{"id":2233,"date":"2026-06-03T13:44:08","date_gmt":"2026-06-03T05:44:08","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=2233"},"modified":"2026-06-03T13:44:08","modified_gmt":"2026-06-03T05:44:08","slug":"tungsten-cmp-slurry-selection-guide","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/de\/blog\/tungsten-cmp-slurry-selection-guide\/","title":{"rendered":"Tungsten CMP Slurry Selection Guide"},"content":{"rendered":"<!-- ===== JEEZ \u00b7 Tungsten CMP Slurry Selection Guide \u2014 paste into Gutenberg \"Custom HTML\" block ===== -->\n\n<style>\n@import url('https:\/\/fonts.googleapis.com\/css2?family=Sora:wght@500;600;700;800&family=IBM+Plex+Sans:ital,wght@0,400;0,500;0,600;1,400&family=IBM+Plex+Mono:wght@500;600&display=swap');\n.jz-b3-wrap{\n  --ink:#0a1f33; --navy:#0d2a44; --navy2:#123a5c;\n  --acc:#2f7dd1; --accd:#245fa3; --accl:#e8f1fb;\n  --text:#1c2b3a; --muted:#5a6b7b; --line:#e1e8ef; --bg:#f6f9fb; --card:#fff;\n  --r:16px; --sh:0 12px 40px rgba(10,31,51,.08); --shs:0 4px 18px rgba(10,31,51,.06);\n  font-family:'IBM Plex Sans',-apple-system,BlinkMacSystemFont,sans-serif;\n  color:var(--text); line-height:1.75; font-size:17px; max-width:1080px; margin:0 auto; padding:0 4px;\n  -webkit-font-smoothing:antialiased;\n}\n.jz-b3-wrap *{box-sizing:border-box;}\n.jz-b3-wrap p{margin:0 0 1.15em;}\n.jz-b3-wrap a{color:var(--accd);text-decoration:none;border-bottom:1px solid rgba(0,0,0,.14);transition:.2s;}\n.jz-b3-wrap a:hover{color:var(--navy);border-bottom-color:var(--acc);}\n.jz-b3-wrap .ps-hero{position:relative;overflow:hidden;border-radius:var(--r);padding:58px 46px 52px;color:#eaf3f8;box-shadow:var(--sh);\n  background:radial-gradient(900px 420px at 88% -10%, color-mix(in srgb,var(--acc) 55%, transparent), transparent 60%),linear-gradient(135deg,#071a2c 0%,#0d2a44 55%,#123a5c 100%);}\n.jz-b3-wrap .ps-hero:before{content:\"\";position:absolute;inset:0;opacity:.5;\n  background-image:linear-gradient(rgba(255,255,255,.05) 1px,transparent 1px),linear-gradient(90deg,rgba(255,255,255,.05) 1px,transparent 1px);background-size:42px 42px;\n  -webkit-mask-image:radial-gradient(600px 300px at 78% 18%,#000,transparent 75%);mask-image:radial-gradient(600px 300px at 78% 18%,#000,transparent 75%);}\n.jz-b3-wrap .ps-hero>*{position:relative;z-index:1;}\n.jz-b3-wrap .ps-eyebrow{font-family:'IBM Plex Mono',monospace;font-weight:600;letter-spacing:.22em;text-transform:uppercase;font-size:12px;color:#bfe9f3;margin-bottom:16px;display:flex;align-items:center;gap:10px;}\n.jz-b3-wrap .ps-eyebrow:before{content:\"\";width:30px;height:2px;background:var(--acc);display:inline-block;}\n.jz-b3-wrap .ps-hero h1{font-family:'Sora',sans-serif;font-weight:800;font-size:clamp(27px,4.4vw,42px);line-height:1.14;margin:0 0 16px;letter-spacing:-.02em;color:#fff;max-width:20ch;}\n.jz-b3-wrap .ps-lead{font-size:clamp(16px,2vw,18.5px);color:#cfe2ec;max-width:62ch;margin-bottom:24px;}\n.jz-b3-wrap .ps-meta{display:flex;flex-wrap:wrap;gap:10px 22px;font-size:13px;color:#9fc0d2;font-family:'IBM Plex Mono',monospace;border-top:1px solid rgba(255,255,255,.14);padding-top:16px;}\n.jz-b3-wrap .ps-meta b{color:#cfe9f2;font-weight:600;}\n.jz-b3-wrap .ps-toc{background:var(--card);border:1px solid var(--line);border-radius:var(--r);box-shadow:var(--shs);padding:28px 32px;margin:34px 0 8px;}\n.jz-b3-wrap .ps-toc h2{font-family:'Sora',sans-serif;font-size:14px;letter-spacing:.14em;text-transform:uppercase;color:var(--navy);margin:0 0 16px;display:flex;align-items:center;gap:10px;border:none;padding:0;}\n.jz-b3-wrap .ps-toc