{"id":1885,"date":"2026-04-22T11:10:53","date_gmt":"2026-04-22T03:10:53","guid":{"rendered":"https:\/\/jeez-semicon.com\/?post_type=semiconductor&p=1885"},"modified":"2026-04-22T13:50:09","modified_gmt":"2026-04-22T05:50:09","slug":"silicon-carbide-substrate-grinding-slurry","status":"publish","type":"semiconductor","link":"https:\/\/jeez-semicon.com\/fr\/semiconductor\/silicon-carbide-substrate-grinding-slurry\/","title":{"rendered":"Silicon Carbide Substrate Grinding Slurry"},"content":{"rendered":"

Cat\u00e9gorie de produits<\/strong><\/h2>\n\n\n\n

JIZHI Electronics \u2013 Silicon Carbide Grinding \/ Semiconductor Wafer Polishing<\/p>\n\n\n\n

Caract\u00e9ristiques du produit<\/strong><\/h2>\n\n\n\n

JIZHI Electronics provides two-stage polishing process solutions for silicon carbide (SiC), combining different models of grinding slurries and polishing pads (rough grinding pad \/ fine grinding pad \/ rough polishing pad \/ fine polishing pad). This approach improves the surface quality of SiC substrates during grinding while significantly increasing the material removal rate.<\/p>\n\n\n\n

Process and Applications<\/strong><\/h2>\n\n\n\n

Suitable for DMP and CMP processes of SiC substrates, effectively improving efficiency and yield. SiC grinding slurries and polishing pads enable domestic substitution for imported products.<\/p>\n\n\n\n

Brief Overview of the Silicon Carbide Substrate Processing Flow<\/strong><\/h2>\n\n\n\n
\"\"<\/figure>\n\n\n\n

Silicon Carbide (SiC) Grinding Process \u2013 Rough Grinding \/ Fine Grinding<\/strong><\/h2>\n\n\n\n

Step1<\/strong>
JIZHI Electronics Silicon Carbide (SiC) Rough Grinding Process<\/p>\n\n\n\n

\n
\n\n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n
SiC Double-Sided Rough Grinding Process<\/th>\n <\/tr>\n <\/thead>\n
Verification Equipment<\/td>\n double-sided36B<\/td>\n <\/tr>\n
Wafer<\/td>\n 6″SiC<\/td>\n <\/tr>\n
Boues de polissage<\/td>\n JZ-8003<\/td>\n <\/tr>\n
Tampon de polissage<\/td>\n JZ-1020<\/td>\n <\/tr>\n
Pressure<\/td>\n 3 psi<\/td>\n <\/tr>\n
Upper Platen Rotation Speed<\/td>\n 25 rpm<\/td>\n <\/tr>\n
Lower Platen Rotation Speed<\/td>\n 10 rpm<\/td>\n <\/tr>\n
Slurry Flow Rate<\/td>\n 5L \/min<\/td>\n <\/tr>\n
Polishing Rate<\/td>\n 25-30um\/H<\/td>\n <\/tr>\n
Surface Roughness<\/td>\n 1.22nm<\/td>\n <\/tr>\n
TTV (Total Thickness Variation)<\/td>\n <2<\/td>\n <\/tr>\n
Warp<\/td>\n <30<\/td>\n <\/tr>\n
Bow<\/td>\n <10<\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n<\/div>\n\n\n\n
\n
\"\"<\/figure>\n<\/div>\n\n
\n
\"\"<\/figure>\n<\/div><\/div>\n\n\n\n
\n\n \n \n \n \n \n \n \n \n \n
\n Rough Grinding \u00b7 Used with Lapping Pad\n <\/th>\n <\/tr>\n
\n Lapping Pad Dimensions and Specifications\n <\/th>\n <\/tr>\n <\/thead>\n\n
Model<\/td>\n JZ-1020<\/td>\n <\/tr>\n
\u00c9paisseur<\/td>\n 1.4 mm<\/td>\n <\/tr>\n
Groove Pattern<\/td>\n Personnalisable<\/td>\n <\/tr>\n
Duret\u00e9<\/td>\n Shore A 85\u00b0<\/td>\n <\/tr>\n
Taux de compression<\/td>\n 2.92<\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n\n\n\n
\"\"<\/figure>\n<\/div>\n<\/div>\n\n\n\n

Step2<\/strong>
JIZHI Electronics Silicon Carbide (SiC) Fine Grinding Process<\/p>\n\n\n\n

