{"id":1731,"date":"2026-03-16T09:44:20","date_gmt":"2026-03-16T01:44:20","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=1731"},"modified":"2026-03-16T09:44:20","modified_gmt":"2026-03-16T01:44:20","slug":"dicing-blade-wear-too-fast-heres-what-to-check","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/fr\/blog\/dicing-blade-wear-too-fast-heres-what-to-check\/","title":{"rendered":"Usure trop rapide de la lame de d\u00e9coupe Voici ce qu'il faut v\u00e9rifier"},"content":{"rendered":"<!-- ============================================================\n     CLUSTER C-02\n     H1 \/ URL slug: dicing-blade-wear-too-fast-heres-what-to-check\n     Full URL: https:\/\/jeez-semicon.com\/blog\/dicing-blade-wear-too-fast-heres-what-to-check\n     Pillar:   https:\/\/jeez-semicon.com\/blog\/diamond-dicing-blades\n     Company:  Jizhi Electronic Technology Co., Ltd.\n     Target:   ~1,800 words\n     ============================================================ -->\n\n<style>\n.jz-art{font-family:'Georgia',serif;color:#1a1a2e;line-height:1.8;font-size:16px;max-width:860px;margin:0 auto;}\n.jz-art *{box-sizing:border-box;}\n.jz-art h1{font-family:'Trebuchet MS',sans-serif;font-size:2.1rem;color:#0d2b55;margin:0 0 1.5rem;line-height:1.25;font-weight:700;}\n.jz-art h2{font-family:'Trebuchet MS',sans-serif;font-size:1.65rem;color:#0d2b55;margin:2.5rem 0 1rem;border-left:4px solid #0072ce;padding-left:14px;line-height:1.3;}\n.jz-art h3{font-family:'Trebuchet MS',sans-serif;font-size:1.2rem;color:#004a9f;margin:1.75rem 0 0.6rem;}\n.jz-art p{margin:0 0 1.25rem;}\n.jz-art ul,.jz-art ol{margin:0 0 1.25rem;padding-left:1.6rem;}\n.jz-art li{margin-bottom:.45rem;}\n.jz-art a{color:#0072ce;text-decoration:underline;text-underline-offset:3px;}\n.jz-art a:hover{color:#004a9f;}\n.jz-art hr{border:none;border-top:2px solid #dde8f5;margin:2.5rem 0;}\n.jz-toc{background:#f0f6ff;border:1px solid #bdd4f0;border-radius:8px;padding:1.4rem 1.8rem;margin:1.75rem 0 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#d5e5f5;vertical-align:top;}\n.jz-tip{background:#fff8e1;border-left:4px solid #f59e0b;border-radius:0 6px 6px 0;padding:.9rem 1.2rem;margin:1.5rem 0;font-size:.94rem;}\n.jz-tip strong{color:#92400e;}\n.jz-note{background:#e8f5e9;border-left:4px solid #22c55e;border-radius:0 6px 6px 0;padding:.9rem 1.2rem;margin:1.5rem 0;font-size:.94rem;}\n.jz-note strong{color:#166534;}\n.jz-warning{background:#fff1f2;border-left:4px solid #ef4444;border-radius:0 6px 6px 0;padding:.9rem 1.2rem;margin:1.5rem 0;font-size:.94rem;}\n.jz-warning strong{color:#991b1b;}\n.jz-cta{background:linear-gradient(135deg,#003d82,#0072ce);border-radius:10px;padding:1.8rem 2rem;margin:2.5rem 0;text-align:center;color:#fff;}\n.jz-cta h3{color:#fff;margin:0 0 .5rem;font-size:1.25rem;font-family:'Trebuchet MS',sans-serif;}\n.jz-cta p{color:#d4e8ff;margin:0 0 1.1rem;font-size:.97rem;}\n.jz-cta a.jz-btn{display:inline-block;background:#fff;color:#003d82;font-family:'Trebuchet MS',sans-serif;font-weight:700;font-size:.93rem;padding:.65rem 1.6rem;border-radius:50px;text-decoration:none;margin:.25rem .35rem;}\n.jz-cta a.jz-btn:hover{background:#e0edff;}\n.jz-cta a.jz-btn.outline{background:transparent;color:#fff;border:2px solid rgba(255,255,255,.7);}\n.jz-faq-item{border:1px solid #d0e4f5;border-radius:8px;margin-bottom:.85rem;overflow:hidden;}\n.jz-faq-q{background:#f0f7ff;padding:.85rem 1.15rem;font-family:'Trebuchet MS',sans-serif;font-weight:600;font-size:.95rem;color:#0d2b55;}\n.jz-faq-a{padding:.8rem 1.15rem;font-size:.92rem;color:#374151;line-height:1.7;}\n.jz-back{font-size:.88rem;margin:0 0 1.75rem;color:#6b7280;}\n.jz-back a{color:#0072ce;}\n@media(max-width:600px){\n  .jz-art h1{font-size:1.6rem;}\n  .jz-art h2{font-size:1.3rem;}\n  .jz-intro-box,.jz-cta{padding:1.2rem 