{"id":750,"date":"2025-12-05T10:37:26","date_gmt":"2025-12-05T02:37:26","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=750"},"modified":"2025-12-25T10:47:48","modified_gmt":"2025-12-25T02:47:48","slug":"3c-product-mirror-polishing-solution-pitting-free-sio2-silica-polishing-slurry","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/es\/blog\/3c-product-mirror-polishing-solution-pitting-free-sio2-silica-polishing-slurry\/","title":{"rendered":"Producto 3C Soluci\u00f3n para pulido de espejos: Lechada de pulido de s\u00edlice SiO2 sin picaduras"},"content":{"rendered":"<p class=\"ds-markdown-paragraph\"><strong>\u00bfPor qu\u00e9 elegir CMP en lugar del pulido electroqu\u00edmico para el pulido espejo de productos 3C?<\/strong><\/p>\n<p class=\"ds-markdown-paragraph\">En la industria 3C (tel\u00e9fonos m\u00f3viles, ordenadores port\u00e1tiles, dispositivos inteligentes para llevar puestos, etc.), el pulido electroqu\u00edmico est\u00e1 siendo sustituido gradualmente por el pulido qu\u00edmico-mec\u00e1nico (CMP) debido a problemas como el sobregrabado de bordes y las limitaciones de material. Gracias a la sinergia mec\u00e1nico-qu\u00edmica de su lechada de pulido de SiO2 a nanoescala, Jizhi Electronics consigue:<\/p>\n<p class=\"ds-markdown-paragraph\">\u2460\u00a0<strong>Precisi\u00f3n a nanoescala:<\/strong>\u00a0Rugosidad superficial Ra &lt; 2nm, que cumple los requisitos de los espejos de calidad \u00f3ptica.<br \/>\n\u2461\u00a0<strong>Adaptabilidad de estructuras complejas:<\/strong>\u00a0Adecuado para piezas irregulares como bastidores intermedios de aleaci\u00f3n de aluminio y botones de acero inoxidable.<br \/>\n\u2462\u00a0<strong>Mejora de la eficiencia:<\/strong>\u00a0Reduce el tiempo de procesamiento en 30% en comparaci\u00f3n con los m\u00e9todos tradicionales.<\/p>\n<p><img decoding=\"async\" class=\"lazyload alignnone size-full wp-image-751\" src=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9.png\" data-orig-src=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9.png\" alt=\"\" width=\"750\" height=\"484\" srcset=\"data:image\/svg+xml,%3Csvg%20xmlns%3D%27http%3A%2F%2Fwww.w3.org%2F2000%2Fsvg%27%20width%3D%27750%27%20height%3D%27484%27%20viewBox%3D%270%200%20750%20484%27%3E%3Crect%20width%3D%27750%27%20height%3D%27484%27%20fill-opacity%3D%220%22%2F%3E%3C%2Fsvg%3E\" data-srcset=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9-200x129.png 200w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9-300x194.png 300w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9-400x258.png 400w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9-600x387.png 600w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/11-9.png 750w\" data-sizes=\"auto\" data-orig-sizes=\"(max-width: 750px) 100vw, 750px\" \/><\/p>\n<p class=\"ds-markdown-paragraph\"><strong>An\u00e1lisis en profundidad del problema de las picaduras en los lodos de pulido de s\u00edlice<\/strong><\/p>\n<p class=\"ds-markdown-paragraph\">Los problemas de picaduras comunicados por los clientes suelen deberse a:<\/p>\n<ul>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Corrosi\u00f3n del sol de s\u00edlice:<\/strong>\u00a0Iones Na+, Cl- en lodos de baja pureza que desencadenan la corrosi\u00f3n electroqu\u00edmica de los metales.<\/p>\n<\/li>\n<li>\n<p class=\"ds-markdown-paragraph\"><strong>Defectos de proceso:<\/strong>\u00a0Ara\u00f1azos residuales &gt; 0,1\u03bcm de etapas previas de pulido basto que se amplifican durante el pulido fino.