{"id":927,"date":"2025-12-15T16:29:00","date_gmt":"2025-12-15T08:29:00","guid":{"rendered":"https:\/\/jeez-semicon.com\/?post_type=semiconductor&p=927"},"modified":"2026-04-07T16:56:21","modified_gmt":"2026-04-07T08:56:21","slug":"cutting-blade","status":"publish","type":"semiconductor","link":"https:\/\/jeez-semicon.com\/fr\/semiconductor\/cutting-blade\/","title":{"rendered":"Lame \u00e0 d\u00e9couper"},"content":{"rendered":"

Pr\u00e9sentation du produit<\/strong><\/h2>\n\n\n\n

Nous proposons actuellement trois s\u00e9ries de lames de d\u00e9coupe - HD25, HS25 et E25 - adapt\u00e9es au traitement des plaquettes de semi-conducteurs, des substrats d'emballage et de divers mat\u00e9riaux durs et cassants tels que le LTCC, le PZT et le TGG. Notre \u00e9quipe a ma\u00eetris\u00e9 des technologies cl\u00e9s telles que l'\u00e9lectrod\u00e9position de pr\u00e9cision, le contr\u00f4le de la taille des particules abrasives et l'usinage ultra-pr\u00e9cis, ce qui permet \u00e0 nos lames d'atteindre un niveau de pointe sur le march\u00e9 national.<\/p>\n\n\n\n

Processus d'emballage et d'essai<\/strong><\/h2>\n\n\n\n
\n\n
\n Mise en forme des plaquettes de silicium\n <\/div>\n\n
\u279c<\/div>\n\n
\n \u00c9claircissement de la face arri\u00e8re\n <\/div>\n\n
\u279c<\/div>\n\n
\n Polissage\n <\/div>\n\n
\u279c<\/div>\n\n
\n D\u00e9coupage des plaquettes\n <\/div>\n\n
\u279c<\/div>\n\n
\n Emballage\n <\/div>\n\n
\u279c<\/div>\n\n
\n Singulation des paquets\n <\/div>\n\n
\u279c<\/div>\n\n
\n Puce\n <\/div>\n\n <\/div>\n\n\n\n

Pr\u00e9sentation du produit HD25<\/strong><\/h2>\n\n\n\n
\n
\n
\"\"<\/figure>\n<\/div><\/div>\n\n\n\n
\n

Les lames de d\u00e9coupe dures de la s\u00e9rie HD25 se caract\u00e9risent par une grande pr\u00e9cision d'usinage et un trait de scie \u00e9troit. Elles conviennent au traitement des plaquettes de silicium, des plaquettes d'oxyde et de divers compos\u00e9s tels que le carbure de silicium (SiC), l'ars\u00e9niure de gallium (GaAs) et le phosphure de gallium (GaP).<\/p>\n<\/div>\n<\/div>\n\n\n\n

Exemple de sp\u00e9cification : HD25 CB 3000N 70<\/strong><\/h2>\n\n\n\n
\n \n \n \n \n \n \n \n \n \n \n \n \n
Exposition de la lame (um)<\/th>\n Largeur de la fente (um)<\/th>\n Granulom\u00e9trie (taille des mailles)<\/th>\n Agent de liaison<\/th>\n Volume Concentration<\/th>\n <\/tr>\n <\/thead>\n
Z<\/td>\n 250-380<\/td>\n Z<\/td>\n 11-15<\/td>\n 5000<\/td>\n 2500<\/td>\n S<\/td>\n Type tranchant<\/td>\n 50<\/td>\n <\/tr>\n
A<\/td>\n 380-510<\/td>\n A<\/td>\n 16-20<\/td>\n 4800<\/td>\n 2000<\/td>\n N<\/td>\n Type \u00e0 usage g\u00e9n\u00e9ral<\/td>\n 70<\/td>\n <\/tr>\n
B<\/td>\n 510-640<\/td>\n B<\/td>\n 20-25<\/td>\n 4500<\/td>\n 1800<\/td>\n H<\/td>\n Type haute r\u00e9sistance<\/td>\n 90<\/td>\n <\/tr>\n
C<\/td>\n 640-760<\/td>\n C<\/td>\n 25-30<\/td>\n 4000<\/td>\n 1700<\/td>\n <\/td>\n <\/td>\n 110<\/td>\n <\/tr>\n
D<\/td>\n 760-890<\/td>\n D<\/td>\n 30-35<\/td>\n 3500<\/td>\n 1500<\/td>\n <\/td>\n <\/td>\n 130<\/td>\n <\/tr>\n
E<\/td>\n 890-1020<\/td>\n E<\/td>\n 35-40<\/td>\n 3000<\/td>\n 1000<\/td>\n <\/td>\n <\/td>\n <\/td>\n <\/tr>\n
F<\/td>\n 1020-1150<\/td>\n F<\/td>\n 40-50<\/td>\n <\/td>\n <\/td>\n <\/td>\n <\/td>\n <\/td>\n <\/tr>\n
G<\/td>\n 1150-1270<\/td>\n G<\/td>\n 50-60<\/td>\n <\/td>\n <\/td>\n <\/td>\n <\/td>\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n<\/div>\n\n\n\n

