{"id":2028,"date":"2026-05-07T14:35:50","date_gmt":"2026-05-07T06:35:50","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=2028"},"modified":"2026-05-07T14:39:39","modified_gmt":"2026-05-07T06:39:39","slug":"wafer-dicing-blade-specifications-dimensions-and-parameters","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/es\/blog\/wafer-dicing-blade-specifications-dimensions-and-parameters\/","title":{"rendered":"Wafer Dicing Blade Specifications: Dimensions &amp; Parameters \u2014 Complete Reference"},"content":{"rendered":"<!-- ============================================================\r\n     Cluster 5: Wafer Dicing Blade Specifications: Dimensions & Parameters\r\n     JEEZ Semiconductor | Jizhi Electronic Technology Co., Ltd.\r\n     May 2026\r\n     ============================================================ 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strong{color:var(--navy);font-weight:700}\r\n.jzc-table-wrap{overflow-x:auto;margin-bottom:28px;border-radius:var(--radius);box-shadow:var(--shadow)}\r\n.jzc-table{width:100%;border-collapse:collapse;font-family:'Trebuchet MS',sans-serif;font-size:14px}\r\n.jzc-table thead tr{background:var(--navy);color:#fff}\r\n.jzc-table thead th{padding:12px 16px;text-align:left;font-weight:600;letter-spacing:.04em;white-space:nowrap}\r\n.jzc-table tbody tr:nth-child(even){background:var(--sky)}\r\n.jzc-table tbody tr:nth-child(odd){background:#fff}\r\n.jzc-table tbody td{padding:11px 16px;border-bottom:1px solid var(--border);color:var(--text);vertical-align:top}\r\n.jzc-table tbody tr:last-child td{border-bottom:none}\r\n.jzc-note{display:flex;gap:14px;background:var(--sky);border:1px solid #bcd5ef;border-left:4px solid var(--accent);border-radius:var(--radius);padding:16px 20px;margin-bottom:26px;font-size:15px;font-family:'Trebuchet MS',sans-serif;color:var(--blue);line-height:1.65}\r\n.jzc-note-icon{font-size:20px;flex-shrink:0;margin-top:2px}\r\n.jzc-spec-grid{display:grid;grid-template-columns:repeat(auto-fit,minmax(190px,1fr));gap:14px;margin-bottom:28px}\r\n.jzc-spec-card{background:#fff;border:1px solid var(--border);border-top:3px solid var(--accent);border-radius:var(--radius);padding:16px 18px;box-shadow:0 2px 8px rgba(10,22,40,.06)}\r\n.jzc-spec-card-label{font-family:'Trebuchet MS',sans-serif;font-size:11px;font-weight:700;text-transform:uppercase;letter-spacing:.08em;color:var(--muted);margin-bottom:5px}\r\n.jzc-spec-card-value{font-family:'Trebuchet MS',sans-serif;font-size:17px;font-weight:700;color:var(--navy)}\r\n.jzc-spec-card-note{font-family:'Trebuchet MS',sans-serif;font-size:12px;color:var(--muted);margin-top:3px;line-height:1.45}\r\n.jzc-back{background:var(--sky);border:1px solid #c5d9f0;border-radius:var(--radius);padding:18px 22px;margin-top:48px;font-family:'Trebuchet MS',sans-serif;font-size:14px;color:var(--muted)}\r\n.jzc-back a{color:var(--accent);font-weight:600}\r\n.jzc-divider{border:none;border-top:1px solid var(--border);margin:44px 0}\r\n@media(max-width:600px){.jzc-hero{padding:34px 20px 28px}}\r\n<\/style><\/p>\r\n<article class=\"jzc\">\r\n<div class=\"jzc-hero\">\r\n<div class=\"jzc-hero-tag\">Technical Reference \u00b7 May 2026<\/div>\r\n<p>A comprehensive technical reference covering all standard dimensional parameters for wafer dicing blades \u2014 outer diameter, inner diameter, blade thickness, exposure, grit size, concentration, and flange configurations for all major saw platforms.