\r\n<div class=\"jz-step-num\">3<\/div>\r\n<div class=\"jz-step-body\">\r\n<h4>Assess the Defect Budget<\/h4>\r\n<p>At nodes \u22647 nm, or for any CMP step preceding a high-resolution lithography level, the post-CMP scratch and particle defect budget is extremely tight. In this regime, poreless film pads are strongly preferred despite their cost premium. For mature nodes or non-critical process steps, the defect density of standard filled-PU pads is typically acceptable and the cost advantage of conventional pads is decisive.<\/p>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jz-step\">\r\n<div class=\"jz-step-num\">4<\/div>\r\n<div class=\"jz-step-body\">\r\n<h4>Factor in Economic Constraints<\/h4>\r\n<p>Total cost of ownership (TCO) \u2014 not just pad unit price \u2014 drives the economic decision. A poreless pad at 3\u00d7 the price of a conventional pad may be TCO-positive if it eliminates 5 wafer rework events per quarter at a cost of several thousand dollars each. Conversely, for a mature-node oxide CMP step where defect yields are already excellent, switching to a poreless pad at 3\u00d7 the price delivers no incremental value. For a detailed procurement analysis, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Polishing-Pad-Price-Factors-and-Buying-Guide\/\" target=\"_blank\" rel=\"noopener\">CMP Polishing Pad Price Factors and Buying Guide<\/a>.<\/p>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 9 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2 id=\"chemistry-deep-dive\">9. Polyurethane Chemistry Deep Dive: What Process Engineers Need to Know<\/h2>\r\n<p>Because polyurethane dominates the CMP pad market, a deeper understanding of its chemistry is valuable for anyone specifying, qualifying, or troubleshooting CMP pads. The three most process-relevant aspects of PU chemistry are hydrolytic stability, thermal degradation behavior, and slurry-chemical compatibility.<\/p>\r\n<h3>Hydrolytic Stability: Polyol Backbone Matters<\/h3>\r\n<p>Polyurethane pads used in alkaline slurry environments (pH 10\u201311, common in oxide CMP with ceria slurries) are subject to hydrolytic degradation of the urethane linkages over time. The rate of hydrolysis depends strongly on the polyol backbone:<\/p>\r\n<div class=\"jz-table-wrap\">\r\n<table class=\"jz-table\">\r\n<thead>\r\n<tr>\r\n<th>Polyol Type<\/th>\r\n<th>Hydrolytic Stability<\/th>\r\n<th>Typische Anwendung<\/th>\r\n<th>Trade-off<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td><strong>Polyether polyol<\/strong><\/td>\r\n<td class=\"mid\">Moderate (ether linkage vulnerable to oxidation)<\/td>\r\n<td>General oxide CMP, legacy nodes<\/td>\r\n<td>Low cost; moderate chemical resistance<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Polyester polyol<\/strong><\/td>\r\n<td class=\"poor\">Poor (ester hydrolysis at high pH)<\/td>\r\n<td>Dry or near-neutral pH applications only<\/td>\r\n<td>Excellent initial hardness; degrades in alkaline slurry<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Polycarbonate polyol<\/strong><\/td>\r\n<td class=\"best\">Excellent (carbonate linkage highly resistant)<\/td>\r\n<td>Advanced node oxide, W, high-pH slurry applications<\/td>\r\n<td>Higher raw material cost; most stable option<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>Polysiloxane-modified PU<\/strong><\/td>\r\n<td class=\"best\">Excellent (Si-O backbone)<\/td>\r\n<td>Very aggressive oxidizer slurries (KMnO\u2084, high-conc. H\u2082O\u2082)<\/td>\r\n<td>Specialty material; limited supplier base<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h3>Thermal Degradation: The Tg Ceiling<\/h3>\r\n<p>As pad surface temperature rises during polishing \u2014 driven by frictional heat generation \u2014 the polymer approaches its glass transition temperature (Tg). Above Tg, the polymer transitions from a glassy, elastic solid to a rubbery, viscous material. For CMP pads, operating near Tg causes rapid glazing, asperity collapse, and MRR drift. Selection of a pad with Tg well above the expected process temperature is essential.