1.1rem;}\n}\n<\/style>\n\n<div class=\"jz-art\">\n\n<p class=\"jz-back\">\u2190 Retour \u00e0 : <a href=\"https:\/\/jeez-semicon.com\/fr\/blog\/diamond-dicing-blades\/\" target=\"_blank\">Disques \u00e0 d\u00e9couper en diamant : Le guide complet<\/a><\/p>\n\n\n<div class=\"jz-intro-box\">\n  <p>When a dicing blade wears out in half the expected service life, the instinct is often to blame the blade supplier. In practice, premature blade wear is almost always a process or application issue \u2014 the blade is being asked to do something outside its design envelope. This guide walks through the eight most common causes of abnormally fast blade wear and provides a systematic checklist for diagnosing each one.<\/p>\n<\/div>\n\n<nav class=\"jz-toc\">\n  <div class=\"jz-toc-title\">\ud83d\udccb Table des mati\u00e8res<\/div>\n  <ol>\n    <li><a href=\"#define-baseline\">First: Establish Your Wear Baseline<\/a><\/li>\n    <li><a href=\"#cause1\">Cause 1 \u2014 Bond Too Soft for the Material<\/a><\/li>\n    <li><a href=\"#cause2\">Cause 2 \u2014 Incorrect or Insufficient Diamond Concentration<\/a><\/li>\n    <li><a href=\"#cause3\">Cause 3 \u2014 Feed Rate Too High<\/a><\/li>\n    <li><a href=\"#cause4\">Cause 4 \u2014 Over-Dressing<\/a><\/li>\n    <li><a href=\"#cause5\">Cause 5 \u2014 Coolant Problems<\/a><\/li>\n    <li><a href=\"#cause6\">Cause 6 \u2014 Wrong Grit Size for the Application<\/a><\/li>\n    <li><a href=\"#cause7\">Cause 7 \u2014 Abrasive Contamination in the Kerf<\/a><\/li>\n    <li><a href=\"#cause8\">Cause 8 \u2014 Spindle Runout and Lateral Vibration<\/a><\/li>\n    <li><a href=\"#checklist\">Rapid Diagnosis Checklist<\/a><\/li>\n    <li><a href=\"#faq\">Questions fr\u00e9quemment pos\u00e9es<\/a><\/li>\n  <\/ol>\n<\/nav>\n\n\n<h2 id=\"define-baseline\">1. First: Establish Your Wear Baseline<\/h2>\n\n<p>Before diagnosing premature wear, you need a precise definition of &#8220;normal&#8221; wear for your specific blade-material-parameter combination. Blade life is expressed in <strong>linear metres of cut<\/strong> \u2014 the total length of kerf produced before the blade must be replaced. For a given substrate, blade specification, and parameter set, this number should be consistent to within \u00b120% across blade lots from the same supplier.<\/p>\n\n<p>If you do not have a documented baseline, you cannot objectively determine whether wear is &#8220;premature.&#8221; Establish one by measuring the OD of a new blade (with a micrometer or the saw&#8217;s blade measurement function), tracking metres cut to end-of-life across three consecutive blades, and recording the average OD loss at end-of-life. That data set is your baseline. Every future blade is then compared against it.<\/p>\n\n<div class=\"jz-tip\">\n  <strong>\ud83d\udca1 Useful Metric:<\/strong> Express wear rate as \u00b5m of OD loss per linear metre of cut, rather than absolute blade life. This normalises for differences in exposure setting and makes blade-to-blade comparisons meaningful. A 10 \u00b5m\/m wear rate on silicon with a resin bond blade is typical; 50 \u00b5m\/m on the same application suggests a process problem.\n<\/div>\n\n\n<h2 id=\"cause1\">Cause 1 \u2014 Bond Too Soft for the Material<\/h2>\n\n<p>The bond matrix must match the hardness of the workpiece. A bond that is too soft is eroded by the workpiece faster than the diamond grains are consumed \u2014 essentially the workpiece grinds away the blade body rather than being cut by it. This is the most common blade-specification mismatch that causes fast wear.<\/p>\n\n<p>It manifests most often when a blade qualified for a softer material (e.g., Si resin bond blade) is used on a harder substrate (glass, quartz, alumina) without re-qualification. The workpiece rapidly erodes the soft resin matrix, producing dramatic blade diameter reduction within the first few wafers.