How can the improvement in polishing uniformity be quantified after using your finishing pads?

Improvement can be quantified through three key metrics:

1. TTV Improvement: Proprietary porous elastic layer design controls wafer total thickness variation to < 0.3 µm (40% improvement over conventional pads)

2. Removal Rate Uniformity: Micro-channel technology improves within-wafer non-uniformity (WIWNU) to > 95%

3. Defect Control: Flexible fiber surface structure reduces scratch defect density to < 0.05 counts/cm²
   We offer free process audit services to provide customers with benchmark comparison reports.