{"id":750,"date":"2025-12-05T10:37:26","date_gmt":"2025-12-05T02:37:26","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=750"},"modified":"2025-12-25T10:47:48","modified_gmt":"2025-12-25T02:47:48","slug":"3c-product-mirror-polishing-solution-pitting-free-sio2-silica-polishing-slurry","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/de\/blog\/3c-product-mirror-polishing-solution-pitting-free-sio2-silica-polishing-slurry\/","title":{"rendered":"3C Product Mirror Polishing Solution: Lochfra\u00dffreie SiO2-Kiesels\u00e4ure-Polierschl\u00e4mme"},"content":{"rendered":"<p class=\"ds-markdown-paragraph\"><strong>Warum CMP gegen\u00fcber elektrochemischem Polieren f\u00fcr das Hochglanzpolieren von 3C-Produkten w\u00e4hlen?<\/strong><\/p>\n<p class=\"ds-markdown-paragraph\">In der 3C-Industrie (Mobiltelefone, Laptops, Smart Wearables usw.) wird das elektrochemische Polieren aufgrund von Problemen wie Kanten\u00fcber\u00e4tzung und Materialbeschr\u00e4nkungen nach und nach durch CMP (Chemical Mechanical Polishing) ersetzt. Durch die mechanisch-chemische Synergie seines nanoskaligen SiO2-Polierschlamms erreicht Jizhi Electronics dies:<\/p>\n<p class=\"ds-markdown-paragraph\">\u2460\u00a0<strong>Pr\u00e4zision auf der Nanoskala:<\/strong>\u00a0Oberfl\u00e4chenrauhigkeit Ra &lt; 2 nm, erf\u00fcllt die Anforderungen an optische Spiegel.<br \/>\n\u2461\u00a0<strong>Anpassungsf\u00e4higkeit komplexer Strukturen:<\/strong>\u00a0Geeignet f\u00fcr unregelm\u00e4\u00dfige Teile wie Mittelteile aus Aluminiumlegierungen und Kn\u00f6pfe aus Edelstahl.<br \/>\n\u2462\u00a0<strong>Verbesserung der Effizienz:<\/strong>\u00a0Reduziert die Bearbeitungszeit um 30% im Vergleich zu herk\u00f6mmlichen Methoden.<\/p>\n<p><img decoding=\"async\" class=\"lazyload alignnone size-full wp-image-751\" src=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9.png\" data-orig-src=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9.png\" alt=\"\" width=\"750\" height=\"484\" srcset=\"data:image\/svg+xml,%3Csvg%20xmlns%3D%27http%3A%2F%2Fwww.w3.org%2F2000%2Fsvg%27%20width%3D%27750%27%20height%3D%27484%27%20viewBox%3D%270%200%20750%20484%27%3E%3Crect%20width%3D%27750%27%20height%3D%27484%27%20fill-opacity%3D%220%22%2F%3E%3C%2Fsvg%3E\" data-srcset=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9-200x129.png 200w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9-300x194.png 300w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9-400x258.png 400w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9-600x387.png 600w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9.png 750w\" data-sizes=\"auto\" data-orig-sizes=\"(max-width: 750px) 100vw, 750px\" \/><\/p>\n<p class=\"ds-markdown-paragraph\"><strong>Eingehende Analyse des Lochfra\u00dfproblems bei Silica-Polierschl\u00e4mmen<\/strong><\/p>\n<p class=\"ds-markdown-paragraph\">Die von Kunden gemeldeten Probleme mit Lochfra\u00df haben oft folgende Ursachen:<\/p>\n<ul>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Korrosion durch Kiesels\u00e4ure:<\/strong>\u00a0Na+, Cl- Ionen in niedrigreinen Schl\u00e4mmen, die elektrochemische Korrosion von Metallen ausl\u00f6sen.<\/p>\n<\/li>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Prozessdefekte:<\/strong>\u00a0Restkratzer &gt; 0,1\u03bcm aus vorangegangenen Grobpolierstufen werden beim Feinpolieren verst\u00e4rkt.