{"id":1649,"date":"2026-03-13T09:16:16","date_gmt":"2026-03-13T01:16:16","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=1649"},"modified":"2026-03-13T09:53:24","modified_gmt":"2026-03-13T01:53:24","slug":"fr-4-vs-g-10-fiberglass-polishing-templates-material-properties-selection-guide","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/ja\/blog\/fr-4-vs-g-10-fiberglass-polishing-templates-material-properties-selection-guide\/","title":{"rendered":"FR-4\u3068G-10\u30ac\u30e9\u30b9\u7e4a\u7dad\u7814\u78e8\u30c6\u30f3\u30d7\u30ec\u30fc\u30c8\u306e\u6bd4\u8f03\uff1a\u6750\u6599\u7279\u6027\u3068\u9078\u629e\u30ac\u30a4\u30c9"},"content":{"rendered":"<!DOCTYPE html>\n<html lang=\"en\">\n<head>\n<meta charset=\"UTF-8\" \/>\n<meta name=\"viewport\" content=\"width=device-width, initial-scale=1.0\" \/>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\n     SEO META TAGS\n     \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n\n<meta name=\"description\" content=\"Detailed comparison of FR-4 and G-10 fiberglass polishing template materials for semiconductor wafer processing. Covers chemical resistance, dimensional stability, pH compatibility, edge treatment, and CXT alternatives for SiC.\" \/>\n<meta name=\"keywords\" content=\"FR4 polishing template, G10 polishing template, FR-4 vs G-10 wafer polishing, fiberglass polishing template material, semiconductor polishing template material selection, G10 fiberglass carrier plate, FR4 carrier plate semiconductor, CXT polishing template material\" \/>\n<link rel=\"canonical\" href=\"https:\/\/jeez-semicon.com\/blog\/FR-4-vs-G-10-Fiberglass-Polishing-Templates-Material-Properties-Selection-Guide\" \/>\n\n<!-- Open Graph -->\n<meta property=\"og:title\" content=\"FR-4 vs G-10 Fiberglass Polishing Templates: Material Properties &#038; Selection Guide\" \/>\n<meta property=\"og:description\" content=\"Which fiberglass material is right for your polishing template? A rigorous engineering comparison of FR-4, G-10, and CXT-grade materials across chemical resistance, dimensional stability, and semiconductor application fit.\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:url\" content=\"https:\/\/jeez-semicon.com\/blog\/FR-4-vs-G-10-Fiberglass-Polishing-Templates-Material-Properties-Selection-Guide\" \/>\n\n<!-- Schema -->\n<script type=\"application\/ld+json\">\n{\n  \"@context\": \"https:\/\/schema.org\",\n  \"@graph\": [\n    {\n      \"@type\": \"Article\",\n      \"headline\": \"FR-4 vs G-10 Fiberglass Polishing Templates: Material Properties & Selection Guide\",\n      \"description\": \"Engineering comparison of FR-4, G-10, and CXT-grade fiberglass materials for semiconductor polishing template carrier plates, covering chemical resistance, dimensional stability, pH compatibility, machining considerations, and substrate-specific selection guidance.\",\n      \"author\": {\n        \"@type\": \"Organization\",\n        \"name\": \"Jizhi Electronic Technology Co., Ltd.\",\n        \"url\": \"https:\/\/jeez-semicon.com\"\n      },\n      \"publisher\": {\n        \"@type\": \"Organization\",\n        \"name\": \"Jizhi Electronic Technology Co., Ltd.\",\n        \"url\": \"https:\/\/jeez-semicon.com\"\n      },\n      \"mainEntityOfPage\": {\n        \"@type\": \"WebPage\",\n        \"@id\": \"https:\/\/jeez-semicon.com\/blog\/FR-4-vs-G-10-Fiberglass-Polishing-Templates-Material-Properties-Selection-Guide\"\n      }\n    },\n    {\n      \"@type\": \"FAQPage\",\n      \"mainEntity\": [\n        {\n          \"@type\": \"Question\",\n          \"name\": \"What is the difference between FR-4 and G-10 in polishing templates?\",\n          \"acceptedAnswer\": {\n            \"@type\": \"Answer\",\n            \"text\": \"FR-4 and G-10 are both woven glass fabric \/ epoxy laminate composites with nearly identical mechanical and dimensional properties. The key difference is that FR-4 contains a halogenated (brominated) flame retardant additive in the epoxy matrix, while G-10 does not. In polishing template applications, this makes G-10 marginally more resistant to mildly acidic slurry environments (pH 5\u20137), because the halogenated epoxy in FR-4 is slightly more susceptible to acid-induced swelling. For standard alkaline silicon polishing slurries (pH 8\u201312), the performance difference is negligible and FR-4 is the standard choice due to its lower cost.