How is the service life of finishing pads evaluated? What are the warning indicators for replacement?

Life assessment requires comprehensive monitoring of the following indicators: Monitoring Metric Normal Range Replacement Warning Surface Porosity Change Initial value ± 5% > ± 15% Elastic Recovery Rate > 92% < 85% Friction Coefficient Stability Fluctuation < ± 0.02 Fluctuation > ± 0.05 Slurry Consumption Rate Baseline ± 10% Increase > 25% Smart Monitoring Solution : We offer optional embedded sensor pads that transmit real-time pressure/temperature data to customer MES systems. Professional surface topography analysis is recommended after every 500 polishing cycles.

What special properties are required for finishing pads when processing third-generation semiconductor materials like Gallium Nitride (GaN)?

Three special requirements must be met: Low-stress polishing : Elastic substrate modulus must match GaN's brittle nature (fracture toughness < 2 MPa·m¹/²) to prevent micro-cracks Resistance to strong alkaline environments : PTFE-modified polyurethane enables stable operation > 200 hours in KOH-based slurries with pH > 12 Enhanced thermal management : Thermal conductivity > 0.5 W/m·K for rapid dissipation of localized friction heat (GaN is temperature-sensitive) Jizhi Electronics' GaN-specific pad series has been validated in 6-inch wafer mass production, with warpage control < 50 µm.

How can the improvement in polishing uniformity be quantified after using your finishing pads?

Improvement can be quantified through three key metrics: TTV Improvement : Proprietary porous elastic layer design controls wafer total thickness variation to < 0.3 µm (40% improvement over conventional pads) Removal Rate Uniformity : Micro-channel technology improves within-wafer non-uniformity (WIWNU) to > 95% Defect Control : Flexible fiber surface structure reduces scratch defect density to < 0.05 counts/cm² We offer free process audit services to provide customers with benchmark comparison reports.

What is the core difference between a CMP finishing pad and rough/intermediate polishing pads? How should they be selected?

CMP finishing pads (Final Pads) are specifically designed for ultra-precise surface finishing . Their key characteristics include: Finer surface structure : Porosity < 10% with higher groove density for nanoscale material removal control (< 50 nm/min) Optimized elastic modulus (typically < 500 MPa): Buffers pressure through flexible contact to avoid surface damage Enhanced chemical compatibility : Surface-treated for alkaline/oxidative slurries Selection Guide : Rough polishing stage : Use high-hardness pads (> 1 GPa) for rapid removal Finishing stage : Must use finishing pads to ensure surface roughness Ra < 0.5 nm Jizhi Electronics offers complete pad portfolio solutions with intelligent process parameter matching.

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2025年12月12日
How is the service life of finishing pads evaluated? What are the warning indicators for replacement?
Life assessment requires comprehensive monitoring of the following indicators: Monitoring Metric Nor ...

View more >
2025年12月12日
What special properties are required for finishing pads when processing third-generation semiconductor materials like Gallium Nitride (GaN)?
Three special requirements must be met: Low-stress polishing: Elastic substrate modulus must match G ...

View more >
2025年12月12日
How can the improvement in polishing uniformity be quantified after using your finishing pads?
Improvement can be quantified through three key metrics: TTV Improvement: Proprietary porous elastic ...

View more >
2025年12月12日
What is the core difference between a CMP finishing pad and rough/intermediate polishing pads? How should they be selected?
CMP finishing pads (Final Pads) are specifically designed for ultra-precise surface finishing. Their ...

View more >

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