<\/p>\n\n<p><strong>Check:<\/strong> Compare the blade bond type against the recommendations in the <a href=\"https:\/\/jeez-semicon.com\/fr\/blog\/dicing-blade-material-compatibility-chart-silicon-sic-gaas-sapphire-and-more\/\" target=\"_blank\">tableau de compatibilit\u00e9 des mat\u00e9riaux<\/a>. If the bond is softer than recommended, switch to the correct bond type before investigating other causes.<\/p>\n\n\n<h2 id=\"cause2\">Cause 2 \u2014 Incorrect or Insufficient Diamond Concentration<\/h2>\n\n<p>Diamond concentration determines how many abrasive grains share the cutting load per unit volume of blade rim. At low concentration, fewer grains share the work \u2014 each grain must remove more material per pass, accelerating individual grain wear and causing them to be shed from the matrix before they have contributed their full abrasive potential.<\/p>\n\n<p>For hard materials (SiC, sapphire, alumina), high concentration (C100 or above) is essential. Using a standard-concentration blade on SiC is the single most common cause of catastrophic blade wear in compound semiconductor manufacturing. Each grain is overloaded and is shed almost immediately after exposure, consuming blade diameter at a rate 10\u201320\u00d7 above normal.<\/p>\n\n<p><strong>Check:<\/strong> Verify the blade concentration grade against the application requirement. If the supplier datasheet does not explicitly state a concentration grade, contact the supplier for confirmation.<\/p>\n\n\n<h2 id=\"cause3\">Cause 3 \u2014 Feed Rate Too High<\/h2>\n\n<p>Feed rate controls the volume of material each diamond grain must remove per revolution. At high feed rates, each grain impact is more energetic, increasing the probability of grain fracture or premature shedding. On softer bond blades, the bond matrix surrounding each grain also experiences higher stress at high feed rates, accelerating matrix erosion around the grain base and causing premature grain loss.<\/p>\n\n<p>Feed-rate-induced wear is easy to identify: wear rate increases roughly linearly with feed rate above the optimal range. A 50% increase in feed rate that produces a 50\u201360% increase in wear rate confirms feed rate as the primary driver.<\/p>\n\n<p><strong>Check:<\/strong> Reduce feed rate by 30% and measure wear rate over one full blade life. If wear rate falls proportionally, feed rate was the cause. Rebalance feed rate versus blade life cost to find the optimum operating point.<\/p>\n\n\n<h2 id=\"cause4\">Cause 4 \u2014 Over-Dressing<\/h2>\n\n<p>Dressing is necessary, but each dress pass removes blade material. If dressing frequency is higher than process conditions require \u2014 or if dress depth per pass is too aggressive \u2014 the cumulative blade material consumed in dressing can account for a significant fraction of total blade life loss.<\/p>\n\n<p>Over-dressing is particularly common in facilities where dressing is performed on a fixed time schedule rather than triggered by process data. A blade that is dressed every 10 wafers regardless of spindle load or chipping data will be over-dressed on easy cuts and under-dressed on demanding ones.<\/p>\n\n<p><strong>Check:<\/strong> Review dressing logs. Calculate the total dress passes per blade life and the estimated OD consumed in dressing versus in cutting. If dressing accounts for more than 20\u201325% of total OD loss, the dressing schedule is too aggressive. Switch to data-driven dressing triggers as described in our <a href=\"https:\/\/jeez-semicon.com\/fr\/blog\/how-to-dress-a-dicing-blade-step-by-step-tutorial\/\" target=\"_blank\">dressing tutorial<\/a>.