Pr\u00e9sentation du produit HS25<\/strong><\/h2>\n\n\n\n
\n
\n
\"\"<\/figure>\n<\/div><\/div>\n\n\n\n
\n

Les lames de d\u00e9coupe dures de la s\u00e9rie HS25 offrent une excellente r\u00e9sistance \u00e0 l'usure et une meilleure stabilit\u00e9 des ar\u00eates, ce qui permet de contr\u00f4ler efficacement les marches lat\u00e9rales sur les puces et de garantir des dimensions constantes. Elles conviennent aux substrats LED en c\u00e9ramique, aux substrats d'emballage de semi-conducteurs et aux mat\u00e9riaux durs et cassants tels que le PZT et le TGG.<\/p>\n<\/div>\n<\/div>\n\n\n\n

Exemple de sp\u00e9cification : HS25 58 \u00d74,0 \u00d70,2B 400S30S48<\/strong><\/h2>\n\n\n\n
\n \n \n \n \n \n \n \n \n \n \n \n
Diam\u00e8tre ext\u00e9rieur (mm)<\/th>\n Exposition (mm)<\/th>\n \u00c9paisseur (mm)<\/th>\n Tol\u00e9rance d'\u00e9paisseur (mm)<\/th>\n Granulom\u00e9trie (taille des mailles)<\/th>\n Agent de liaison<\/th>\n Volume Concentration<\/th>\n Nombre d'emplacements<\/th>\n <\/tr>\n <\/thead>\n
56<\/td>\n 2.0<\/td>\n 3.4<\/td>\n 0.06<\/td>\n 0.20<\/td>\n A<\/td>\n \u00b10.005<\/td>\n 1200<\/td>\n S<\/td>\n Type tranchant<\/td>\n 30<\/td>\n S16<\/td>\n 16<\/td>\n <\/tr>\n
58<\/td>\n 2.2<\/td>\n 3.6<\/td>\n 0.08<\/td>\n 0.22<\/td>\n B<\/td>\n \u00b10.010<\/td>\n 1000<\/td>\n N<\/td>\n Type \u00e0 usage g\u00e9n\u00e9ral<\/td>\n 50<\/td>\n S32<\/td>\n 32<\/td>\n <\/tr>\n
<\/td>\n 2.4<\/td>\n 3.8<\/td>\n 0.10<\/td>\n 0.24<\/td>\n C<\/td>\n \u00b10.015<\/td>\n 800<\/td>\n H<\/td>\n Type haute r\u00e9sistance<\/td>\n 70<\/td>\n S48<\/td>\n 48<\/td>\n <\/tr>\n
<\/td>\n 2.6<\/td>\n 4.0<\/td>\n 0.12<\/td>\n 0.26<\/td>\n <\/td>\n <\/td>\n 600<\/td>\n <\/td>\n <\/td>\n 90<\/td>\n <\/td>\n <\/td>\n <\/tr>\n
<\/td>\n 2.8<\/td>\n 4.2<\/td>\n 0.14<\/td>\n 0.28<\/td>\n <\/td>\n <\/td>\n 500<\/td>\n <\/td>\n <\/td>\n 110<\/td>\n <\/td>\n <\/td>\n <\/tr>\n
<\/td>\n 3.0<\/td>\n 4.4<\/td>\n 0.16<\/td>\n 0.30<\/td>\n <\/td>\n <\/td>\n 400<\/td>\n <\/td>\n <\/td>\n 130<\/td>\n <\/td>\n <\/td>\n <\/tr>\n
<\/td>\n 3.2<\/td>\n 4.6<\/td>\n 0.18<\/td>\n 0.32<\/td>\n <\/td>\n <\/td>\n 340<\/td>\n <\/td>\n <\/td>\n 150<\/td>\n <\/td>\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n<\/div>\n\n\n\n