<\/p>\r\n<div class=\"jz-callout tip\">\r\n<div class=\"jz-callout-icon\">\ud83d\udca1<\/div>\r\n<div class=\"jz-callout-body\"><strong>Tg Measurement and Process Temperature Margin<\/strong> Jizhi characterizes the Tg of every PU formulation using dynamic mechanical analysis (DMA), reporting both the storage modulus (E&#8217;) onset and the tan-delta peak. We recommend a minimum 30\u00b0C margin between measured Tg and peak expected process surface temperature. For high-pressure oxide CMP (surface temperature reaching 55\u201365\u00b0C), this requires a minimum Tg of ~90\u00b0C \u2014 achievable with standard formulations. For SiC CMP (surface temperatures reaching 75\u201385\u00b0C), a minimum Tg of 115\u00b0C is recommended, requiring polycarbonate-backbone or cross-linker-enhanced formulations.<\/div>\r\n<\/div>\r\n<h3>Chemical Compatibility: Beyond pH<\/h3>\r\n<p>Slurry-pad chemical compatibility extends beyond pH resistance. Three specific chemical classes require verification during pad qualification:<\/p>\r\n<ul>\r\n<li><strong>Strong oxidizers (KMnO\u2084, H\u2082O\u2082 &gt;5%, O\u2083):<\/strong> Can oxidize PU chain segments, accelerating surface degradation and increasing debris generation. Polycarbonate-backbone PU and polysiloxane-modified PU offer the best resistance.<\/li>\r\n<li><strong>Organic additives (BTA, glycine, citric acid):<\/strong> Most PU formulations show excellent resistance to these low-concentration organic complexing agents. However, high-concentration BTA (used in some Cu CMP slurries) can plasticize certain polyether PU formulations, reducing hardness during polishing.<\/li>\r\n<li><strong>Surfactants:<\/strong> Used in low-k CMP slurries to reduce surface tension, surfactants can swell soft PU foams over extended polishing campaigns, gradually increasing compressibility and shifting the process window. Verify with 24-hour immersion tests at process concentration and temperature.<\/li>\r\n<\/ul>\r\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 FAQ \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\r\n<h2>10. Frequently Asked Questions<\/h2>\r\n<div class=\"jz-faq\">\r\n<div class=\"jz-faq-item\">\r\n<div class=\"jz-faq-q\">Why is polyurethane the dominant CMP pad material rather than silicone or PTFE?<\/div>\r\n<div class=\"jz-faq-a\">Polyurethane offers a unique combination of properties that no other polymer class matches simultaneously: wide hardness tunability (Shore D 28\u201370 from a single polymer family), good chemical resistance to aqueous slurries, excellent elastic recovery (maintaining asperity geometry over thousands of wafer passes), and compatibility with diamond conditioning. Silicone elastomers are too soft and have poor abrasion resistance. PTFE is too chemically inert to be functionalized for controlled slurry interaction. PU&#8217;s versatility \u2014 driven by the combinatorial diversity of isocyanate and polyol chemistries \u2014 makes it uniquely suited to the CMP application.<\/div>\r\n<\/div>\r\n<div class=\"jz-faq-item\">\r\n<div class=\"jz-faq-q\">Can a single pad material be used for both oxide CMP and Cu CMP?<\/div>\r\n<div class=\"jz-faq-a\">Not optimally. Oxide CMP requires hard pads (Shore D 55\u201365) for planarization efficiency, while Cu CMP benefits from soft pads (Shore D 28\u201345) to protect fragile low-k dielectrics. Some fabs use a &#8220;universal&#8221; intermediate-hardness pad (Shore D 45\u201352) to reduce SKU count, accepting a performance compromise at each step. This is generally acceptable for mature nodes but not for leading-edge processes where both oxide and Cu steps are at their tightest tolerances. Separate, optimized pad SKUs per process step remain the standard at advanced fabs.<\/div>\r\n<\/div>\r\n<div class=\"jz-faq-item\">\r\n<div class=\"jz-faq-q\">How do I know if a pad is genuinely poreless or just very low-porosity?