{"id":829,"date":"2025-12-09T13:30:40","date_gmt":"2025-12-09T05:30:40","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=829"},"modified":"2025-12-16T11:39:57","modified_gmt":"2025-12-16T03:39:57","slug":"semiconductor-polishing-slurry-ceramic-copper-clad-substrate-dpc-polishing-slurry-dbc-grinding-fluid","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/fr\/application\/semiconductor-polishing-slurry-ceramic-copper-clad-substrate-dpc-polishing-slurry-dbc-grinding-fluid\/","title":{"rendered":"Boues de polissage pour semi-conducteurs - Substrats en c\u00e9ramique, cuivre et laiton Boues de polissage DPC \/ Fluide de pr\u00e9polissage DBC"},"content":{"rendered":"<div class=\"ds-message _63c77b1\">\n<div class=\"ds-markdown\">\n<p class=\"ds-markdown-paragraph\">Le liquide de pr\u00e9polissage des substrats en cuivre-cuivre de Gizhil Electronic \/ la suspension de polissage DPC \/ le liquide de pr\u00e9polissage DBC impliquent g\u00e9n\u00e9ralement deux processus : le polissage grossier et le polissage fin. En fonction des exigences du client en mati\u00e8re de polissage des pi\u00e8ces et de rugosit\u00e9 de surface, diff\u00e9rents fluides de pr\u00e9polissage DPC ou boues de polissage fin sont s\u00e9lectionn\u00e9s.<\/p>\n<p class=\"ds-markdown-paragraph\">Le processus de polissage grossier des substrats DPC\/DBC rev\u00eatus de cuivre c\u00e9ramique est principalement ax\u00e9 sur la r\u00e9duction rapide de l'\u00e9paisseur et l'am\u00e9lioration de l'efficacit\u00e9 du polissage. Pour les substrats DPC n\u00e9cessitant une qualit\u00e9 sup\u00e9rieure, une \u00e9tape secondaire de polissage fin est n\u00e9cessaire pour \u00e9liminer les d\u00e9fauts et imperfections de surface. Apr\u00e8s l'utilisation du fluide de pr\u00e9polissage des substrats \u00e0 rev\u00eatement en cuivre c\u00e9ramique \/ de la boue de polissage fin de Gizhil Electronic, la rugosit\u00e9 de surface (Ra) des substrats DPC\/DBC peut atteindre des valeurs inf\u00e9rieures \u00e0 0,003 \u03bcm.<\/p>\n<p class=\"ds-markdown-paragraph\">Le choix du liquide de polissage pour substrats c\u00e9ramiques cuivr\u00e9s de Gizhil Electronic \/ de la suspension de polissage DPC \/ du liquide de polissage DBC permet d'obtenir des r\u00e9sultats efficaces \u00e0 diff\u00e9rents stades du polissage grossier et fin des substrats c\u00e9ramiques. Apr\u00e8s le polissage CMP de Gizhil, la comparaison des pi\u00e8ces est la suivante :<\/p>\n<\/div>\n<\/div>\n<div class=\"ds-flex _0a3d93b\">\n<div class=\"ds-flex _965abe9 _54866f7\">\n<div class=\"db183363 ds-icon-button ds-icon-button--m ds-icon-button--sizing-container\" tabindex=\"0\" role=\"button\" aria-disabled=\"false\">\n<div class=\"ds-icon\"><img decoding=\"async\" class=\"lazyload alignnone size-full wp-image-830\" src=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/22-13.png\" data-orig-src=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/22-13.png\" alt=\"\" width=\"525\" height=\"1500\" srcset=\"data:image\/svg+xml,%3Csvg%20xmlns%3D%27http%3A%2F%2Fwww.w3.org%2F2000%2Fsvg%27%20width%3D%27525%27%20height%3D%271500%27%20viewBox%3D%270%200%20525%201500%27%3E%3Crect%20width%3D%27525%27%20height%3D%271500%27%20fill-opacity%3D%220%22%2F%3E%3C%2Fsvg%3E\" data-srcset=\"https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/22-13-105x300.png 105w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/22-13-200x571.png 200w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/22-13-358x1024.png 358w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/22-13-400x1143.png 400w, https:\/\/jeez-semicon.com\/wp-content\/uploads\/2025\/12\/22-13.png 525w\" data-sizes=\"auto\" data-orig-sizes=\"(max-width: 525px) 100vw, 525px\" \/><\/div>\n<\/div>\n<\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Gizhil Electronic&#8217;s ceramic copper-clad substrate grinding fluid \/ DPC polishing slurry \/ DBC grinding fluid typically involves two processes: coarse polishing and fine polishing. Depending on the customer&#8217;s requirements for  &#8230;<\/p>","protected":false},"author":1,"featured_media":989,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[8],"tags":[],"class_list":["post-829","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-application"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/posts\/829","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/comments?post=829"}],"version-history":[{"count":1,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/posts\/829\/revisions"}],"predecessor-version":[{"id":832,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/posts\/829\/revisions\/832"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/media\/989"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/media?parent=829"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/categories?post=829"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/tags?post=829"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}