h2:before{content:\"\u00a7\";color:var(--acc);font-size:20px;}\n.jz-b3-wrap .ps-toc ol{margin:0;padding:0;list-style:none;counter-reset:toc;display:grid;grid-template-columns:1fr 1fr;gap:2px 34px;}\n.jz-b3-wrap .ps-toc li{counter-increment:toc;border-bottom:1px dashed var(--line);}\n.jz-b3-wrap .ps-toc a{display:flex;gap:12px;padding:9px 2px;border:none;color:var(--text);font-size:15px;}\n.jz-b3-wrap .ps-toc a:before{content:counter(toc,decimal-leading-zero);font-family:'IBM Plex Mono',monospace;color:var(--accd);font-weight:600;font-size:12.5px;min-width:24px;}\n.jz-b3-wrap .ps-toc a:hover{color:var(--accd);}\n.jz-b3-wrap .ps-sec{margin:44px 0;}\n.jz-b3-wrap .ps-sec h2{font-family:'Sora',sans-serif;font-weight:700;font-size:clamp(22px,2.9vw,29px);line-height:1.2;color:var(--ink);letter-spacing:-.01em;margin:0 0 16px;padding-left:18px;position:relative;}\n.jz-b3-wrap .ps-sec h2:before{content:\"\";position:absolute;left:0;top:.18em;bottom:.18em;width:5px;border-radius:4px;background:linear-gradient(var(--acc),var(--accd));}\n.jz-b3-wrap .ps-sec h3{font-family:'Sora',sans-serif;font-weight:600;font-size:19.5px;color:var(--navy);margin:28px 0 10px;letter-spacing:-.01em;}\n.jz-b3-wrap ul.ps-list{margin:0 0 1.2em;padding:0;list-style:none;}\n.jz-b3-wrap ul.ps-list li{position:relative;padding:7px 0 7px 30px;border-bottom:1px solid var(--line);}\n.jz-b3-wrap ul.ps-list li:before{content:\"\";position:absolute;left:6px;top:16px;width:8px;height:8px;border-radius:2px;transform:rotate(45deg);background:var(--acc);}\n.jz-b3-wrap ul.ps-list li b{color:var(--navy);}\n.jz-b3-wrap .ps-callout{background:linear-gradient(135deg,var(--accl),#fff);border:1px solid var(--line);border-left:5px solid var(--acc);border-radius:12px;padding:20px 24px;margin:24px 0;}\n.jz-b3-wrap .ps-callout p:last-child{margin-bottom:0;}\n.jz-b3-wrap .ps-callout .tag{font-family:'IBM Plex Mono',monospace;font-weight:600;font-size:12px;letter-spacing:.12em;text-transform:uppercase;color:var(--accd);display:block;margin-bottom:6px;}\n.jz-b3-wrap .ps-tablewrap{overflow-x:auto;margin:22px 0;border-radius:12px;box-shadow:var(--shs);border:1px solid var(--line);}\n.jz-b3-wrap table.ps-table{width:100%;border-collapse:collapse;font-size:15px;min-width:600px;background:#fff;}\n.jz-b3-wrap table.ps-table thead th{background:var(--navy);color:#eaf3f8;font-family:'Sora',sans-serif;font-weight:600;text-align:left;padding:13px 17px;font-size:13.5px;}\n.jz-b3-wrap table.ps-table td{padding:12px 17px;border-top:1px solid var(--line);vertical-align:top;}\n.jz-b3-wrap table.ps-table tbody tr:nth-child(even){background:#f8fbfc;}\n.jz-b3-wrap table.ps-table td b{color:var(--navy);}\n.jz-b3-wrap .ps-related{margin:48px 0;}\n.jz-b3-wrap .ps-related h2{font-family:'Sora',sans-serif;font-weight:700;font-size:clamp(21px,2.7vw,27px);color:var(--ink);margin:0 0 6px;padding-left:18px;position:relative;}\n.jz-b3-wrap .ps-related h2:before{content:\"\";position:absolute;left:0;top:.18em;bottom:.18em;width:5px;border-radius:4px;background:linear-gradient(var(--acc),var(--accd));}\n.jz-b3-wrap .ps-related .sub{color:var(--muted);margin-bottom:14px;}\n.jz-b3-wrap .ps-cards{display:grid;grid-template-columns:repeat(2,1fr);gap:14px;}\n.jz-b3-wrap .ps-card{display:block;background:var(--card);border:1px solid var(--line);border-radius:14px;padding:18px 20px;box-shadow:var(--shs);transition:.22s;color:var(--text);}\n.jz-b3-wrap .ps-card:hover{transform:translateY(-2px);box-shadow:var(--sh);border-color:var(--acc);color:var(--text);}\n.jz-b3-wrap .ps-card .k{font-family:'IBM Plex