\"\n          }\n        },\n        {\n          \"@type\": \"Question\",\n          \"name\": \"Can FR-4 polishing templates be used with SiC CMP slurries?\",\n          \"acceptedAnswer\": {\n            \"@type\": \"Answer\",\n            \"text\": \"No. SiC CMP typically uses KMnO\u2084-based or H\u2082O\u2082-based oxidant slurries at pH 2\u20134, which are chemically incompatible with FR-4 and G-10 epoxy matrices. These conditions cause progressive delamination of the laminate layers, dimensional swelling, and contamination of the slurry with carrier plate material. CXT-grade chemically resistant templates with seamless single-shell construction are required for SiC CMP applications.\"\n          }\n        },\n        {\n          \"@type\": \"Question\",\n          \"name\": \"Why do FR-4 and G-10 polishing templates need edge sealing?\",\n          \"acceptedAnswer\": {\n            \"@type\": \"Answer\",\n            \"text\": \"Both FR-4 and G-10 are woven glass fabric laminates. When these materials are machined (milled or drilled to create work holes and outer profile), the cut exposes the ends of glass fiber bundles at the machined surface. These fiber ends can fray and shed sub-micron glass particles into the polishing environment during use, causing wafer scratch defects. Edge sealing \u2014 a CNC finish-milling operation followed by edge coating or epoxy sealing \u2014 encapsulates the exposed fiber ends and prevents shedding.\"\n          }\n        },\n        {\n          \"@type\": \"Question\",\n          \"name\": \"What is CXT-grade polishing template material?\",\n          \"acceptedAnswer\": {\n            \"@type\": \"Answer\",\n            \"text\": \"CXT-grade is a chemically resistant polishing template material using a seamless single-shell construction rather than the laminate layer approach of FR-4 and G-10. The matrix resin is selected for resistance across the full pH range (2\u201313), including oxidant chemistries such as KMnO\u2084. Because CXT templates have no laminate interface, there is no delamination failure mode and no fiber-shedding risk at machined edges. CXT-grade templates are the standard choice for SiC CMP and other aggressive slurry applications.\"\n          }\n        }\n      ]\n    }\n  ]\n}\n<\/script>\n\n<style>\n  @import url('https:\/\/fonts.googleapis.com\/css2?family=DM+Serif+Display:ital@0;1&family=DM+Sans:opsz,wght@9..40,300;9..40,400;9..40,500;9..40,600&family=JetBrains+Mono:wght@400;500&display=swap');\n\n  :root {\n    --navy:      #0a1628;\n    --navy-mid:  #112240;\n    --blue:      #1a56db;\n    --blue-lite: #3b82f6;\n    --cyan:      #06b6d4;\n    --slate:     #334155;\n    --muted:     #64748b;\n    --border:    #e2e8f0;\n    --bg:        #f8fafc;\n    --white:     #ffffff;\n    --accent:    #f59e0b;\n    --green:     #10b981;\n    --teal:      #0f766e;\n    --red:       #ef4444;\n    --orange:    #ea580c;\n    --radius:    10px;\n    --shadow:    0 4px 24px rgba(10,22,40,.08);\n    --shadow-lg: 0 12px 48px rgba(10,22,40,.14);\n  }\n\n  *, *::before, *::after { box-sizing: border-box; margin: 0; padding: 0; }\n  body {\n    font-family: 'DM Sans', sans-serif;\n    font-size: 16px; 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}\n  }\n\n  \/* \u2500\u2500 Inline link pill \u2500\u2500 *\/\n  .text-link-pill {\n    display: inline-flex; align-items: center; gap: 5px;\n    background: #eff6ff; border: 1px solid #bfdbfe;\n    color: var(--blue); text-decoration: none;\n    font-size: 14px; font-weight: 500;\n    padding: 3px 10px; border-radius: 20px;\n    transition: background .15s; white-space: nowrap;\n  }\n  .text-link-pill:hover { background: #dbeafe; color: var(--navy); }\n  .text-link-pill::after { content: '\u2197'; font-size: 10px; }\n\n  \/* \u2500\u2500 Related articles \u2500\u2500 *\/\n  .related-box {\n    background: linear-gradient(135deg, var(--navy) 0%, var(--navy-mid) 100%);\n    