{"id":915,"date":"2025-12-12T16:37:24","date_gmt":"2025-12-12T08:37:24","guid":{"rendered":"https:\/\/jeez-semicon.com\/?post_type=avada_faq&#038;p=915"},"modified":"2025-12-12T16:40:26","modified_gmt":"2025-12-12T08:40:26","slug":"what-is-the-core-difference-between-a-cmp-finishing-pad-and-rough-intermediate-polishing-pads-how-should-they-be-selected","status":"publish","type":"avada_faq","link":"https:\/\/jeez-semicon.com\/es\/faq-items\/what-is-the-core-difference-between-a-cmp-finishing-pad-and-rough-intermediate-polishing-pads-how-should-they-be-selected\/","title":{"rendered":"\u00bfCu\u00e1l es la diferencia fundamental entre una almohadilla de acabado CMP y las almohadillas de pulido basto\/intermedio? \u00bfC\u00f3mo deben seleccionarse?"},"content":{"rendered":"<p class=\"ds-markdown-paragraph\">CMP finishing pads (Final Pads) are specifically designed for\u00a0<strong>ultra-precise surface finishing<\/strong>. Their key characteristics include:<\/p>\n<ul>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Finer surface structure<\/strong>: Porosity &lt; 10% with higher groove density for nanoscale material removal control (&lt; 50 nm\/min)<\/p>\n<\/li>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Optimized elastic modulus<\/strong>\u00a0(typically &lt; 500 MPa): Buffers pressure through flexible contact to avoid surface damage<\/p>\n<\/li>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Enhanced chemical compatibility<\/strong>: Surface-treated for alkaline\/oxidative slurries<br \/>\n<strong>Selection Guide<\/strong>:<\/p>\n<\/li>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Rough polishing stage<\/strong>: Use high-hardness pads (&gt; 1 GPa) for rapid removal<\/p>\n<\/li>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Finishing stage<\/strong>: Must use finishing pads to ensure surface roughness Ra &lt; 0.5 nm<br \/>\nJizhi Electronics offers complete pad portfolio solutions with intelligent process parameter matching.<\/p>\n<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>CMP finishing pads (Final Pads) are specifically designed for\u00a0ultra-precise surface finishing. Their key characteristics include: Finer surface structure: Porosity &lt; 10% with higher groove density for nanoscale material removal control  &#8230;<\/p>","protected":false},"author":1,"featured_media":923,"menu_order":0,"comment_status":"open","ping_status":"closed","template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"faq_category":[],"class_list":["post-915","avada_faq","type-avada_faq","status-publish","format-standard","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/avada_faq\/915","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/avada_faq"}],"about":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/types\/avada_faq"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/comments?post=915"}],"version-history":[{"count":1,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/avada_faq\/915\/revisions"}],"predecessor-version":[{"id":916,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/avada_faq\/915\/revisions\/916"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/media\/923"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/media?parent=915"}],"wp:term":[{"taxonomy":"faq_category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/faq_category?post=915"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}