<\/p>\r\n<div class=\"jzc-hero-meta\">JEEZ Semiconductor \u00b7 Jizhi Electronic Technology Co., Ltd.~2,000 words \u00b7 9 min readMay 2026<\/div>\r\n<\/div>\r\n<nav class=\"jzc-toc\" aria-label=\"\u00cdndice\">\r\n<div class=\"jzc-toc-title\">\ud83d\udccb \u00cdndice<\/div>\r\n<ol>\r\n<li><a href=\"#params-overview\">Parameter Overview<\/a><\/li>\r\n<li><a href=\"#od\">Outer Diameter (OD)<\/a><\/li>\r\n<li><a href=\"#id\">Inner Diameter (ID)<\/a><\/li>\r\n<li><a href=\"#thickness\">Grosor de la cuchilla<\/a><\/li>\r\n<li><a href=\"#exposure\">Blade Exposure<\/a><\/li>\r\n<li><a href=\"#kerf\">Kerf Width<\/a><\/li>\r\n<li><a href=\"#grit\">Tama\u00f1o del grano de diamante<\/a><\/li>\r\n<li><a href=\"#concentration\">Concentraci\u00f3n de diamantes<\/a><\/li>\r\n<li><a href=\"#flanges\">Flange Configurations by Saw Platform<\/a><\/li>\r\n<li><a href=\"#standard-sizes\">Standard Hub Blade Dimensions<\/a><\/li>\r\n<li><a href=\"#hubless-sizes\">Standard Hubless Blade Dimensions<\/a><\/li>\r\n<li><a href=\"#tolerances\">Manufacturing Tolerances<\/a><\/li>\r\n<\/ol>\r\n<\/nav>\r\n<h2 id=\"params-overview\">1. Parameter Overview<\/h2>\r\n<p>A wafer dicing blade data sheet contains both <em>dimensional parameters<\/em> \u2014 physical measurements of the blade geometry \u2014 and <em>abrasive parameters<\/em> \u2014 specifications of the diamond content. Both sets of parameters must be verified against the dicing saw platform and process requirements before ordering. This reference covers all parameters in detail and is designed to be bookmarked for use during blade specification review. For guidance on how to use these parameters in a selection decision, refer to: <a href=\"https:\/\/jeez-semicon.com\/es\/blog\/Wafer-Dicing-Blade-Complete-Buyers-Guide\/\" target=\"_blank\" rel=\"noopener noreferrer\">Wafer Dicing Blade: The Complete Buyer&#8217;s Guide<\/a>.<\/p>\r\n<div class=\"jzc-spec-grid\">\r\n<div class=\"jzc-spec-card\">\r\n<div class=\"jzc-spec-card-label\">Outer Diameter (OD)<\/div>\r\n<div class=\"jzc-spec-card-value\">50\u2013114 mm<\/div>\r\n<div class=\"jzc-spec-card-note\">Determines cutting exposure range<\/div>\r\n<\/div>\r\n<div class=\"jzc-spec-card\">\r\n<div class=\"jzc-spec-card-label\">Inner Diameter (ID)<\/div>\r\n<div class=\"jzc-spec-card-value\">40\u201357.15 mm<\/div>\r\n<div class=\"jzc-spec-card-note\">Must match spindle or flange bore<\/div>\r\n<\/div>\r\n<div class=\"jzc-spec-card\">\r\n<div class=\"jzc-spec-card-label\">Grosor de la cuchilla<\/div>\r\n<div class=\"jzc-spec-card-value\">15\u2013500 \u00b5m<\/div>\r\n<div class=\"jzc-spec-card-note\">Primary determinant of kerf width<\/div>\r\n<\/div>\r\n<div class=\"jzc-spec-card\">\r\n<div class=\"jzc-spec-card-label\">Exposure<\/div>\r\n<div class=\"jzc-spec-card-value\">\u2265 2\u00d7 wafer t<\/div>\r\n<div class=\"jzc-spec-card-note\">Cutting depth available below flange<\/div>\r\n<\/div>\r\n<div class=\"jzc-spec-card\">\r\n<div class=\"jzc-spec-card-label\">Grit Size<\/div>\r\n<div class=\"jzc-spec-card-value\">2\u201320 \u00b5m<\/div>\r\n<div class=\"jzc-spec-card-note\">Finer = smoother cut surface<\/div>\r\n<\/div>\r\n<div class=\"jzc-spec-card\">\r\n<div class=\"jzc-spec-card-label\">Concentration<\/div>\r\n<div class=\"jzc-spec-card-value\">25\u2013100+<\/div>\r\n<div class=\"jzc-spec-card-note\">Relative diamond volume in bond<\/div>\r\n<\/div>\r\n<\/div>\r\n<h2 id=\"od\">2. Outer Diameter (OD)<\/h2>\r\n<p>The outer diameter of a dicing blade determines two things: the maximum available exposure (how deep the blade can cut) and the peripheral velocity of the cutting rim at a given spindle RPM. Larger OD blades provide more exposure for thick substrate applications and maintain a higher rim velocity at the same RPM setting \u2014 potentially useful for improving cut quality on hard substrates where rim velocity is a key process variable.