border-radius: var(--radius); padding: 28px 32px; margin: 44px 0; color: var(--white);\n  }\n  .related-box h3 {\n    font-family: 'DM Sans', sans-serif; font-size: 13px; font-weight: 600;\n    letter-spacing: .1em; text-transform: uppercase; color: var(--cyan); margin: 0 0 14px;\n  }\n  .related-box p { color: rgba(255,255,255,.65); 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max-width: 520px; margin: 0 auto 28px; }\n  .cta-btn {\n    display: inline-flex; align-items: center; gap: 8px;\n    background: var(--cyan); color: var(--navy); text-decoration: none;\n    font-weight: 600; font-size: 15px; padding: 14px 32px; border-radius: 8px;\n    transition: opacity .2s, transform .15s;\n  }\n  .cta-btn:hover { opacity: .9; transform: translateY(-1px); color: var(--navy); }\n\n  \/* \u2500\u2500 Back to pillar \u2500\u2500 *\/\n  .back-to-pillar {\n    display: inline-flex; align-items: center; gap: 8px;\n    background: var(--bg); border: 1px solid var(--border);\n    color: var(--slate); text-decoration: none;\n    font-size: 13.5px; font-weight: 500; padding: 10px 18px; border-radius: 8px;\n    margin: 40px 0 0; transition: border-color .2s, color .2s;\n  }\n  .back-to-pillar::before { content: '\u2190'; color: var(--blue); }\n  .back-to-pillar:hover { border-color: var(--blue); color: var(--blue); }\n<\/style>\n<\/head>\n<body>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 HERO \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<div class=\"hero\">\n  <div class=\"hero-eyebrow\">Material Engineering Guide<\/div>\n\n  <p class=\"hero-sub\">Two materials. Nearly identical names. Genuinely different performance envelopes. This guide explains exactly when each is the right choice \u2014 and when neither is sufficient.<\/p>\n  <p class=\"hero-meta\">\n    <span>Jizhi Electronic Technology Co, Ltd.\u306b\u3088\u308b\u3002.<\/span>\n    <span>\u00b7<\/span>\n    <span>\u534a\u5c0e\u4f53\u7814\u78e8\u306e\u30b9\u30da\u30b7\u30e3\u30ea\u30b9\u30c8<\/span>\n    <span>\u00b7<\/span>\n    <span>12 min read<\/span>\n  <\/p>\n<\/div>\n\n<div class=\"page-wrap\">\n\n  <!-- Breadcrumb -->\n  <nav class=\"breadcrumb\" aria-label=\"Breadcrumb\">\n    <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/Polishing-Templates-for-Semiconductor-Silicon-Wafer-Processing\/\" target=\"_blank\">\u2190 Polishing Templates: Complete Guide<\/a>\n    <span>\/<\/span>\n    FR-4 vs G-10 \u7d20\u6750\u30ac\u30a4\u30c9\n  <\/nav>\n\n  <!-- TOC -->\n  <nav class=\"toc-box\" aria-label=\"\u76ee\u6b21\">\n    <h2>\u76ee\u6b21<\/h2>\n    <ol class=\"toc-list\">\n      <li><a href=\"#what-are-they\">What FR-4 and G-10 Actually Are<\/a><\/li>\n      <li><a href=\"#the-one-difference\">The One Real Difference Between Them<\/a><\/li>\n      <li><a href=\"#material-properties\">Full Material Property Comparison<\/a><\/li>\n      <li><a href=\"#ph-compatibility\">pH &amp; Chemical Compatibility<\/a><\/li>\n      <li><a href=\"#failure-modes\">How Each Material Fails in Service<\/a><\/li>\n      <li><a href=\"#edge-treatment\">Edge Treatment: Why It Matters More Than Grade<\/a><\/li>\n      <li><a href=\"#machining\">Machining &amp; Fabrication Considerations<\/a><\/li>\n      <li><a href=\"#cxt\">When Neither FR-4 Nor G-10 Is Sufficient: CXT Grade<\/a><\/li>\n      <li><a href=\"#selection-matrix\">Material Selection Matrix by Application<\/a><\/li>\n      <li><a href=\"#common-mistakes\">Common Material Selection Mistakes<\/a><\/li>\n      <li><a href=\"#faq\">\u3088\u304f\u3042\u308b\u8cea\u554f<\/a><\/li>\n    <\/ol>\n  <\/nav>\n\n  <!-- \u2550\u2550\u2550 SECTION 1 \u2550\u2550\u2550 -->\n  <h2 id=\"what-are-they\">What FR-4 and G-10 Actually Are<\/h2>\n\n  <p>FR-4 and G-10 are both members of the NEMA (National Electrical Manufacturers Association) LI-series of industrial laminate materials \u2014 composite sheets built from woven E-glass fabric impregnated with an epoxy resin system and cured under heat and pressure into rigid, dimensionally stable laminates. They have been manufactured to standardized specifications since the 1950s, originally for printed circuit board substrates, and their consistent dimensional and mechanical properties have made them the default carrier plate material in semiconductor polishing templates worldwide.