<\/p>\n\n\n<h2 id=\"cause5\">Cause 5 \u2014 Coolant Problems<\/h2>\n\n<p>Coolant does more than cool \u2014 it lubricates and flushes. Insufficient lubrication increases friction at every grain contact point, generating more heat and greater mechanical stress on both the diamond grain and the bond matrix. Over time, this thermal and mechanical overload accelerates bond erosion and grain shedding.<\/p>\n\n<p>Three coolant failure modes cause premature wear:<\/p>\n<ul>\n  <li><strong>Insufficient flow rate:<\/strong> Heat accumulates at the cutting zone, softening the bond matrix and accelerating erosion. Verify flow rate at both nozzles with a calibrated flow meter \u2014 flow sensor readings at the pump can overstate actual delivery if nozzles are partially blocked.<\/li>\n  <li><strong>Blocked or misaligned nozzles:<\/strong> Even if total flow is correct, misdirected flow does not reach the blade\u2013workpiece interface. Inspect nozzle alignment visually with the spindle running.<\/li>\n  <li><strong>No coolant additive (plain DI water):<\/strong> DI water provides no boundary lubrication. Switching from plain DI water to a formulated <a href=\"https:\/\/jeez-semicon.com\/fr\/blog\/dicing-blade-coolant-why-water-alone-is-not-enough\/\" target=\"_blank\">coolant additive<\/a> with lubricity enhancers typically reduces wear rate by 15\u201330% on metal bond blades with no other process changes.<\/li>\n<\/ul>\n\n\n<h2 id=\"cause6\">Cause 6 \u2014 Wrong Grit Size for the Application<\/h2>\n\n<p>Finer diamond grit means more grains per unit volume of blade rim, each removing a smaller amount of material per pass. For a given feed rate, finer grit distributes the cutting load across more contact points, reducing wear per grain. However, if finer grit is used on a very hard material (SiC, sapphire), the reduced material removal rate per grain means each grain must make many more passes before the material is removed \u2014 heat accumulates, and grain fracture rate increases.<\/p>\n\n<p>Conversely, coarser grit on a soft material removes material so aggressively that the bond matrix is undermined before grains are worn \u2014 grains are shed prematurely with their abrasive potential unconsumed. Both mismatches accelerate wear rate compared to the optimal grit for the specific material.<\/p>\n\n<p><strong>Check:<\/strong> Cross-reference current grit against the material-specific grit recommendations in the <a href=\"https:\/\/jeez-semicon.com\/fr\/blog\/dicing-blade-specifications-guide-od-thickness-grit-size-and-exposure\/\" target=\"_blank\">blade specifications guide<\/a>.<\/p>\n\n\n<h2 id=\"cause7\">Cause 7 \u2014 Abrasive Contamination in the Kerf<\/h2>\n\n<p>Hard particles on the wafer surface \u2014 from upstream process steps such as grinding, CMP, or laser processing \u2014 can act as additional abrasive contacts against the blade rim as the cut progresses. If the incoming wafer surface is contaminated with SiC or Al\u2082O\u2083 particles from grinding wheel debris, these hard particles are harder than the blade bond matrix and will erode it on contact.<\/p>\n\n<p>This cause is identified by sudden onset of fast wear on a process that previously ran normally, coinciding with a change in upstream processing or wafer cleaning. Inspect incoming wafer surfaces under dark-field illumination before dicing to check for surface particle contamination.<\/p>\n\n\n<h2 id=\"cause8\">Cause 8 \u2014 Spindle Runout and Lateral Vibration<\/h2>\n\n<p>Elevated spindle runout causes the blade to oscillate laterally during cutting. Each lateral oscillation forces the blade rim against the kerf wall at an angle, generating abrasive contact between the blade&#8217;s side face and the cut material \u2014 a form of wear that is entirely separate from the intended cutting action at the blade&#8217;s bottom edge. This side-wall abrasion can contribute substantially to OD loss without producing useful cutting.