<\/p>\r\n<p>Standard OD values follow inch-based conventions inherited from the original equipment manufacturers:<\/p>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Standard OD values for dicing blades\">\r\n<thead>\r\n<tr>\r\n<th>OD (inch)<\/th>\r\n<th>OD (mm)<\/th>\r\n<th>Aplicaci\u00f3n t\u00edpica<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>2.000&#8243;<\/td>\r\n<td>50.8 mm<\/td>\r\n<td>Thin wafers, package singulation, MEMS<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>2.165&#8243; (55mm)<\/td>\r\n<td>55.0 mm<\/td>\r\n<td>General silicon, GaAs<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>2.520&#8243;<\/td>\r\n<td>64.0 mm<\/td>\r\n<td>Standard silicon production<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>3.000&#8243;<\/td>\r\n<td>76.2 mm<\/td>\r\n<td>Wide-range silicon, ceramics<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>4.000&#8243;<\/td>\r\n<td>101.6 mm<\/td>\r\n<td>Thick substrate, high-exposure applications<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>4.488&#8243;<\/td>\r\n<td>114.0 mm<\/td>\r\n<td>Maximum OD for most production saws<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"id\">3. Inner Diameter (ID)<\/h2>\r\n<p>The inner diameter must match the spindle bore for hub blades, or the flange bore for hubless blades. This dimension is critical: a mismatch of even 50 \u00b5m can cause inadequate seating, elevated runout, and blade wobble. Standard ID values are:<\/p>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Standard ID values for dicing blades\">\r\n<thead>\r\n<tr>\r\n<th>ID (inch)<\/th>\r\n<th>ID (mm)<\/th>\r\n<th>Common Saw Platform<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>1.575&#8243;<\/td>\r\n<td>40.00 mm<\/td>\r\n<td>DISCO NBC series (standard)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>1.969&#8243;<\/td>\r\n<td>50.00 mm<\/td>\r\n<td>Accretech BS series<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>2.000&#8243;<\/td>\r\n<td>50.80 mm<\/td>\r\n<td>DISCO, ADT \u2014 alternate configuration<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>2.250&#8243;<\/td>\r\n<td>57.15 mm<\/td>\r\n<td>ADT 7100\/7130 series<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<div class=\"jzc-note\">\r\n<div class=\"jzc-note-icon\">\u26a0\ufe0f<\/div>\r\n<div><strong>Always verify ID against your specific saw model documentation.<\/strong> Saw manufacturers may offer multiple spindle configurations for the same model line. Using the wrong ID causes dangerous blade mounting conditions and will result in immediate spindle runout issues.<\/div>\r\n<\/div>\r\n<h2 id=\"thickness\">4. Blade Thickness<\/h2>\r\n<p>Blade thickness is the dimension most directly linked to kerf width and therefore to die count per wafer. It is specified as the nominal thickness of the cutting rim (for hub blades) or the full disc thickness (for hubless blades). Blade thickness tolerances are critical: a blade with \u00b15 \u00b5m tolerance variation cutting a 60 \u00b5m street provides significantly less alignment margin than a \u00b11 \u00b5m nickel electroformed blade.