<\/p>\n\n  <p>The naming convention is straightforward in principle: the letters describe the flame retardancy class, and the number describes the base fabric and resin system. G-10 is the base specification: woven E-glass \/ general-purpose epoxy, with no flame retardant requirement. FR-4 is the flame-retardant version of G-10, manufactured with halogenated (brominated) epoxy to achieve a UL 94 V-0 flammability rating. In all mechanical and dimensional respects, they are essentially identical. The difference is in the resin chemistry \u2014 specifically, what has been added to the epoxy to make it flame retardant.<\/p>\n\n  <p>Understanding this distinction matters for polishing template material selection because the flame retardant additive \u2014 tetrabromobisphenol A (TBBPA) in most FR-4 formulations \u2014 affects the epoxy matrix&#8217;s response to acidic chemical environments in ways that are meaningful for slurry-contact applications, even though they are irrelevant for the original circuit board application context for which both materials were designed.<\/p>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 2 \u2550\u2550\u2550 -->\n  <h2 id=\"the-one-difference\">The One Real Difference Between FR-4 and G-10<\/h2>\n\n  <p>With all the technical language around laminate grades, the practical difference between FR-4 and G-10 in polishing template applications reduces to a single sentence: <strong>G-10 tolerates mildly acidic polishing environments (pH 5\u20137) somewhat better than FR-4, because its epoxy matrix does not contain the brominated flame retardant that makes FR-4 more susceptible to acid-induced swelling.<\/strong><\/p>\n\n  <p>The mechanism is as follows. In an acidic aqueous environment, the ester linkages in epoxy resins are susceptible to hydrolytic degradation \u2014 the acid catalyzes ester bond cleavage, causing gradual absorption of water into the resin matrix and progressive dimensional swelling. In FR-4, the TBBPA flame retardant is chemically bonded into the epoxy backbone; the presence of the halogen substituents makes the resin&#8217;s ester groups slightly more electrophilic and therefore more susceptible to acid-catalyzed hydrolysis. G-10&#8217;s epoxy, without the halogenated additive, is marginally more resistant to this mechanism.<\/p>\n\n  <p>In practice, this difference manifests as a longer service life for G-10 templates in pH 5\u20137 slurry environments \u2014 typically 20\u201340% more polishing cycles before dimensional drift of the carrier plate exceeds the replacement threshold. For pH 8\u201312 (standard alkaline silicon polishing), both materials perform equivalently and the cost advantage of FR-4 makes it the correct default choice.<\/p>\n\n  <div class=\"material-trio\">\n    <div class=\"mat-card\">\n      <div class=\"mat-card-head fr4\">FR-4<small>NEMA Grade \u2014 Flame Retardant<\/small><\/div>\n      <div class=\"mat-card-body\">\n        <div class=\"mat-stat\"><span class=\"label\">Resin system<\/span><span class=\"value\">Brominated epoxy<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Flame rating<\/span><span class=\"value\">UL 94 V-0<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">pH range<\/span><span class=\"value\">8 - 12<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">\u76f8\u5bfe\u30b3\u30b9\u30c8<\/span><span class=\"value\">Lowest<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Best for<\/span><span class=\"value\">Si SSP (alkaline)<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Availability<\/span><span class=\"value\">Stock \/ catalog<\/span><\/div>\n      <\/div>\n    <\/div>\n    <div class=\"mat-card\">\n      <div class=\"mat-card-head g10\">G-10<small>NEMA Grade \u2014 Non-Flame Retardant<\/small><\/div>\n      <div class=\"mat-card-body\">\n        <div class=\"mat-stat\"><span class=\"label\">Resin system<\/span><span class=\"value\">Non-halogenated epoxy<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Flame rating<\/span><span class=\"value\">None (not required)<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">pH range<\/span><span class=\"value\">5 - 12<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">\u76f8\u5bfe\u30b3\u30b9\u30c8<\/span><span class=\"value\">Low\u2013moderate<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Best for<\/span><span class=\"value\">Si + mildly acidic<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Availability<\/span><span class=\"value\">Stock \/ catalog<\/span><\/div>\n      <\/div>\n    <\/div>\n    <div class=\"mat-card\">\n      <div class=\"mat-card-head cxt\">CXT\u30b0\u30ec\u30fc\u30c9<small>Chemically Resistant \u2014 Seamless<\/small><\/div>\n      <div class=\"mat-card-body\">\n        <div class=\"mat-stat\"><span class=\"label\">Resin system<\/span><span class=\"value\">Inert matrix (seamless)<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Flame rating<\/span><span class=\"value\">N\/A \u2014 application use<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">pH range<\/span><span class=\"value\">2 - 13<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">\u76f8\u5bfe\u30b3\u30b9\u30c8<\/span><span class=\"value\">\u30d7\u30ec\u30df\u30a2\u30e0<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Best for<\/span><span class=\"value\">SiC CMP, GaAs, aggressive<\/span><\/div>\n        <div class=\"mat-stat\"><span class=\"label\">Availability<\/span><span class=\"value\">Custom order<\/span><\/div>\n      <\/div>\n    <\/div>\n  <\/div>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 3 \u2550\u2550\u2550 -->\n  <h2 id=\"material-properties\">Full Material Property Comparison<\/h2>\n\n  <p>Beyond chemical resistance, FR-4 and G-10 share nearly identical mechanical, thermal, and dimensional properties \u2014 which is precisely why the chemical resistance difference is the only meaningful selection criterion between them for polishing template applications. The following table presents the full property comparison relevant to template engineering.<\/p>\n\n  <div class=\"table-wrap\">\n    <table>\n      <thead>\n        <tr>\n          <th>\u30d7\u30ed\u30d1\u30c6\u30a3<\/th>\n          <th>FR-4<\/th>\n          <th>G-10<\/th>\n          <th>CXT\u30b0\u30ec\u30fc\u30c9<\/th>\n          <th>Relevance to Template Performance<\/th>\n        <\/tr>\n      <\/thead>\n      <tbody>\n        <tr>\n          <td><strong>Tensile strength<\/strong><\/td>\n          <td>270\u2013310 MPa<\/td>\n          <td>270\u2013310 MPa<\/td>\n          <td>Equivalent<\/td>\n          <td>Determines resistance to carrier head clamping forces<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>Flexural modulus<\/strong><\/td>\n          <td>18\u201322 GPa<\/td>\n          <td>18\u201322 GPa<\/td>\n          <td>Similar<\/td>\n          <td>Higher modulus \u2192 better carrier plate bow resistance under polishing load<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>CTE (in-plane)<\/strong><\/td>\n          <td>14\u201316 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n          <td>14\u201316 \u00d7 10\u207b\u2076\/\u00b0C<\/td>\n          <td>Similar<\/td>\n          <td>Must be compatible with carrier head material to prevent bow at process temperature<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>Water absorption (24h)<\/strong><\/td>\n          <td>0.10\u20130.20%<\/td>\n          <td>0.10\u20130.20%<\/td>\n          <td>Lower<\/td>\n          <td>Lower absorption \u2192 less dimensional change in wet polishing environment<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>\u5bc6\u5ea6<\/strong><\/td>\n          <td>1.80\u20131.90 g\/cm\u00b3<\/td>\n          <td>1.80\u20131.90 g\/cm\u00b3<\/td>\n          <td>Similar<\/td>\n          <td>Affects template weight; relevant for carrier head balance on large multi-pocket templates<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>Surface hardness (Rockwell M)<\/strong><\/td>\n          <td>M-110 typical<\/td>\n          <td>M-110 typical<\/td>\n          <td>Equivalent<\/td>\n          <td>Hardness determines machinability and edge quality after CNC milling<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>Dielectric