<\/div>\r\n<div class=\"jz-faq-a\">True poreless pads have pore volume fractions below 1\u20132%, measured by mercury porosimetry or X-ray micro-CT of pad cross-sections. Optical cross-section microscopy (at 200\u2013500\u00d7 magnification) provides a qualitative check \u2014 genuinely poreless pads show no visible pores in a polished cross-section. Ask suppliers for SEM cross-section images and mercury intrusion porosimetry data sheets. &#8220;Near-poreless&#8221; pads with pore fractions of 5\u201310% will still show pore-related lot variation and debris risk, even if marketed as poreless.<\/div>\r\n<\/div>\r\n<div class=\"jz-faq-item\">\r\n<div class=\"jz-faq-q\">Does pad material affect slurry consumption?<\/div>\r\n<div class=\"jz-faq-a\">Yes, significantly. Highly porous pads (non-woven fiber, open-cell soft PU) absorb large volumes of slurry into the pad bulk, increasing slurry consumption without a proportional increase in useful work at the pad-wafer interface. Closed-cell hard PU pads retain slurry in closed pores rather than absorbing it freely, reducing bulk consumption. Poreless pads consume only the slurry delivered by the groove network to the contact interface \u2014 the lowest slurry utilization volume \u2014 but require stable, uninterrupted slurry flow. Slurry cost is typically 50\u201370% of total CMP consumable cost at a 300 mm fab, making pad-slurry efficiency a significant economic driver.<\/div>\r\n<\/div>\r\n<div class=\"jz-faq-item\">\r\n<div class=\"jz-faq-q\">What pad material does Jizhi Electronic Technology supply?<\/div>\r\n<div class=\"jz-faq-a\">Jizhi manufactures and supplies hard closed-cell polyurethane pads (IC1000-equivalent and custom hardness formulations), soft polyurethane subpads, and specialty hard-PU pads engineered for SiC and GaN substrate polishing. Our poreless pad series is currently in qualification at multiple customer fabs and is expected to enter volume supply in mid-2026. For custom formulation requests \u2014 including non-standard polyol chemistries, alternative microsphere types, or specialty groove patterns \u2014 please <a href=\"https:\/\/jeez-semicon.com\/de\/contact\/\" target=\"_blank\" rel=\"noopener\">contact our application engineering team<\/a> to discuss your requirements.<\/div>\r\n<\/div>\r\n<\/div>\r\n<!-- Related Articles -->\r\n<div class=\"jz-related\">\r\n<div class=\"jz-related-title\">\ud83d\udcda Continue Reading \u2014 CMP Pad Deep Dives<\/div>\r\n<div class=\"jz-related-grid\">\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">PILLAR \u2014 COMPLETE GUIDE<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Polishing-Pads-The-Complete-Guide\/\" target=\"_blank\" rel=\"noopener\">CMP Polishing Pads: The Complete Guide<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">FUNDAMENTALS<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/What-Is-a-CMP-Polishing-Pad-The-Ultimate-Guide\/\" target=\"_blank\" rel=\"noopener\">What Is a CMP Polishing Pad? The Ultimate Guide<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">FUNDAMENTALS<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/How-CMP-Polishing-Pads-Work\/\" target=\"_blank\" rel=\"noopener\">How CMP Polishing Pads Work<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">SELECTION<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/Hard-vs-Soft-CMP-Polishing-Pads-Selection-Guide\/\" target=\"_blank\" rel=\"noopener\">Hard vs. Soft CMP Polishing Pads: Selection Guide<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">ENGINEERING<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Pad-Groove-Design-and-Slurry-Distribution\/\" target=\"_blank\" rel=\"noopener\">CMP Pad Groove Design and Slurry Distribution<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">APPLICATIONS<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/SiC-CMP-Polishing-Pads-for-Third-Generation-Semiconductors\/\" target=\"_blank\" rel=\"noopener\">SiC CMP Polishing Pads for Third-Generation Semiconductors<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">TECHNOLOGY<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/Poreless-CMP-Pads-vs-Porous-Structure\/\" target=\"_blank\" rel=\"noopener\">Poreless CMP Pads vs. Porous