\n
\n\n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n
SiC Double-Sided Rough Grinding Process<\/th>\n <\/tr>\n <\/thead>\n
Verification Equipment<\/td>\n double-sided36B<\/td>\n <\/tr>\n
Wafer<\/td>\n 6″SiC<\/td>\n <\/tr>\n
Boues de polissage<\/td>\n JZ-8001<\/td>\n <\/tr>\n
Tampon de polissage<\/td>\n JZ-1020<\/td>\n <\/tr>\n
Pressure<\/td>\n 3 psi<\/td>\n <\/tr>\n
Upper Platen Rotation Speed<\/td>\n 25 rpm<\/td>\n <\/tr>\n
Lower Platen Rotation Speed<\/td>\n 10 rpm<\/td>\n <\/tr>\n
Slurry Flow Rate<\/td>\n 5L \/min<\/td>\n <\/tr>\n
Polishing Rate<\/td>\n 6.8um\/H<\/td>\n <\/tr>\n
Surface Roughness<\/td>\n 0.45nm<\/td>\n <\/tr>\n
TTV (Total Thickness Variation)<\/td>\n <2<\/td>\n <\/tr>\n
Warp<\/td>\n <30<\/td>\n <\/tr>\n
Bow<\/td>\n <20<\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n<\/div>\n\n\n\n
\n
\"\"<\/figure>\n<\/div>\n\n
\n
\"\"<\/figure>\n<\/div><\/div>\n\n\n\n
\n\n \n \n \n \n \n \n \n \n \n
\n ine Grinding \u00b7 Used with Lapping Pad\n <\/th>\n <\/tr>\n
\n Lapping Pad Dimensions and Specifications\n <\/th>\n <\/tr>\n <\/thead>\n\n
Model<\/td>\n JZ-1020<\/td>\n <\/tr>\n
\u00c9paisseur<\/td>\n 1.4 mm<\/td>\n <\/tr>\n
Groove Pattern<\/td>\n Personnalisable<\/td>\n <\/tr>\n
Duret\u00e9<\/td>\n Shore A 85\u00b0<\/td>\n <\/tr>\n
Taux de compression<\/td>\n 2.92<\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n\n\n\n
\"\"<\/figure>\n<\/div>\n<\/div>\n\n\n\n

JIZHI Electronics\u2019 CMP rough and fine grinding process for SiC substrates<\/strong><\/h2>\n\n\n\n

Tip 1 \u2013 Using rough grinding slurry with a lapping pad, Ra can reach 1.22 nm or lower.
Tip 2 \u2013 Using fine grinding slurry with a lapping pad, Ra can reach 0.45 nm or lower.<\/p>\n\n\n\n

Recommended Products and Parameters for Silicon Carbide Grinding \/ Polishing Processes<\/strong><\/h2>\n\n\n\n\n \n \n \n \n \n \n
\n Processing Method\n <\/th>\n \n Recommended Products\n <\/th>\n \n Removal Rate\n <\/th>\n \n Surface Quality\n <\/th>\n <\/tr>\n \n \n
<\/th>\n \n Boues de polissage\n <\/th>\n \n Tampon de polissage\n <\/th>\n <\/tr>\n \n \n
\n Final Polishing\n <\/td>\n Grinding \/ Lapping<\/td>\n JZ-8003<\/td>\n JZ-1020<\/td>\n 25-30um\/H<\/td>\n 1.22nm<\/td>\n <\/tr>\n \n \n
Final Polishing<\/td>\n JZ-8001<\/td>\n JZ-1020<\/td>\n 6.8um\/H<\/td>\n 0.45nm<\/td>\n <\/tr>\n \n <\/table>\n\n\n\n

Storage Method for JIZHI Electronics SiC Silicon Carbide Polishing Slurry<\/h2>\n\n\n\n

Stocker dans un entrep\u00f4t bien ventil\u00e9, frais et sec. Le produit doit \u00eatre stock\u00e9 \u00e0 une temp\u00e9rature comprise entre 5 et 35 \u00b0C, \u00e0 l'abri de la lumi\u00e8re directe du soleil et du gel. S'il est stock\u00e9 \u00e0 une temp\u00e9rature inf\u00e9rieure \u00e0 0 \u00b0C, une agglom\u00e9ration irr\u00e9versible peut se produire, rendant le produit inutilisable.<\/p>\n\n\n\n

Prix des liquides de polissage CMP \/ Slurry de JIZHI Electronics<\/h2>\n\n\n\n

Les boues de polissage des m\u00e9taux CMP de JIZHI Electronics sont fabriqu\u00e9es \u00e0 l'aide de technologies et d'\u00e9quipements de production avanc\u00e9s \u00e0 l'\u00e9tranger et sont formul\u00e9es avec des compositions chimiques sp\u00e9cialis\u00e9es. La qualit\u00e9 des boues de polissage de JIZHI Electronics est comparable \u00e0 celle de produits import\u00e9s similaires.<\/p>\n\n\n\n

Gr\u00e2ce \u00e0 une production locale, les boues CMP de JIZHI Electronics offrent des d\u00e9lais de livraison courts, une haute qualit\u00e9 stable et des prix comp\u00e9titifs et rentables.<\/p>\n\n\n\n

<\/p>","protected":false},"excerpt":{"rendered":"

Product Category JIZHI Electronics \u2013 Silicon Carbide Grinding \/ Semiconductor Wafer Polishing Product Features JIZHI Electronics provides two-stage polishing process solutions for silicon carbide (SiC), combining different models of grinding …<\/p>","protected":false},"featured_media":1886,"template":"","categories":[],"tags":[],"semicategories":[50],"class_list":["post-1885","semiconductor","type-semiconductor","status-publish","has-post-thumbnail","hentry","semicategories-polishing_slurry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/semiconductor\/1885","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/semiconductor"}],"about":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/types\/semiconductor"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/media\/1886"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/media?parent=1885"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/categories?post=1885"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/tags?post=1885"},{"taxonomy":"semicategories","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/semicategories?post=1885"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}