constant (@ 1 MHz)<\/strong><\/td>\n          <td>4.5\u20135.0<\/td>\n          <td>4.5\u20135.0<\/td>\n          <td>\u8a72\u5f53\u306a\u3057<\/td>\n          <td>Proxy for material homogeneity; tight Dk range indicates consistent fiber\/resin distribution<\/td>\n        <\/tr>\n        <tr class=\"row-highlight\">\n          <td><strong>Acid resistance (pH 3\u20135)<\/strong><\/td>\n          <td><span class=\"badge badge-amber\">\u4e2d\u7a0b\u5ea6<\/span><\/td>\n          <td><span class=\"badge badge-green\">\u30b0\u30c3\u30c9<\/span><\/td>\n          <td><span class=\"badge badge-teal\">\u7d20\u6674\u3089\u3057\u3044<\/span><\/td>\n          <td><strong>Primary selection criterion for acidic slurry applications<\/strong><\/td>\n        <\/tr>\n        <tr class=\"row-highlight\">\n          <td><strong>Alkaline resistance (pH 8\u201312)<\/strong><\/td>\n          <td><span class=\"badge badge-green\">\u7d20\u6674\u3089\u3057\u3044<\/span><\/td>\n          <td><span class=\"badge badge-green\">\u7d20\u6674\u3089\u3057\u3044<\/span><\/td>\n          <td><span class=\"badge badge-teal\">\u7d20\u6674\u3089\u3057\u3044<\/span><\/td>\n          <td>Both grades perform equivalently for standard alkaline Si polishing<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>Oxidant resistance (KMnO\u2084, H\u2082O\u2082)<\/strong><\/td>\n          <td><span class=\"badge badge-red\">Poor<\/span><\/td>\n          <td><span class=\"badge badge-red\">Poor<\/span><\/td>\n          <td><span class=\"badge badge-teal\">\u7d20\u6674\u3089\u3057\u3044<\/span><\/td>\n          <td>Critical for SiC CMP; both laminate grades fail in KMnO\u2084 environments<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>Laminate delamination risk<\/strong><\/td>\n          <td>Present (layer interface)<\/td>\n          <td>Present (layer interface)<\/td>\n          <td>\u306a\u3057\uff08\u30b7\u30fc\u30e0\u30ec\u30b9\uff09<\/td>\n          <td>Delamination introduces dimensional instability and contamination<\/td>\n        <\/tr>\n        <tr>\n          <td><strong>Halogen content<\/strong><\/td>\n          <td>~18\u201321% Br (TBBPA)<\/td>\n          <td>None<\/td>\n          <td>None<\/td>\n          <td>Halogen-free preferred for some fab chemical management programs<\/td>\n        <\/tr>\n      <\/tbody>\n    <\/table>\n  <\/div>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 4 \u2550\u2550\u2550 -->\n  <h2 id=\"ph-compatibility\">pH &amp; Chemical Compatibility: The Decisive Factor<\/h2>\n\n  <p>For semiconductor polishing template material selection, chemical compatibility with the process slurry is the primary criterion, and pH range is the most practical way to characterize it. The following visualization shows the effective operating range for each material against the pH scale.<\/p>\n\n  <div class=\"ph-ruler-wrap\">\n    <div class=\"ph-ruler-label\">pH Operating Range by Material<\/div>\n    <div style=\"position: relative; padding: 30px 0 8px;\">\n      <div class=\"ph-ruler\">\n        <div class=\"ph-bracket ph-fr4\"><span class=\"ph-bracket-label\">FR-4: pH 8\u201312<\/span><\/div>\n        <div class=\"ph-bracket ph-g10\"><span class=\"ph-bracket-label\">G-10: pH 5\u201312<\/span><\/div>\n        <div class=\"ph-bracket ph-cxt\"><span class=\"ph-bracket-label\">CXT: pH 2\u201313<\/span><\/div>\n      <\/div>\n      <div class=\"ph-numbers\">\n        <span>1<\/span><span>2<\/span><span>3<\/span><span>4<\/span><span>5<\/span>\n        <span>6<\/span><span>7<\/span><span>8<\/span><span>9<\/span><span>10<\/span>\n        <span>11<\/span><span>12<\/span><span>13<\/span><span>14<\/span>\n      <\/div>\n    <\/div>\n  <\/div>\n\n  <p>Reading this chart against your actual slurry chemistry leads directly to the correct material selection:<\/p>\n\n  <ul>\n    <li><strong>Colloidal silica slurry for Si SSP, pH 9\u201311:<\/strong> FR-4 is entirely adequate. No G-10 premium justified.<\/li>\n    <li><strong>Oxide CMP slurry with NH\u2084OH additive, pH 10\u201311:<\/strong> FR-4. Standard alkaline environment.<\/li>\n    <li><strong>Citric acid-buffered silica slurry for glass polishing, pH 5\u20136:<\/strong> G-10 preferred. FR-4 may show swelling over 50+ cycle lifetimes.