Mono',monospace;font-size:11px;letter-spacing:.13em;text-transform:uppercase;color:var(--accd);display:block;margin-bottom:6px;}\n.jz-b3-wrap .ps-card .t{font-family:'Sora',sans-serif;font-weight:600;font-size:16px;color:var(--ink);line-height:1.35;}\n.jz-b3-wrap .ps-card.pillar{background:linear-gradient(135deg,var(--navy),var(--navy2));border-color:var(--navy);}\n.jz-b3-wrap .ps-card.pillar .t{color:#fff;}\n.jz-b3-wrap .ps-card.pillar .k{color:var(--acc);}\n.jz-b3-wrap .ps-card.pillar:hover .t{color:#fff;}\n.jz-b3-wrap .ps-faq details{background:var(--card);border:1px solid var(--line);border-radius:12px;margin-bottom:12px;overflow:hidden;transition:.2s;}\n.jz-b3-wrap .ps-faq details[open]{box-shadow:var(--shs);border-color:var(--acc);}\n.jz-b3-wrap .ps-faq summary{cursor:pointer;padding:17px 22px;font-family:'Sora',sans-serif;font-weight:600;font-size:16px;color:var(--navy);list-style:none;display:flex;justify-content:space-between;align-items:center;gap:16px;}\n.jz-b3-wrap .ps-faq summary::-webkit-details-marker{display:none;}\n.jz-b3-wrap .ps-faq summary:after{content:\"+\";font-size:24px;color:var(--acc);font-weight:400;transition:.2s;line-height:1;}\n.jz-b3-wrap .ps-faq details[open] summary:after{transform:rotate(45deg);}\n.jz-b3-wrap .ps-faq .ans{padding:0 22px 18px;color:var(--text);}\n.jz-b3-wrap .ps-faq .ans p:last-child{margin-bottom:0;}\n.jz-b3-wrap .ps-cta{position:relative;overflow:hidden;border-radius:var(--r);margin:52px 0 28px;padding:44px 42px;color:#eaf3f8;box-shadow:var(--sh);\n  background:radial-gradient(700px 320px at 90% 120%,color-mix(in srgb,var(--acc) 55%, transparent),transparent 60%),linear-gradient(120deg,#071a2c,#0d2a44 60%,#123a5c);}\n.jz-b3-wrap .ps-cta:before{content:\"\";position:absolute;inset:0;opacity:.4;background-image:linear-gradient(90deg,rgba(255,255,255,.06) 1px,transparent 1px);background-size:36px 100%;}\n.jz-b3-wrap .ps-cta>*{position:relative;z-index:1;}\n.jz-b3-wrap .ps-cta h2{font-family:'Sora',sans-serif;font-weight:800;font-size:clamp(21px,2.9vw,28px);color:#fff;margin:0 0 10px;letter-spacing:-.01em;border:none;padding:0;}\n.jz-b3-wrap .ps-cta p{color:#cfe2ec;max-width:62ch;margin-bottom:22px;}\n.jz-b3-wrap .ps-btn{display:inline-flex;align-items:center;gap:10px;background:var(--acc);color:#04222e;font-family:'Sora',sans-serif;font-weight:700;font-size:16px;padding:14px 28px;border-radius:50px;border:none;transition:.2s;box-shadow:0 8px 24px color-mix(in srgb,var(--acc) 45%, transparent);}\n.jz-b3-wrap .ps-btn:hover{filter:brightness(1.1);color:#04222e;transform:translateY(-2px);border:none;}\n.jz-b3-wrap .ps-btn span{font-family:'IBM Plex Mono',monospace;}\n.jz-b3-wrap .ps-signoff{font-size:14px;color:var(--muted);border-top:1px solid var(--line);padding-top:20px;margin-top:38px;font-style:italic;}\n@media(max-width:760px){\n  .jz-b3-wrap{font-size:16px;}\n  .jz-b3-wrap .ps-hero{padding:40px 24px 36px;}\n  .jz-b3-wrap .ps-toc{padding:22px 20px;}\n  .jz-b3-wrap .ps-toc ol{grid-template-columns:1fr;gap:0;}\n  .jz-b3-wrap .ps-cards{grid-template-columns:1fr;}\n  .jz-b3-wrap .ps-cta{padding:34px 24px;}\n}\n<\/style>\n\n<div class=\"jz-b3-wrap\">\n  <header class=\"ps-hero\">\n    <div class=\"ps-eyebrow\">JEEZ \u00b7 Selection by Material<\/div>\n    <h1>Tungsten CMP Slurry Selection Guide<\/h1>\n    <p class=\"ps-lead\">Tungsten plugs and local interconnects demand high, stable removal rates with tight topography control. This guide explains how to select a tungsten CMP slurry \u2014 the oxidiser system, the static-etch and galvanic effects, the selectivity challenge and the defect modes to watch.