What is the core difference between a CMP finishing pad and rough/intermediate polishing pads? How should they be selected?

CMP finishing pads (Final Pads) are specifically designed for ultra-precise surface finishing . Their key characteristics include: Finer surface structure : Porosity < 10% with higher groove density for nanoscale material removal control (< 50 nm/min) Optimized elastic modulus (typically < 500 MPa): Buffers pressure through flexible contact to avoid surface damage Enhanced chemical compatibility : Surface-treated for alkaline/oxidative slurries Selection Guide : Rough polishing stage : Use high-hardness pads (> 1 GPa) for rapid removal Finishing stage : Must use finishing pads to ensure surface roughness Ra < 0.5 nm Jizhi Electronics offers complete pad portfolio solutions with intelligent process parameter matching.

CMPフィニッシングパッドと粗・中間研磨パッドの決定的な違いは何ですか？どのように選択すべきですか？

公開日: 2025年12月12日ビュー212

CMP finishing pads (Final Pads) are specifically designed for ultra-precise surface finishing. Their key characteristics include:

Finer surface structure: Porosity < 10% with higher groove density for nanoscale material removal control (< 50 nm/min)
Optimized elastic modulus (typically < 500 MPa): Buffers pressure through flexible contact to avoid surface damage
Enhanced chemical compatibility: Surface-treated for alkaline/oxidative slurries
Selection Guide:
Rough polishing stage: Use high-hardness pads (> 1 GPa) for rapid removal
Finishing stage: Must use finishing pads to ensure surface roughness Ra < 0.5 nm
Jizhi Electronics offers complete pad portfolio solutions with intelligent process parameter matching.