<\/p>\n<\/li>\n<\/ul>\n<p class=\"ds-markdown-paragraph\"><strong>Jizhi Electronics L\u00f6sung<\/strong><br \/>\n\u2460\u00a0<strong>Hochreines ammoniakstabilisiertes Kieselsol:<\/strong>\u00a0Metallverunreinigungen &lt; 1ppm, mit pr\u00e4ziser pH-Kontrolle (8-10).<br \/>\n\u2461\u00a0<strong>Technologie zur Oberfl\u00e4chenver\u00e4nderung:<\/strong>\u00a0Mit Silan-Haftvermittlern beschichtete Schleifmittel verringern die direkte Kontaktkorrosion.<br \/>\n\u2462\u00a0<strong>Unterst\u00fctzung von Prozesspaketen:<\/strong>\u00a0Bietet komplette Parameters\u00e4tze vom Grobpolieren (Ra 50nm \u2192 10nm) bis zum Feinpolieren (Ra \u2192 2nm).<\/p>\n<p class=\"ds-markdown-paragraph\"><strong>Technische Vorteile von Jizhi Electronics Silica Polierschl\u00e4mme<\/strong><\/p>\n<div class=\"ds-scroll-area _1210dd7 c03cafe9\">\n<div class=\"ds-scroll-area__gutters\">\n<div class=\"ds-scroll-area__horizontal-gutter\"><\/div>\n<div class=\"ds-scroll-area__vertical-gutter\"><\/div>\n<\/div>\n<table>\n<thead>\n<tr>\n<th>Technischer Indikator<\/th>\n<th>Industriestandardprodukt<\/th>\n<th>Jizhi Electronics L\u00f6sung<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td><strong>Abrasive Partikelgr\u00f6\u00dfe<\/strong><\/td>\n<td>50-200nm (breite Verteilung)<\/td>\n<td>10-150nm (D50 \u00b15nm)<\/td>\n<\/tr>\n<tr>\n<td><strong>Metallische Verunreinigungen<\/strong><\/td>\n<td>&gt; 10ppm<\/td>\n<td><strong>&lt; 1ppm<\/strong>\u00a0(ICP-MS zertifiziert)<\/td>\n<\/tr>\n<tr>\n<td><strong>Korrosionstest<\/strong><\/td>\n<td>Oxidation tritt nach 48 Stunden auf<\/td>\n<td><strong>Keine Korrosion nach 96 Stunden<\/strong>\u00a0(ASTM B117)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p class=\"ds-markdown-paragraph\">Jizhi Electronics bietet hochpr\u00e4zise, nicht korrosive SiO2-Poliermittel\/CMP-Polierpads an, um das Problem der Lochfra\u00dfbildung beim Spiegelpolieren von 3C-Produkten zu l\u00f6sen. Unsere nanoskaligen Schleifmittel (10-150nm) erreichen eine Oberfl\u00e4chenpr\u00e4zision von Ra &lt; 2nm. Mit 25 Jahren Erfahrung in der CMP-Prozesstechnologie erm\u00f6glichen wir Polier-Upgrades f\u00fcr Halbleiter, Metalle und Siliziumwafer! F\u00fcr weiteren technischen Austausch k\u00f6nnen Sie das technische Team von Jizhi Electronics kontaktieren, um die\u00a0<em>\u201c3C Produkt CMP-Polieren Wei\u00dfbuch\u201d<\/em>\u00a0und Branchenl\u00f6sungen.<\/p>","protected":false},"excerpt":{"rendered":"<p>Why Choose CMP Over Electrochemical Polishing for 3C Product Mirror Polishing? In the 3C industry (mobile phones, laptops, smart wearables, etc.), electrochemical polishing is gradually being replaced by CMP (Chemical  &#8230;<\/p>","protected":false},"author":1,"featured_media":1012,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,58],"tags":[],"class_list":["post-750","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-dynamics"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/750","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/comments?post=750"}],"version-history":[{"count":1,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/750\/revisions"}],"predecessor-version":[{"id":752,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/posts\/750\/revisions\/752"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/media\/1012"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/media?parent=750"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/categories?post=750"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/de\/wp-json\/wp\/v2\/tags?post=750"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}