<\/p>\n    <div class=\"ps-meta\"><span>By <b>JEEZ \u2014 Jizhi Electronic Technology Co., Ltd.<\/b><\/span><span>Updated <b>June 2026<\/b><\/span><\/div>\n  <\/header>\n\n  <nav class=\"ps-toc\" aria-label=\"Table of contents\">\n    <h2>Inhalts\u00fcbersicht<\/h2>\n    <ol><li><a href=\"#jz-b3-role\">Where Tungsten CMP Fits<\/a><\/li><li><a href=\"#jz-b3-chem\">Oxidiser-Driven Chemistry<\/a><\/li><li><a href=\"#jz-b3-staticetch\">Static Etch and Galvanic Effects<\/a><\/li><li><a href=\"#jz-b3-selectivity\">The Selectivity Challenge<\/a><\/li><li><a href=\"#jz-b3-abrasive\">Abrasive Systems for Tungsten<\/a><\/li><li><a href=\"#jz-b3-defects\">Defect and Topography Control<\/a><\/li><li><a href=\"#jz-b3-select\">Selecting Your Tungsten Slurry<\/a><\/li><\/ol>\n  <\/nav>\n\n  <section class=\"ps-sec\" id=\"jz-b3-role\"><h2>Where Tungsten CMP Fits<\/h2><p>Tungsten fills contacts and vias \u2014 the plugs that connect transistor and interconnect levels \u2014 and forms some local interconnects. CMP removes the tungsten overburden to leave planar plugs flush with the surrounding dielectric. The step rewards high, repeatable removal rate combined with disciplined topography control, because thousands of plugs across a wafer must all finish flush. For the selection method, see <a href=\"https:\/\/jeez-semicon.com\/de\/blog\/How-to-Select-a-CMP-Slurry-by-Material-and-Process\/\" target=\"_blank\" rel=\"noopener\">the selection framework<\/a>; for fundamentals, the <a href=\"https:\/\/jeez-semicon.com\/de\/blog\/What-Is-Polishing-Slurry\/\" target=\"_blank\" rel=\"noopener\">pillar guide<\/a>.<\/p><\/section><section class=\"ps-sec\" id=\"jz-b3-chem\"><h2>Oxidiser-Driven Chemistry<\/h2><p>Tungsten CMP slurries are typically built around a peroxide-based oxidiser system that forms a thin tungsten-oxide layer for the abrasive to clear. Removal rate is strongly governed by oxidiser concentration and abrasive loading, while pH and stabilisers keep the system robust. Iron- or other catalyst-assisted chemistries have historically been used to accelerate the oxidation, with newer formulations reducing metal-ion content for cleaner integration. The ingredient roles are explained in <a href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Slurry-Composition-Explained\/\" target=\"_blank\" rel=\"noopener\">the composition guide<\/a>.<\/p><p>Because tungsten slurries run at high reactivity and often near acidic pH, {A(&#8216;CMP Slurry Stability and Particle Agglomeration&#8217;,&#8217;dispersion stability&#8217;)} and oxidiser handling are central \u2014 oxidiser is frequently blended at point of use to preserve shelf life.<\/p><\/section><section class=\"ps-sec\" id=\"jz-b3-staticetch\"><h2>Static Etch and Galvanic Effects<\/h2><p>Two chemistry-driven effects shape tungsten CMP. <b>Static etch<\/b> \u2014 chemical removal of tungsten with no mechanical contact \u2014 must be low, or recessed plugs keep dissolving and recess grows. <b>Galvanic interaction<\/b> between tungsten and its adhesion\/barrier layer (often titanium or titanium nitride) can accelerate localised attack when both are exposed. A good tungsten slurry keeps static etch minimal while delivering high mechanically-driven removal, maximising the contrast between contacted and recessed regions.