<\/p>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Blade thickness ranges by type and application\">\r\n<thead>\r\n<tr>\r\n<th>Blade Type<\/th>\r\n<th>Typical Thickness Range<\/th>\r\n<th>Minimum Achievable<\/th>\r\n<th>Application Segment<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>Hub blade (resin bond)<\/td>\r\n<td>100\u2013500 \u00b5m<\/td>\r\n<td>~80 \u00b5m<\/td>\r\n<td>Standard silicon, SiC, ceramics<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Hub blade (metal bond)<\/td>\r\n<td>100\u2013400 \u00b5m<\/td>\r\n<td>~100 \u00b5m<\/td>\r\n<td>GaAs, glass, ferrite<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Hubless (resin bond)<\/td>\r\n<td>40\u2013200 \u00b5m<\/td>\r\n<td>~25 \u00b5m<\/td>\r\n<td>Thin wafers, LED, MEMS<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Hubless (metal bond)<\/td>\r\n<td>50\u2013300 \u00b5m<\/td>\r\n<td>~40 \u00b5m<\/td>\r\n<td>Package singulation, glass<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Hubless (nickel electroformed)<\/td>\r\n<td>15\u2013200 \u00b5m<\/td>\r\n<td>~15 \u00b5m<\/td>\r\n<td>Ultra-thin silicon, GaAs, InP, fine-pitch<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"exposure\">5. Blade Exposure<\/h2>\r\n<p>Blade exposure is the vertical height of cutting rim that protrudes below the face of the mounting flange (for hubless blades) or the lower face of the hub (for hub blades). This dimension must be greater than the total material stack the blade must cut through \u2014 the wafer, plus the dicing tape, plus a safety clearance above the vacuum chuck surface.<\/p>\r\n<p><strong>Exposure calculation formula:<\/strong><\/p>\r\n<p style=\"text-align: center; background: var(--sky); padding: 12px 20px; border-radius: var(--radius); font-family: 'Trebuchet MS',sans-serif; font-size: 15px; font-style: italic;\">Minimum required exposure = Wafer thickness + Tape thickness + 0.5 mm safety margin<\/p>\r\n<p>In practice, a production blade should have exposure of approximately 1.5\u20132\u00d7 the total material stack to allow for blade wear over its service life. As the blade OD decreases from wear, exposure decreases proportionally; a blade that starts with barely sufficient exposure will become under-exposed partway through its service life, resulting in incomplete cuts.<\/p>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Exposure calculation examples\">\r\n<thead>\r\n<tr>\r\n<th>Wafer Thickness<\/th>\r\n<th>Tape Thickness<\/th>\r\n<th>Minimum Exposure<\/th>\r\n<th>Recommended Exposure<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>150 \u00b5m (ultra-thin Si)<\/td>\r\n<td>90 \u00b5m UV tape<\/td>\r\n<td>740 \u00b5m<\/td>\r\n<td>1.0\u20131.2 mm<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>300 \u00b5m<\/td>\r\n<td>90 \u00b5m<\/td>\r\n<td>890 \u00b5m<\/td>\r\n<td>1.2\u20131.5 mm<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>525 \u00b5m (200 mm Si)<\/td>\r\n<td>90 \u00b5m<\/td>\r\n<td>1,115 \u00b5m<\/td>\r\n<td>1.5\u20132.0 mm<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>675 \u00b5m (300 mm Si)<\/td>\r\n<td>90 \u00b5m<\/td>\r\n<td>1,265 \u00b5m<\/td>\r\n<td>1.8\u20132.5 mm<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>350 \u00b5m (GaAs)<\/td>\r\n<td>110 \u00b5m<\/td>\r\n<td>960 \u00b5m<\/td>\r\n<td>1.3\u20131.6 mm<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"kerf\">6. Kerf Width<\/h2>\r\n<p>Kerf is the actual width of material removed by the cutting process. It is not equal to blade thickness \u2014 actual kerf is always wider due to sidewall wear, blade deflection, and kerf-wall surface roughness. The kerf-to-thickness offset ranges from approximately 5 \u00b5m for well-maintained nickel electroformed hubless blades to 20\u201330 \u00b5m for worn sintered metal blades near end-of-life.