Structure<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">OPERATIONS<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Pad-Conditioning-and-Lifespan-Management\/\" target=\"_blank\" rel=\"noopener\">CMP Pad Conditioning and Lifespan Management<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">PROCESS<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Material-Removal-Rate-and-Pad-Parameters\/\" target=\"_blank\" rel=\"noopener\">CMP Material Removal Rate and Pad Parameters<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">QUALITY<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Pad-Defect-Control-Scratches-and-Uniformity\/\" target=\"_blank\" rel=\"noopener\">CMP Pad Defect Control: Scratches and Uniformity<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">SOURCING<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Polishing-Pad-Brands-Comparison\/\" target=\"_blank\" rel=\"noopener\">CMP Polishing Pad Brands Comparison<\/a><\/div>\r\n<div class=\"jz-related-item\">\r\n<div class=\"jz-related-cat\">PROCUREMENT<\/div>\r\n<a href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Polishing-Pad-Price-Factors-and-Buying-Guide\/\" target=\"_blank\" rel=\"noopener\">CMP Polishing Pad Price Factors and Buying Guide<\/a><\/div>\r\n<\/div>\r\n<\/div>\r\n<!-- CTA -->\r\n<div class=\"jz-cta-banner\">\r\n<h2>The Right Pad Material for Your Specific Process<\/h2>\r\n<p>Jizhi Electronic Technology supplies hard polyurethane pads, soft subpads, and SiC-specific formulations \u2014 with in-house materials characterization, production-lot COAs, and application engineering support. Tell us your target film, node, and defect requirements and we will recommend the optimal material class and formulation.<\/p>\r\n<a class=\"jz-btn jz-btn-white\" href=\"https:\/\/jeez-semicon.com\/de\/semi-categories\/polishing-pad\/\" target=\"_blank\" rel=\"noopener\">Browse CMP Polishing Pads<\/a> <a class=\"jz-btn jz-btn-outline\" href=\"https:\/\/jeez-semicon.com\/de\/contact\/\" target=\"_blank\" rel=\"noopener\">Get a Material Recommendation<\/a><\/div>\r\n<!--\r\n  \u2554\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n  \u2551  SEO NOTES \u2014 Cluster 3\r\n  \u2560\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n  \u2551  Title tag:  CMP Pad Materials: Polyurethane vs Other Options (2026) | Jizhi\r\n  \u2551  Meta desc:  Complete comparison of CMP polishing pad materials \u2014 filled PU,\r\n  \u2551              soft foam, non-woven fiber, fixed-abrasive, and poreless films.\r\n  \u2551              Property data, selection guide, and chemistry deep dive.\r\n  \u2551  Focus KW:   CMP pad materials\r\n  \u2551  Secondary:  polyurethane CMP pad, fixed abrasive CMP pad, poreless CMP pad,\r\n  \u2551              CMP pad chemistry, CMP pad hardness\r\n  \u2551  Schema:     Article + FAQPage\r\n  \u2551  Intent:     Informational \/ Technical research \/ Commercial investigation\r\n  \u255a\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\r\n--><\/div>\r\n<!-- .jz-art -->","protected":false},"excerpt":{"rendered":"<p>Back to CMP Polishing Pads: The Complete Guide Jizhi Electronic Technology \u2014 Materials Series An in-depth, property-by-property comparison of every major CMP polishing pad material \u2014 polyurethane foam, soft felt  &#8230;<\/p>","protected":false},"author":1,"featured_media":1808,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-1764","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/1764","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/comments?post=1764"}],"version-history":[{"count":3,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/1764\/revisions"}],"predecessor-version":[{"id":1821,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/1764\/revisions\/1821"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/media\/1808"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/media?parent=1764"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/categories?post=1764"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/tags?post=1764"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}