<\/p><\/section><section class=\"ps-sec\" id=\"jz-b3-selectivity\"><h2>The Selectivity Challenge<\/h2><p>Tungsten and the surrounding dielectric or barrier behave very differently under the slurry, so selectivity tuning is central. Too much oxide removal causes erosion and recess; too little leaves tungsten residue (stringers) that can short adjacent features. The target selectivity depends on the integration scheme \u2014 plug-only steps and tungsten local-interconnect steps have different requirements \u2014 so the slurry must be matched to the specific structure.<\/p><div class='ps-callout'><span class='tag'>Defect to watch<\/span><p>Tungsten recess \u2014 the plug sitting below the dielectric surface \u2014 raises contact resistance and can starve the next layer. It is controlled through low static etch, selectivity and endpoint precision, not just raw rate.<\/p><\/div><\/section><section class=\"ps-sec\" id=\"jz-b3-abrasive\"><h2>Abrasive Systems for Tungsten<\/h2><p>Tungsten slurries use silica or, for more aggressive removal, alumina abrasives. The choice trades rate and hardness against defectivity: alumina can drive higher rates on hard tungsten but raises scratch risk, while silica is gentler. Particle size and the large-particle tail are tightly controlled because scratches in a tungsten layer can propagate into reliability failures.<\/p><\/section><section class=\"ps-sec\" id=\"jz-b3-defects\"><h2>Defect and Topography Control<\/h2><p>Key tungsten CMP defects are recess, erosion of dense plug arrays, residual tungsten stringers and scratches from oversized particles. Controlling them means pairing the right selectivity with a stable, tight-distribution slurry, low static etch and accurate endpointing. The principles overlap with <a href=\"https:\/\/jeez-semicon.com\/de\/blog\/Copper-CMP-Slurry-Selection-Guide\/\" target=\"_blank\" rel=\"noopener\">copper CMP<\/a>, where soft-metal dishing is the analogous concern, and with oxide control covered in the <a href=\"https:\/\/jeez-semicon.com\/de\/blog\/Oxide-and-Dielectric-Ceria-CMP-Slurry-Guide\/\" target=\"_blank\" rel=\"noopener\">oxide and dielectric guide<\/a>.<\/p><\/section><section class=\"ps-sec\" id=\"jz-b3-select\"><h2>Selecting Your Tungsten Slurry<\/h2><p>Specify your removal-rate and uniformity targets, define the required tungsten-to-oxide selectivity for your integration scheme, set recess and erosion limits, choose an abrasive that meets rate without excess defectivity, and validate on your own pad and clean. Favour slurries with a wide, forgiving process window so normal drift in oxidiser, temperature and dilution does not push recess off target.<\/p><\/section>\n\n  <section class=\"ps-related\">\n    <h2>Continue Learning<\/h2>\n    <p class=\"sub\">Explore the rest of the JEEZ polishing slurry knowledge series.<\/p>\n    <div class=\"ps-cards\"><a class=\"ps-card pillar\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/What-Is-Polishing-Slurry\/\" target=\"_blank\" rel=\"noopener\"><span class=\"k\">Start here \u00b7 Pillar guide<\/span><span class=\"t\">What Is Polishing Slurry? The Complete Guide<\/span><\/a><a class=\"ps-card\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/How-to-Select-a-CMP-Slurry-by-Material-and-Process\/\" target=\"_blank\" rel=\"noopener\"><span class=\"k\">Related guide<\/span><span class=\"t\">How to Select a CMP Slurry by Material and Process<\/span><\/a><a class=\"ps-card\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/Copper-CMP-Slurry-Selection-Guide\/\" target=\"_blank\" rel=\"noopener\"><span class=\"k\">Related guide<\/span><span class=\"t\">Copper CMP Slurry Selection Guide<\/span><\/a><a class=\"ps-card\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/CMP-Slurry-Composition-Explained\/\" target=\"_blank\" rel=\"noopener\"><span class=\"k\">Related guide<\/span><span class=\"t\">CMP-Slurry-Zusammensetzung erkl\u00e4rt<\/span><\/a><a class=\"ps-card\" href=\"https:\/\/jeez-semicon.com\/de\/blog\/Oxide-and-Dielectric-Ceria-CMP-Slurry-Guide\/\" target=\"_blank\" rel=\"noopener\"><span class=\"k\">Related guide<\/span><span class=\"t\">Oxide and Dielectric Ceria CMP Slurry Guide<\/span><\/a><\/div>\n  <\/section>\n\n  <section class=\"ps-sec ps-faq\" id=\"jz-b3-faq\"><h2>H\u00e4ufig gestellte Fragen<\/h2><details open><summary>What oxidiser is used in tungsten CMP slurry?