<\/p>\r\n<p>Kerf width must be measured regularly during production \u2014 at blade installation, at mid-blade-life, and at end-of-life \u2014 to confirm it remains within the specification window defined by street width and alignment tolerance. Any upward trend in kerf width measurement is an early indicator of blade wear or spindle runout degradation.<\/p>\r\n<h2 id=\"grit\">7. Diamond Grit Size<\/h2>\r\n<p>Diamond grit size is specified as the average particle diameter in micrometres (\u00b5m) and determines the trade-off between cut surface quality and cutting rate. The industry uses both \u00b5m notation and mesh-size notation (e.g., #400 = approximately 30 \u00b5m; #2000 = approximately 6 \u00b5m; #4000 = approximately 3 \u00b5m). When specifying blades, always use \u00b5m notation to avoid ambiguity between different mesh-size standards.<\/p>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Diamond grit size reference table\">\r\n<thead>\r\n<tr>\r\n<th>Grit Size (\u00b5m)<\/th>\r\n<th>Approx. Mesh Equivalent<\/th>\r\n<th>Cut Surface<\/th>\r\n<th>Cutting Rate<\/th>\r\n<th>Typical Use<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>2\u20133 \u00b5m<\/td>\r\n<td>#6000\u2013#8000<\/td>\r\n<td>Very smooth<\/td>\r\n<td>Slow<\/td>\r\n<td>GaAs, InP, ultra-thin Si, optical<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>4\u20136 \u00b5m<\/td>\r\n<td>#2000\u2013#4000<\/td>\r\n<td>Smooth<\/td>\r\n<td>Moderado<\/td>\r\n<td>Standard Si, glass, LiTaO\u2083<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>6\u20138 \u00b5m<\/td>\r\n<td>#1500\u2013#2000<\/td>\r\n<td>Moderado<\/td>\r\n<td>Bien<\/td>\r\n<td>Sapphire, hard ceramics, thick Si<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>8\u201312 \u00b5m<\/td>\r\n<td>#1000\u2013#1500<\/td>\r\n<td>Rougher<\/td>\r\n<td>Alta<\/td>\r\n<td>SiC, AlN, package singulation<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>12\u201320 \u00b5m<\/td>\r\n<td>#600\u2013#1000<\/td>\r\n<td>Coarse<\/td>\r\n<td>Muy alta<\/td>\r\n<td>Rough cutting, hard bulk ceramics<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"concentration\">8. Diamond Concentration<\/h2>\r\n<p>Diamond concentration is expressed on a dimensionless scale where 100 represents approximately 4.4 carats per cm\u00b3 of bond volume (25% by volume). The scale is relative and may vary slightly between manufacturers. Higher concentration increases the number of active cutting points, distributes force more evenly across the blade face, and generally improves cut smoothness. However, in soft bond systems (resin), excessively high concentration can inhibit the bond erosion needed for self-sharpening, leading to glazing.