{"id":1889,"date":"2026-04-22T13:03:22","date_gmt":"2026-04-22T05:03:22","guid":{"rendered":"https:\/\/jeez-semicon.com\/?post_type=semiconductor&p=1889"},"modified":"2026-04-22T13:49:44","modified_gmt":"2026-04-22T05:49:44","slug":"semiconductor-polishing-slurry-sapphire-polishing-slurry-grinding-slurry","status":"publish","type":"semiconductor","link":"https:\/\/jeez-semicon.com\/es\/semiconductor\/semiconductor-polishing-slurry-sapphire-polishing-slurry-grinding-slurry\/","title":{"rendered":"Semiconductor Polishing Slurry Sapphire Polishing Slurry \/ Grinding Slurry"},"content":{"rendered":"

Product Description<\/strong><\/h2>\n\n\n\n

The Sapphire Grinding Slurry \/ Sapphire LED Substrate Polishing Slurry \/ Sapphire Slurry formulation developed for the semiconductor and optical industries is suitable for the planarization of sapphire substrates, epitaxial wafers, and LEDs. Designed to meet the requirements of every substrate manufacturing stage from grinding to CMP, it provides a high-performance, cost-effective solution for sapphire substrate polishing applications.<\/p>\n\n\n\n

Caracter\u00edsticas del producto<\/strong><\/h2>\n\n\n\n

High-purity raw materials with no contamination
Fast polishing rate with high planarization
High removal rate, good stability, low damage layer, and excellent surface quality<\/p>\n\n\n

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\"Grinding<\/figure>\n<\/div>\n\n
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\"Grinding<\/figure>\n<\/div>\n\n\n

Features of JIZHI Electronics CMP Sapphire Grinding Slurry \/ Polishing Slurry<\/strong><\/h2>\n\n\n\n

1.High-performance slurry for the mass production of sapphire wafers.
2.The formulation is designed to meet the requirements of every process stage in substrate manufacturing, from grinding to CMP, and is suitable for oriented sapphire wafers, including C-plane, A-plane, and R-plane polishing.
3.It achieves a high removal rate with no subsurface damage, while providing excellent stability and reusability.
4.The JIZHI Electronics sapphire slurry product portfolio provides a high-performance and cost-effective solution.
5.Customized one-to-one solutions can be provided according to specific grinding and polishing requirements.<\/p>\n\n\n\n

C-Plane Sapphire Substrate Polishing Process and Supporting Materials<\/strong><\/h2>\n\n\n\n\n \n \n \n \n \n \n \n \n
Process<\/th>\n Category<\/th>\n Particle Size (\u03bcm)<\/th>\n pH<\/th>\n Modelo<\/th>\n Matching Plate \/ Pad<\/th>\n Rate (\u03bcm\/min)<\/th>\n <\/tr>\n \n \n
Grinding<\/td>\n Polycrystalline Diamond-Like Slurry<\/td>\n 5-6<\/td>\n 4-6<\/td>\n JZ-CD06<\/td>\n Copper Plate<\/td>\n 3.3<\/td>\n <\/tr>\n \n \n
Polycrystalline Diamond-Like Slurry<\/td>\n 3-4<\/td>\n 4-6<\/td>\n JZ-CD04<\/td>\n Copper Plate<\/td>\n 2.6<\/td>\n <\/tr>\n \n \n
Polycrystalline Diamond-Like Slurry<\/td>\n 1-2<\/td>\n 4-6<\/td>\n JZ-CD02<\/td>\n Copper Plate<\/td>\n 2<\/td>\n <\/tr>\n \n \n
Pulido<\/td>\n Alumina Polishing Slurry<\/td>\n 0.5-1.5<\/td>\n 12-14<\/td>\n JZ-A02<\/td>\n Nonwoven Fiber Pad<\/td>\n 0.13<\/td>\n <\/tr>\n \n \n
Alumina Polishing Slurry<\/td>\n 0.5-1.5<\/td>\n 3-5<\/td>\n JZ-A03<\/td>\n Nonwoven Fiber Pad<\/td>\n 0.08<\/td>\n <\/tr>\n \n <\/table>\n\n\n\n

Technical Specifications of Diamond Grinding Slurry<\/strong><\/h2>\n\n\n\n
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\"Grinding<\/figure>\n<\/div><\/div>\n\n\n\n
\n\n \n \n \n \n \n \n \n \n \n \n
Specification<\/th>\n Coarse Grinding Diamond Slurry<\/th>\n <\/tr>\n \n \n
Product Type<\/td>\n Polycrystalline Diamond-Like Slurry<\/td>\n <\/tr>\n \n \n
Modelo<\/td>\n JZ-CD06<\/td>\n JZ-CD04<\/td>\n JZ-CD02<\/td>\n <\/tr>\n \n \n
Matching Plate \/ Pad<\/td>\n Copper Plate<\/td>\n Copper Plate<\/td>\n Copper Plate<\/td>\n <\/tr>\n \n \n
pH Value<\/td>\n 4-6<\/td>\n 4-6<\/td>\n 4-6<\/td>\n <\/tr>\n \n \n
Particle Size (D50)<\/td>\n 5\u20136 \u03bcm<\/td>\n 3\u20134 \u03bcm<\/td>\n 1\u20132 \u03bcm<\/td>\n <\/tr>\n \n \n
Tasa de eliminaci\u00f3n<\/td>\n 3.3 \u03bcm\/min<\/td>\n 2.6 \u03bcm\/min<\/td>\n 2.0 \u03bcm\/min<\/td>\n <\/tr>\n \n \n
Calidad de la superficie<\/td>\n Fine grinding texture<\/td>\n <\/tr>\n \n <\/table>\n<\/div>\n<\/div>\n\n\n\n