<\/summary><div class=\"ans\">Tungsten CMP slurries are typically peroxide-based, using hydrogen peroxide to form a thin tungsten-oxide layer that the abrasive removes. Oxidiser concentration is a primary control for removal rate, and it is often blended at point of use to protect shelf life.<\/div><\/details><details><summary>What is tungsten recess?<\/summary><div class=\"ans\">Tungsten recess is when the planarised tungsten plug sits below the surrounding dielectric surface. It increases contact resistance and can disrupt the next layer, and is controlled through low static etch, selectivity tuning and precise endpoint detection.<\/div><\/details><details><summary>Why is selectivity important in tungsten CMP?<\/summary><div class=\"ans\">Tungsten and the surrounding oxide or barrier respond very differently to the slurry. The right tungsten-to-oxide selectivity prevents both excessive oxide erosion and leftover tungsten residue or stringers, keeping plugs planar and within recess limits.<\/div><\/details><details><summary>What abrasive is used for tungsten CMP?<\/summary><div class=\"ans\">Silica is common for lower-defect tungsten polishing, while alumina is used where more aggressive removal of hard tungsten is needed, at the cost of higher scratch risk. Particle size and the large-particle tail are tightly controlled in either case.<\/div><\/details><details><summary>How is tungsten CMP different from copper CMP?<\/summary><div class=\"ans\">Tungsten CMP emphasises high, stable removal of a hard metal with low static etch and tight recess and selectivity control, while copper CMP centres on a soft metal where dishing, erosion and corrosion inhibition dominate. The chemistries, abrasives and defect modes differ accordingly.<\/div><\/details><\/section>\n\n  <section class=\"ps-cta\">\n    <h2>Talk to the JEEZ slurry engineering team<\/h2>\n    <p>From first slurry selection to defectivity optimisation and multi-source qualification, JEEZ \u2014 Jizhi Electronic Technology Co., Ltd. \u2014 helps you match the right polishing slurry to your material and process targets.<\/p>\n    <a class=\"ps-btn\" href=\"https:\/\/jeez-semicon.com\/de\/contact\/\" target=\"_blank\" rel=\"noopener\">Contact JEEZ <span>\u2192<\/span><\/a>\n  <\/section>\n\n  <p class=\"ps-signoff\">Part of the JEEZ Polishing Slurry knowledge series. Reviewed and updated June 2026 by Jizhi Electronic Technology Co., Ltd.<\/p>\n<\/div>\n\n<script type=\"application\/ld+json\">\n{\n  \"@context\":\"https:\/\/schema.org\",\"@type\":\"Article\",\n  \"headline\":\"Tungsten CMP Slurry Selection Guide\",\n  \"description\":\"How to select a tungsten CMP slurry: peroxide oxidiser systems, static etch and galvanic effects, abrasive choice, tungsten-to-oxide selectivity, recess and erosion control and endpoint for plug planarization.\",\n  \"author\":{\"@type\":\"Organization\",\"name\":\"JEEZ \\u2014 Jizhi Electronic Technology Co., Ltd.\",\"url\":\"https:\/\/jeez-semicon.com\/\"},\n  \"publisher\":{\"@type\":\"Organization\",\"name\":\"Jizhi Electronic Technology Co., Ltd.