Pr\u00e9sentation du produit ES25<\/strong><\/h2>\n\n\n\n
    \n
  • <\/li>\n<\/ul>\n\n\n\n
    \n
    \n
    \"\"<\/figure>\n<\/div><\/div>\n\n\n\n
    \n

    Les lames de d\u00e9coupe souples de la s\u00e9rie ES25 permettent des vitesses de coupe allant jusqu'\u00e0 200 mm\/s et offrent une dur\u00e9e de vie de plus de 7 000 m. Elles conviennent aux substrats de PCB, aux substrats EMC, aux substrats de LED \u00e0 puce et aux mat\u00e9riaux durs et cassants tels que le LTCC, le PZT et le TGG.<\/p>\n<\/div>\n<\/div>\n\n\n\n

    Exemple de sp\u00e9cification : E25 56 \u00d70,08B \u00d740 800H130S16<\/strong><\/h2>\n\n\n\n
    \n \n \n \n \n \n \n \n \n \n \n \n
    Diam\u00e8tre ext\u00e9rieur (mm)<\/th>\n \u00c9paisseur (mm)<\/th>\n Tol\u00e9rance d'\u00e9paisseur (mm)<\/th>\n Diam\u00e8tre int\u00e9rieur (mm)<\/th>\n Granulom\u00e9trie (taille des mailles)<\/th>\n Agent de liaison<\/th>\n Volume Concentration<\/th>\n Nombre d'emplacements<\/th>\n <\/tr>\n <\/thead>\n
    50<\/td>\n 0.02<\/td>\n P \u00b10.003<\/td>\n 40<\/td>\n 1200<\/td>\n S - Type pointu<\/td>\n 30<\/td>\n S16 (16)<\/td>\n <\/tr>\n
    52<\/td>\n 0.04<\/td>\n A \u00b10.005<\/td>\n <\/td>\n 1000<\/td>\n N - Type \u00e0 usage g\u00e9n\u00e9ral<\/td>\n 50<\/td>\n S32 (32)<\/td>\n <\/tr>\n
    54<\/td>\n 0.06<\/td>\n B \u00b10.010<\/td>\n <\/td>\n 800<\/td>\n H - Type \u00e0 haute r\u00e9sistance<\/td>\n 70<\/td>\n S48 (48)<\/td>\n <\/tr>\n
    56<\/td>\n 0.08<\/td>\n C \u00b10.015<\/td>\n <\/td>\n 600<\/td>\n <\/td>\n 90<\/td>\n <\/td>\n <\/tr>\n
    58<\/td>\n 0.10<\/td>\n <\/td>\n <\/td>\n 500<\/td>\n <\/td>\n 110<\/td>\n <\/td>\n <\/tr>\n
    59<\/td>\n 0.12<\/td>\n <\/td>\n <\/td>\n 400<\/td>\n <\/td>\n 130<\/td>\n <\/td>\n <\/tr>\n
    <\/td>\n 0.14<\/td>\n <\/td>\n <\/td>\n 340<\/td>\n <\/td>\n 150<\/td>\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n<\/div>\n\n\n\n

    Avantages-1<\/strong><\/h2>\n\n\n\n
    \n
    \n
    \"\"<\/figure>\n<\/div><\/div>\n\n\n\n
    \n

    Une distribution extr\u00eamement \u00e9troite de la taille des particules de la micropoudre de diamant et une morphologie cristalline tr\u00e8s uniforme et soigneusement contr\u00f4l\u00e9e sont adopt\u00e9es pour garantir une excellente qualit\u00e9 d'usinage.<\/p>\n<\/div>\n<\/div>\n\n\n\n

    Avantages-2<\/strong><\/h2>\n\n\n\n
    \n
    \n
    \"\"<\/figure>\n<\/div><\/div>\n\n\n\n
    \n