<\/li>\n    <li><strong>HNO\u2083-buffered diamond slurry for sapphire, pH 4\u20136:<\/strong> G-10 minimum; CXT preferred for high cycle count production.<\/li>\n    <li><strong>KMnO\u2084-based slurry for SiC CMP, pH 2\u20134:<\/strong> CXT mandatory. Neither FR-4 nor G-10 is viable. See our detailed <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/SiC-Wafer-Polishing-Templates-Chemically-Resistant-Solutions-for-Silicon-Carbide-Processing\/\" target=\"_blank\" class=\"text-link-pill\">SiC\u7814\u78e8\u30c6\u30f3\u30d7\u30ec\u30fc\u30c8\u30ac\u30a4\u30c9<\/a>.<\/li>\n    <li><strong>H\u2082SO\u2084\/H\u2082O\u2082 (piranha-type) slurry, pH &lt; 2:<\/strong> CXT mandatory. Extreme acid conditions.<\/li>\n    <li><strong>KOH-based slurry for compound semiconductors, pH 12\u201313:<\/strong> CXT preferred. Strong alkali at pH above 12 degrades both FR-4 and G-10 over time.<\/li>\n  <\/ul>\n\n  <div class=\"callout warning\">\n    <span class=\"callout-icon\">\u26a0\ufe0f<\/span>\n    <div class=\"callout-body\">\n      <strong>pH Alone Does Not Tell the Full Story<\/strong>\n      The presence of strong oxidants (KMnO\u2084, H\u2082O\u2082, HF) is as important as pH for material selection. A slurry at pH 6 containing 1% KMnO\u2084 will degrade both FR-4 and G-10 far faster than a pH 4 slurry with no oxidant. Always specify both the pH range <em>\u305d\u3057\u3066<\/em> any oxidant components when requesting a material recommendation.\n    <\/div>\n  <\/div>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 5 \u2550\u2550\u2550 -->\n  <h2 id=\"failure-modes\">How Each Material Fails in Service<\/h2>\n\n  <p>Understanding the failure progression of FR-4 and G-10 in out-of-envelope chemical environments helps predict template replacement timing and identify early warning signs before a process excursion occurs. The failure sequence for laminate materials in acidic slurry is consistent and observable.<\/p>\n\n  <div class=\"failure-timeline\">\n    <div class=\"failure-row safe\">\n      <span class=\"failure-cycle\">Cycles 1\u201320<\/span>\n      <div class=\"failure-body\">\n        <strong>No observable degradation<\/strong>\n        <p>Template performs within dimensional specification. Slurry contact at the work-hole surfaces and carrier plate periphery begins gradual epoxy resin attack, but the rate is slow enough that no measurable dimensional change occurs.<\/p>\n      <\/div>\n    <\/div>\n    <div class=\"failure-row safe\">\n      <span class=\"failure-cycle\">Cycles 20\u201340<\/span>\n      <div class=\"failure-body\">\n        <strong>Surface discoloration at work-hole edges<\/strong>\n        <p>Visible yellowing or darkening of the epoxy resin at the machined work-hole sidewall surfaces. This is the first observable sign of acid attack. Dimensional tolerance is still within spec; template can continue in service but replacement should be planned.<\/p>\n      <\/div>\n    <\/div>\n    <div class=\"failure-row warn\">\n      <span class=\"failure-cycle\">Cycles 40\u201360<\/span>\n      <div class=\"failure-body\">\n        <strong>Work-hole diameter drift begins<\/strong>\n        <p>Swelling of the epoxy matrix at the work-hole sidewall creates a measurable reduction in work-hole diameter \u2014 typically 5\u201315 \u00b5m. This tightens the wafer-to-hole clearance, increasing lateral retention force beyond design intent and creating stress concentrations at the wafer edge. TTV begins to show a systematic shift associated with template-induced pressure variation.<\/p>\n      <\/div>\n    <\/div>\n    <div class=\"failure-row danger\">\n      <span class=\"failure-cycle\">Cycles 60\u201380<\/span>\n      <div class=\"failure-body\">\n        <strong>Laminate layer separation begins<\/strong>\n        <p>The acid penetrates to the glass fabric \/ resin interface and begins attacking the silane coupling agent that bonds the resin to the glass fibers. Micro-delamination initiates, visible as white or translucent blisters between laminate layers at the carrier plate periphery. Once delamination begins, it propagates rapidly.