<\/p>\n\n<p>Runout-driven wear is identifiable by inspecting the blade side faces for unusual wear marks or surface roughening, and by correlating elevated wear rate with elevated TIR measurements. Clean and inspect flanges; replace worn flanges; verify spindle TIR with a dial indicator.<\/p>\n\n\n<h2 id=\"checklist\">Rapid Diagnosis Checklist<\/h2>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead>\n      <tr>\n        <th>#<\/th>\n        <th>Check<\/th>\n        <th>If Yes \u2192 Action<\/th>\n      <\/tr>\n    <\/thead>\n    <tbody>\n      <tr>\n        <td>1<\/td>\n        <td>Bond type matches substrate hardness recommendation?<\/td>\n        <td>If No: switch to correct bond type first before other changes<\/td>\n      <\/tr>\n      <tr>\n        <td>2<\/td>\n        <td>Diamond concentration matches material hardness?<\/td>\n        <td>If No: upgrade to correct concentration grade<\/td>\n      <\/tr>\n      <tr>\n        <td>3<\/td>\n        <td>Feed rate within qualified process window?<\/td>\n        <td>If above window: reduce 20\u201330%; re-measure wear rate<\/td>\n      <\/tr>\n      <tr>\n        <td>4<\/td>\n        <td>Dressing frequency and depth within guidelines?<\/td>\n        <td>If excessive: switch to data-driven dressing trigger<\/td>\n      <\/tr>\n      <tr>\n        <td>5<\/td>\n        <td>Coolant flow rate at spec; nozzles clean and aligned?<\/td>\n        <td>If No: clean nozzles; verify flow; add lubricant additive<\/td>\n      <\/tr>\n      <tr>\n        <td>6<\/td>\n        <td>Grit size correct for substrate per material chart?<\/td>\n        <td>If mismatched: re-specify grit per material recommendation<\/td>\n      <\/tr>\n      <tr>\n        <td>7<\/td>\n        <td>Incoming wafer surface free of hard particle contamination?<\/td>\n        <td>If contaminated: improve upstream cleaning; inspect with dark-field<\/td>\n      <\/tr>\n      <tr>\n        <td>8<\/td>\n        <td>Spindle TIR within spec (\u22642\u20133 \u00b5m)?<\/td>\n        <td>If elevated: clean flanges; replace worn flanges; check spindle<\/td>\n      <\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<p>For context on how wear rate interacts with chipping and process quality, see the companion troubleshooting articles on <a href=\"https:\/\/jeez-semicon.com\/fr\/blog\/dicing-blade-chipping-causes-diagnosis-and-solutions\/\" target=\"_blank\">lame de coupe \u00e9br\u00e9ch\u00e9e<\/a> et <a href=\"https:\/\/jeez-semicon.com\/fr\/blog\/dicing-blade-loading-what-it-is-and-how-to-fix-it\/\" target=\"_blank\">blade loading<\/a>.<\/p>\n\n<hr>\n\n<div class=\"jz-cta\">\n  <h3>Blades Wearing Out Faster Than Expected?<\/h3>\n  <p>Jizhi Electronic Technology&#8217;s application team can review your blade specification, process parameters, and wear data to identify the root cause and recommend corrective action. Our resin bond, metal bond, and nickel bond blades are formulated for maximum life in their respective material ranges.<\/p>\n  <a href=\"https:\/\/jeez-semicon.com\/fr\/contact\/\" target=\"_blank\" class=\"jz-btn\">Request a Wear Analysis<\/a>\n  <a href=\"https:\/\/jeez-semicon.com\/fr\/semi-categories\/dicing_blade\/\" target=\"_blank\" class=\"jz-btn outline\">View Dicing Blades<\/a>\n<\/div>\n\n\n<h2 id=\"faq\">Questions fr\u00e9quemment pos\u00e9es<\/h2>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">How do I measure blade wear accurately without removing the blade?<\/div>\n  <div class=\"jz-faq-a\">Most modern dicing saws include a blade diameter measurement function \u2014 typically a laser or contact sensor that can measure the blade OD while it is mounted on the spindle. This allows non-destructive wear tracking at any point in the blade&#8217;s service life without disturbing the mounting geometry. If your saw lacks this feature, a micrometer measurement of the blade OD after removal (before reinstallation) provides equivalent data at the cost of an additional blade change cycle.