    Le contr\u00f4le s\u00e9rialis\u00e9 et gradu\u00e9 avec pr\u00e9cision de la concentration de diamants assure un \u00e9quilibre optimal entre la qualit\u00e9 de l'usinage (en particulier la r\u00e9duction de l'\u00e9caillage de la face arri\u00e8re) et la dur\u00e9e de vie de l'outil.<\/p>\n<\/div>\n<\/div>\n\n\n\n

    Avantages-3<\/strong><\/h2>\n\n\n\n
    \n
    \n
    \"\"<\/figure>\n<\/div><\/div>\n\n\n\n
    \n

    La tr\u00e8s grande pr\u00e9cision de fabrication du moyeu et du bord de la lame r\u00e9duit le temps de pr\u00e9-d\u00e9coupage et minimise les vibrations de la lame \u00e0 des vitesses de rotation \u00e9lev\u00e9es.<\/p>\n<\/div>\n<\/div>\n\n\n\n

    Avantages-4<\/strong><\/h2>\n\n\n\n
    \n
    \n
    \"\"<\/figure>\n<\/div><\/div>\n\n\n\n
    \n

    Le tranchant de la lame offre une excellente r\u00e9sistance \u00e0 la corrosion, ce qui le rend adapt\u00e9 aux environnements de coupe au CO\u2082 et prolonge la dur\u00e9e de vie globale de la lame.<\/p>\n<\/div>\n<\/div>\n\n\n\n

    Avantages-5<\/strong><\/h2>\n\n\n\n
    \n
    \n
    \"\"<\/figure>\n<\/div><\/div>\n\n\n\n
    \n

    Largeur de coupe extr\u00eamement \u00e9troite, jusqu'\u00e0 10 \u00b5m, r\u00e9pondant aux exigences de d\u00e9coupage des plaquettes \u00e9troites telles que les LED GaAs.<\/p>\n<\/div>\n<\/div>\n\n\n\n

    Avantages-6<\/strong><\/h2>\n\n\n\n
    \n
    \n
    \"\"<\/figure>\n<\/div><\/div>\n\n\n\n
    \n

    La lame pr\u00e9sente une r\u00e9sistance des ar\u00eates extr\u00eamement \u00e9lev\u00e9e, emp\u00eachant la coupe en serpentin \u00e0 des vitesses de broche \u00e9lev\u00e9es et maintenant une excellente verticalit\u00e9 des flancs sur les copeaux.<\/p>\n<\/div>\n<\/div>\n\n\n\n

    Engagement de service<\/strong><\/h2>\n\n\n\n
      \n
    • - Pour les commandes jusqu'\u00e0 500 lames, la livraison se fait dans les 7 jours ouvrables.<\/li>\n\n\n\n
    • - Aider les clients \u00e0 s\u00e9lectionner les lames et \u00e0 mettre au point de nouveaux proc\u00e9d\u00e9s de d\u00e9coupe.<\/li>\n\n\n\n
    • - Fournir des \u00e9chantillons d'essai gratuits.<\/li>\n\n\n\n
    • - R\u00e9ponse rapide du service dans les 8 heures ; assistance sur place dans les 48 heures.<\/li>\n\n\n\n
    • - \u00c9changes techniques et visites de suivi r\u00e9guli\u00e8res.<\/li>\n\n\n\n
    • - Fournir des rapports 8D pour tout probl\u00e8me li\u00e9 \u00e0 la qualit\u00e9.<\/li>\n<\/ul>\n\n\n\n

      <\/p>","protected":false},"excerpt":{"rendered":"

      Product Introduction We currently offer three series of dicing blades\u2014HD25, HS25, and E25\u2014suitable for processing semiconductor wafers, packaging substrates, and various hard and brittle materials such as LTCC, PZT, and …<\/p>","protected":false},"featured_media":938,"template":"","categories":[],"tags":[],"semicategories":[48],"class_list":["post-927","semiconductor","type-semiconductor","status-publish","has-post-thumbnail","hentry","semicategories-dicing_blade"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/semiconductor\/927","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/semiconductor"}],"about":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/types\/semiconductor"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/media\/938"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/media?parent=927"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/categories?post=927"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/tags?post=927"},{"taxonomy":"semicategories","embeddable":true,"href":"https:\/\/jeez-semicon.com\/fr\/wp-json\/wp\/v2\/semicategories?post=927"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}