Caracter\u00edsticas del producto<\/strong><\/h2>\n\n\n\n

Fast removal rate \/ Easy to clean after polishing \/ Stable particle size with fine texture<\/p>\n\n\n\n

Technical Specifications and Product Introduction of Alumina Polishing Slurry<\/strong><\/h2>\n\n\n\n
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\"Grinding<\/figure>\n<\/div>\n\n\n\n
\n\n \n \n \n \n \n \n \n \n \n \n \n
Specification<\/th>\n Alumina Polishing Slurry<\/th>\n <\/tr>\n \n \n
Applicable Wafer<\/td>\n C-plane Sapphire Substrate<\/td>\n <\/tr>\n \n \n
Product Model<\/td>\n JZ-A02<\/td>\n JZ-A03<\/td>\n <\/tr>\n \n \n
Matching Polishing Pad<\/td>\n Non-woven Pad Z-800T<\/td>\n <\/tr>\n \n \n
Solid Content<\/td>\n 20<\/td>\n 20<\/td>\n <\/tr>\n \n \n
pH Value<\/td>\n 12-14<\/td>\n 3-5<\/td>\n <\/tr>\n \n \n
Particle Size (D50)<\/td>\n 0.5-1.5 \u03bcm<\/td>\n 0.5-1.5 \u03bcm<\/td>\n <\/tr>\n \n \n
Tasa de eliminaci\u00f3n<\/td>\n 0.13\u03bcm<\/td>\n 0.08\u03bcm<\/td>\n <\/tr>\n \n \n
Dilution Ratio<\/td>\n 5\u201310\u00d7<\/td>\n 5\u201310\u00d7<\/td>\n <\/tr>\n \n <\/table>\n<\/div>\n<\/div>\n\n\n\n

Caracter\u00edsticas del producto<\/strong><\/h2>\n\n\n\n

High dilution ratio, reducing costs
Alkaline formulation with fast removal rate, good suspension performance, and easy redispersion
Long service life, stable particle size, and no scratching<\/p>\n\n\n\n

Technical Specifications and Product Introduction of Polishing Pad<\/strong><\/h2>\n\n\n\n

Suitable for rough polishing of sapphire and silicon carbide substrates<\/strong><\/h2>\n\n\n\n

Resistant to strong acids, alkalis, and corrosion, with a long service life\u2028Moderate hardness, maintaining good removal rate while reducing the risk of scratching\u2028Made from a special polymer polyurethane and non-woven composite structure, compatible with alumina-based rough polishing slurries for over 48 hours<\/p>\n\n\n\n\n \n \n \n \n
Modelo<\/th>\n Espesor (mm)<\/th>\n Shore A Hardness<\/th>\n Density (g\/cm\u00b3)<\/th>\n Compression Ratio (%)<\/th>\n <\/tr>\n \n \n
JZ-800T<\/td>\n 1.5MM<\/td>\n 90<\/td>\n 0.44<\/td>\n 2.1<\/td>\n <\/tr>\n \n <\/table>\n\n\n\n

Backing adhesive and grooving services can be provided according to different requirements.
Standard grid groove sizes: 5\u00d75 mm, 10\u00d710 mm, 15\u00d715 mm, 20\u00d720 mm, 25\u00d725 mm, 30\u00d730 mm, etc.
Standard diameters: 380 mm, \u03a6610 mm, \u03a6640 mm, \u03a6855 mm, \u03a6910 mm, \u03a6930 mm, \u03a61120 mm, \u03a61180 mm, \u03a61300 mm, etc.; custom sizes available.<\/p>\n\n\n\n

AFM Surface Roughness Measurement<\/strong><\/h2>\n\n\n\n

Sapphire Polishing Slurry JZ-A02<\/strong><\/h2>\n\n\n
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\"Grinding<\/figure>\n<\/div>\n\n\n

Data Performance After Candela Inspection<\/strong><\/h2>\n\n\n\n

Data Performance After Candela Inspection<\/strong><\/h2>\n\n\n
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\"Grinding<\/figure>\n<\/div>\n\n\n

M\u00e9todo de almacenamiento de la pasta de pulido de carburo de silicio SiC de JIZHI Electronics<\/strong><\/h2>\n\n\n\n

Almacenar en un almac\u00e9n bien ventilado, fresco y seco. El producto debe almacenarse a 5-35 \u00b0C, protegido de la luz solar directa y de la congelaci\u00f3n. Si se almacena por debajo de 0 \u00b0C, puede producirse una aglomeraci\u00f3n irreversible que inutilice el producto.<\/p>\n\n\n\n

Precios de JIZHI Electronics CMP \/ Slurry Polishing Liquids<\/strong><\/h2>\n\n\n\n

Los lodos de pulido de metales CMP de JIZHI Electronics se fabrican utilizando tecnolog\u00edas y equipos de producci\u00f3n extranjeros avanzados y se formulan con composiciones qu\u00edmicas especializadas. La calidad de los lodos de pulido de JIZHI Electronics es comparable a la de productos importados similares.<\/p>\n\n\n\n

Gracias a la producci\u00f3n localizada, los lodos CMP de JIZHI Electronics ofrecen plazos de entrega cortos, una alta calidad estable y precios competitivos y rentables.<\/p>\n\n\n\n

<\/p>","protected":false},"excerpt":{"rendered":"

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