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Can switching to a harder bond grade extend blade life without changing other parameters?<\/div>\n  <div class=\"jz-faq-a\">Yes, within limits. Switching to a harder bond grade within the same bond type \u2014 for example, from soft resin to medium resin \u2014 reduces the rate of bond matrix erosion and typically extends blade life. However, a harder bond grade also reduces the blade&#8217;s self-sharpening rate, which can increase chipping if the material is not abrasive enough to erode the harder bond at an adequate rate. Bond grade changes always require a chipping re-qualification on the target material, not just a blade life measurement.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Why does blade wear rate sometimes increase suddenly mid-lot rather than gradually?<\/div>\n  <div class=\"jz-faq-a\">Sudden mid-lot wear escalation usually indicates one of three causes: a blocked coolant nozzle (heat spike causes accelerated bond erosion), a hard inclusion or contamination particle on the wafer surface that mechanically overloads the blade in a single pass, or the blade reaching the end of a consistent wear phase and entering an accelerated terminal wear zone where diamond density in the rim has fallen below the minimum needed for stable self-sharpening. Spindle load current monitoring can identify the transition point in real time.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Is blade wear rate consistent from the start of a blade&#8217;s life to the end?<\/div>\n  <div class=\"jz-faq-a\">Not always. Many blades show three distinct wear phases: an initial &#8220;break-in&#8221; phase with slightly faster wear as the blade settles into its cutting geometry, a stable mid-life phase with consistent wear rate, and a terminal phase where diamond density drops below the self-sharpening threshold and wear accelerates again. The practical end-of-life trigger should be set at the onset of the terminal phase, before the accelerated wear begins producing yield-impacting chipping. Tracking OD loss per metre over the blade&#8217;s life reveals this profile and helps set the replacement trigger at the right point.<\/div>\n<\/div>\n\n<p style=\"margin-top:2rem;font-size:.9rem;color:#6b7280;\">Retourner au guide complet : <a href=\"https:\/\/jeez-semicon.com\/fr\/blog\/diamond-dicing-blades\/\" target=\"_blank\">Disques \u00e0 d\u00e9couper en diamant - Le guide complet<\/a><\/p>\n\n<\/div><!-- \/.jz-art -->","protected":false},"excerpt":{"rendered":"<p>\u2190 Back to: Diamond Dicing Blades: The Complete Guide When a dicing blade wears out in half the expected service life, the instinct is often to blame the blade supplier.  &#8230;<\/p>","protected":false},"author":1,"featured_media":1751,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-1731","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/posts\/1731","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/comments?post=1731"}],"version-history":[{"count":2,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/posts\/1731\/revisions"}],"predecessor-version":[{"id":1733,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/posts\/1731\/revisions\/1733"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/media\/1751"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/media?parent=1731"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/categories?post=1731"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/tags?post=1731"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}