\",\"logo\":{\"@type\":\"ImageObject\",\"url\":\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/jeez-logo.png\"}},\n  \"datePublished\":\"2026-06-01\",\"dateModified\":\"2026-06-01\",\n  \"mainEntityOfPage\":{\"@type\":\"WebPage\",\"@id\":\"https:\/\/jeez-semicon.com\/blog\/Tungsten-CMP-Slurry-Selection-Guide\"}\n}\n<\/script>\n<script type=\"application\/ld+json\">\n{\n  \"@context\":\"https:\/\/schema.org\",\"@type\":\"FAQPage\",\"mainEntity\":[\n    {\"@type\":\"Question\",\"name\":\"What oxidiser is used in tungsten CMP slurry?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"Tungsten CMP slurries are typically peroxide-based, using hydrogen peroxide to form a thin tungsten-oxide layer that the abrasive removes. Oxidiser concentration is a primary control for removal rate, and it is often blended at point of use to protect shelf life.\"}},\n    {\"@type\":\"Question\",\"name\":\"What is tungsten recess?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"Tungsten recess is when the planarised tungsten plug sits below the surrounding dielectric surface. It increases contact resistance and can disrupt the next layer, and is controlled through low static etch, selectivity tuning and precise endpoint detection.\"}},\n    {\"@type\":\"Question\",\"name\":\"Why is selectivity important in tungsten CMP?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"Tungsten and the surrounding oxide or barrier respond very differently to the slurry. The right tungsten-to-oxide selectivity prevents both excessive oxide erosion and leftover tungsten residue or stringers, keeping plugs planar and within recess limits.\"}},\n    {\"@type\":\"Question\",\"name\":\"What abrasive is used for tungsten CMP?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"Silica is common for lower-defect tungsten polishing, while alumina is used where more aggressive removal of hard tungsten is needed, at the cost of higher scratch risk. Particle size and the large-particle tail are tightly controlled in either case.\"}},\n    {\"@type\":\"Question\",\"name\":\"How is tungsten CMP different from copper CMP?\",\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"Tungsten CMP emphasises high, stable removal of a hard metal with low static etch and tight recess and selectivity control, while copper CMP centres on a soft metal where dishing, erosion and corrosion inhibition dominate. The chemistries, abrasives and defect modes differ accordingly.\"}}\n  ]\n}\n<\/script>","protected":false},"excerpt":{"rendered":"<p>JEEZ \u00b7 Selection by Material Tungsten CMP Slurry Selection Guide Tungsten plugs and local interconnects demand high, stable removal rates with tight topography control. This guide explains how to select  &#8230;<\/p>","protected":false},"author":1,"featured_media":2235,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-2233","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/2233","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/comments?post=2233"}],"version-history":[{"count":2,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/2233\/revisions"}],"predecessor-version":[{"id":2236,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/2233\/revisions\/2236"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/media\/2235"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/media?parent=2233"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/categories?post=2233"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/tags?post=2233"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}