<\/p>\n<\/li>\n<\/ul>\n<p class=\"ds-markdown-paragraph\"><strong>Soluci\u00f3n electr\u00f3nica Jizhi<\/strong><br \/>\n\u2460\u00a0<strong>Sol de s\u00edlice estabilizada con amon\u00edaco de gran pureza:<\/strong>\u00a0Impurezas met\u00e1licas &lt; 1ppm, con control preciso del pH (8-10).<br \/>\n\u2461\u00a0<strong>Tecnolog\u00eda de modificaci\u00f3n de superficies:<\/strong>\u00a0Los abrasivos recubiertos con agentes de acoplamiento de silano reducen la corrosi\u00f3n por contacto directo.<br \/>\n\u2462\u00a0<strong>Soporte de paquetes de procesos:<\/strong>\u00a0Proporciona conjuntos de par\u00e1metros completos desde el pulido basto (Ra 50nm \u2192 10nm) hasta el pulido fino (Ra \u2192 2nm).<\/p>\n<p class=\"ds-markdown-paragraph\"><strong>Ventajas t\u00e9cnicas de Jizhi Electronics Silica Polishing Slurry<\/strong><\/p>\n<div class=\"ds-scroll-area _1210dd7 c03cafe9\">\n<div class=\"ds-scroll-area__gutters\">\n<div class=\"ds-scroll-area__horizontal-gutter\"><\/div>\n<div class=\"ds-scroll-area__vertical-gutter\"><\/div>\n<\/div>\n<table>\n<thead>\n<tr>\n<th>Indicador t\u00e9cnico<\/th>\n<th>Producto est\u00e1ndar del sector<\/th>\n<th>Soluci\u00f3n electr\u00f3nica Jizhi<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td><strong>Tama\u00f1o de las part\u00edculas abrasivas<\/strong><\/td>\n<td>50-200nm (amplia distribuci\u00f3n)<\/td>\n<td>10-150nm (D50 \u00b15nm)<\/td>\n<\/tr>\n<tr>\n<td><strong>Impurezas met\u00e1licas<\/strong><\/td>\n<td>&gt; 10ppm<\/td>\n<td><strong>&lt; 1ppm<\/strong>\u00a0(certificado ICP-MS)<\/td>\n<\/tr>\n<tr>\n<td><strong>Prueba de corrosi\u00f3n<\/strong><\/td>\n<td>La oxidaci\u00f3n aparece despu\u00e9s de 48 horas<\/td>\n<td><strong>Sin corrosi\u00f3n tras 96 horas<\/strong>\u00a0(ASTM B117)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p class=\"ds-markdown-paragraph\">Jizhi Electronics proporciona alta precisi\u00f3n, no corrosivo SiO2 pulido slurry\/CMP almohadillas de pulido para resolver el problema de picaduras en 3C producto espejo pulido. Nuestros abrasivos a nanoescala (10-150nm) consiguen una precisi\u00f3n superficial de Ra &lt; 2nm. Gracias a nuestros 25 a\u00f1os de experiencia en tecnolog\u00eda de procesos CMP, podemos mejorar el pulido de semiconductores, metales y obleas de silicio. Para m\u00e1s intercambio t\u00e9cnico, puede ponerse en contacto con el equipo t\u00e9cnico de Jizhi Electronics para obtener el\u00a0<em>\u201cLibro blanco del pulido CMP con productos 3C\u201d<\/em>\u00a0y soluciones industriales.<\/p>","protected":false},"excerpt":{"rendered":"<p>Why Choose CMP Over Electrochemical Polishing for 3C Product Mirror Polishing? In the 3C industry (mobile phones, laptops, smart wearables, etc.), electrochemical polishing is gradually being replaced by CMP (Chemical  &#8230;<\/p>","protected":false},"author":1,"featured_media":1012,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,58],"tags":[],"class_list":["post-750","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-dynamics"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/posts\/750","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/comments?post=750"}],"version-history":[{"count":1,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/posts\/750\/revisions"}],"predecessor-version":[{"id":752,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/posts\/750\/revisions\/752"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/media\/1012"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/media?parent=750"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/categories?post=750"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/es\/wp-json\/wp\/v2\/tags?post=750"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}