<\/p>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Diamond concentration guidance\">\r\n<thead>\r\n<tr>\r\n<th>Concentration<\/th>\r\n<th>Approximate Vol%<\/th>\r\n<th>Effect<\/th>\r\n<th>Recommended For<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>25<\/td>\r\n<td>~6%<\/td>\r\n<td>Aggressive dressing action, fast self-sharpening<\/td>\r\n<td>Very hard substrates (SiC, sapphire) with resin bond<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>50<\/td>\r\n<td>~12.5%<\/td>\r\n<td>Balanced \u2014 most common production specification<\/td>\r\n<td>Silicon, glass, GaAs (general purpose)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>75<\/td>\r\n<td>~19%<\/td>\r\n<td>More cutting points, smoother finish<\/td>\r\n<td>Fine-pitch cutting, die-edge quality critical<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>100<\/td>\r\n<td>~25%<\/td>\r\n<td>Maximum density, stable kerf, premium finish<\/td>\r\n<td>Precision optical, silicon photonics<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"flanges\">9. Flange Configurations by Saw Platform<\/h2>\r\n<p>For hubless blades, the mounting flange configuration must be specified alongside the blade dimensions. Flanges are saw-platform-specific: an Accretech flange set will not mount on a DISCO spindle without an adapter. The table below provides standard flange configurations for the most common production platforms as of May 2026. Always verify with your saw OEM documentation before ordering.<\/p>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Flange configurations by saw platform\">\r\n<thead>\r\n<tr>\r\n<th>Saw Platform<\/th>\r\n<th>Spindle Bore<\/th>\r\n<th>Standard Flange OD<\/th>\r\n<th>Flange Face Diameter<\/th>\r\n<th>Notas<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>DISCO NBC-Z series<\/td>\r\n<td>40.00 mm<\/td>\r\n<td>40 mm<\/td>\r\n<td>Various (blade-OD dependent)<\/td>\r\n<td>Self-locking flange nut system<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>DISCO DFD series<\/td>\r\n<td>40.00 mm<\/td>\r\n<td>40 mm<\/td>\r\n<td>Various<\/td>\r\n<td>Compatible with NBC flange sets<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Accretech BS-G series<\/td>\r\n<td>50.00 mm<\/td>\r\n<td>50 mm<\/td>\r\n<td>Various<\/td>\r\n<td>Different nut thread from DISCO<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>ADT 7100\/7130<\/td>\r\n<td>57.15 mm<\/td>\r\n<td>57.15 mm<\/td>\r\n<td>Various<\/td>\r\n<td>Requires ADT-specific flange pair<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Loadpoint Micro-200<\/td>\r\n<td>40.00 mm<\/td>\r\n<td>40 mm<\/td>\r\n<td>Various<\/td>\r\n<td>Compatible with DISCO 40 mm flanges in most configurations<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"standard-sizes\">10. Standard Hub Blade Dimensions<\/h2>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Standard hub blade dimension reference\">\r\n<thead>\r\n<tr>\r\n<th>OD (mm)<\/th>\r\n<th>Hub Thickness (mm)<\/th>\r\n<th>Typical Cutting Rim Thickness<\/th>\r\n<th>Common Wafer Size<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>55.0<\/td>\r\n<td>6.0<\/td>\r\n<td>100\u2013400 \u00b5m<\/td>\r\n<td>100 mm (4&#8243;) and below<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>76.2<\/td>\r\n<td>8.0<\/td>\r\n<td>100\u2013500 \u00b5m<\/td>\r\n<td>150 mm (6&#8243;) and 200 mm (8&#8243;)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>101.6<\/td>\r\n<td>11.0<\/td>\r\n<td>150\u2013500 \u00b5m<\/td>\r\n<td>200 mm (8&#8243;) and 300 mm (12&#8243;)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>114.0<\/td>\r\n<td>12.7<\/td>\r\n<td>200\u2013500 \u00b5m<\/td>\r\n<td>300 mm (12&#8243;) thick substrates<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"hubless-sizes\">11. Standard Hubless Blade Dimensions<\/h2>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Standard hubless blade dimension reference\">\r\n<thead>\r\n<tr>\r\n<th>OD (mm)<\/th>\r\n<th>ID (mm)<\/th>\r\n<th>Espesor t\u00edpico de la hoja<\/th>\r\n<th>Bond Type Available<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>55.0<\/td>\r\n<td>40.0<\/td>\r\n<td>15\u2013200 \u00b5m<\/td>\r\n<td>Resin, Nickel, Hybrid<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>55.0<\/td>\r\n<td>50.0<\/td>\r\n<td>20\u2013200 \u00b5m<\/td>\r\n<td>Resin, Metal, Nickel, Hybrid<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>76.2<\/td>\r\n<td>40.0<\/td>\r\n<td>25\u2013300 \u00b5m<\/td>\r\n<td>Resin, Metal, Nickel, Hybrid<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>76.2<\/td>\r\n<td>50.0<\/td>\r\n<td>25\u2013300 \u00b5m<\/td>\r\n<td>Resin, Metal, Nickel, Hybrid<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>76.2<\/td>\r\n<td>57.15<\/td>\r\n<td>30\u2013300 \u00b5m<\/td>\r\n<td>Resin, Metal, Hybrid<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"tolerances\">12. Manufacturing Tolerances<\/h2>\r\n<div class=\"jzc-table-wrap\">\r\n<table class=\"jzc-table\" aria-label=\"Manufacturing tolerances by bond type\">\r\n<thead>\r\n<tr>\r\n<th>Par\u00e1metro<\/th>\r\n<th>Adhesi\u00f3n de resina<\/th>\r\n<th>Metal (Sintered)<\/th>\r\n<th>Nickel (Electroformed)<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>Blade thickness tolerance<\/td>\r\n<td>\u00b13\u20135 \u00b5m<\/td>\r\n<td>\u00b12\u20135 \u00b5m<\/td>\r\n<td>\u00b11 \u00b5m<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>OD tolerance<\/td>\r\n<td>\u00b10.1 mm<\/td>\r\n<td>\u00b10.1 mm<\/td>\r\n<td>\u00b10.05 mm<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>ID tolerance<\/td>\r\n<td>\u00b10.01 mm<\/td>\r\n<td>\u00b10.01 mm<\/td>\r\n<td>\u00b10.005 mm<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Runout (TIR at face)<\/td>\r\n<td>&lt;5 \u00b5m<\/td>\r\n<td>&lt;5 \u00b5m<\/td>\r\n<td>&lt;2 \u00b5m<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Blade flatness<\/td>\r\n<td>&lt;10 \u00b5m<\/td>\r\n<td>&lt;8 \u00b5m<\/td>\r\n<td>&lt;3 \u00b5m<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<hr class=\"jzc-divider\" \/>\r\n<div class=\"jzc-back\">\u2190 Back to the full guide: <a href=\"https:\/\/jeez-semicon.com\/es\/blog\/Wafer-Dicing-Blade-Complete-Buyers-Guide\/\" target=\"_blank\" rel=\"noopener noreferrer\">Wafer Dicing Blade: The Complete Buyer&#8217;s Guide<\/a> \u2014 for blade selection methodology, bond type comparison, process optimisation, and all related technical topics.<\/div>\r\n<\/article>","protected":false},"excerpt":{"rendered":"<p>Technical Reference \u00b7 May 2026 A comprehensive technical reference covering all standard dimensional parameters for wafer dicing blades \u2014 outer diameter, inner diameter, blade thickness, exposure, grit size, concentration, and  &#8230;<\/p>","protected":false},"author":1,"featured_media":2030,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-2028","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/posts\/2028","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/comments?post=2028"}],"version-history":[{"count":3,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/posts\/2028\/revisions"}],"predecessor-version":[{"id":2045,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/posts\/2028\/revisions\/2045"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/media\/2030"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/media?parent=2028"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/categories?post=2028"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/tags?post=2028"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}