<\/p>\n      <\/div>\n    <\/div>\n    <div class=\"failure-row danger\">\n      <span class=\"failure-cycle\">Cycles 80+<\/span>\n      <div class=\"failure-body\">\n        <strong>Contamination and dimensional failure<\/strong>\n        <p>Delaminated material and liberated glass fibers shed into the polishing slurry. These particles cause scratch defects on the wafer surface and contaminate the slurry bath. Carrier plate bow increases as the laminate structure loses coherence. Template is a process hazard and must be removed from service immediately.<\/p>\n      <\/div>\n    <\/div>\n  <\/div>\n\n  <p>The same failure sequence occurs for G-10 in pH-incompatible environments, but the cycle onset of each stage is approximately 20\u201340% later due to the marginally better acid resistance of the non-halogenated epoxy. For CXT-grade templates, this failure mode does not exist: there is no laminate interface to delaminate and no epoxy matrix susceptible to acid attack.<\/p>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 6 \u2550\u2550\u2550 -->\n  <h2 id=\"edge-treatment\">Edge Treatment: Why It Matters More Than Material Grade<\/h2>\n\n  <p>In practice, for silicon polishing with alkaline slurry, the quality of the edge treatment on an FR-4 template is a more important performance variable than whether FR-4 or G-10 was chosen as the base material. This is because the primary contamination risk from both materials in normal service is not chemical degradation of the bulk epoxy \u2014 it is mechanical shedding of glass fibers from machined edges.<\/p>\n\n  <p>Both FR-4 and G-10 are woven glass fabric composites. When a router bit or end mill cuts through the material to create the work-hole pocket or the outer carrier plate profile, the cutting action severs individual glass fiber bundles at the cut surface. If these fiber ends are left exposed, they can fray during polishing and release sub-micron glass particles directly into the slurry stream at the wafer surface. A single glass fiber fragment of 0.3\u20131.0 \u00b5m diameter is sufficient to leave a scratch on a 300 mm prime silicon wafer that fails surface inspection.<\/p>\n\n  <p>The solution is edge treatment: a precision finishing operation applied to all machined surfaces before backing pad lamination. At Jizhi, this consists of a three-step sequence applied to every template regardless of whether FR-4 or G-10 is the specified material:<\/p>\n\n  <div class=\"machining-steps\">\n    <div class=\"mstep\">\n      <div class=\"mstep-num\">1<\/div>\n      <div class=\"mstep-body\">\n        <strong>CNC finish-milling to specification<\/strong>\n        <p>All work-hole and outer profile surfaces are finish-milled to drawing dimensions using carbide end mills with controlled feed rate and cutting speed to minimize heat-induced fiber pull-out and achieve maximum surface quality at the cut edge.<\/p>\n      <\/div>\n    <\/div>\n    <div class=\"mstep\">\n      <div class=\"mstep-num\">2<\/div>\n      <div class=\"mstep-body\">\n        <strong>Magnified edge inspection<\/strong>\n        <p>All machined edges are inspected at 20\u201340\u00d7 magnification for fiber fraying, delamination, and dimensional conformance. Any template showing visible fiber exposure beyond the specified limit is rejected before proceeding to the next step.<\/p>\n      <\/div>\n    <\/div>\n    <div class=\"mstep\">\n      <div class=\"mstep-num\">3<\/div>\n      <div class=\"mstep-body\">\n        <strong>Edge sealing application<\/strong>\n        <p>A thin coat of chemically compatible epoxy sealant is applied to all machined edges by precision brush or spray, encapsulating any exposed fiber ends. The sealant is cured under controlled temperature and then inspected for complete coverage and absence of runs or voids that could introduce particles in service.<\/p>\n      <\/div>\n    <\/div>\n  <\/div>\n\n  <div class=\"callout tip\">\n    <span class=\"callout-icon\">\ud83d\udca1<\/span>\n    <div class=\"callout-body\">\n      <strong>Ask Your Supplier About Edge Treatment<\/strong>\n      When evaluating polishing template suppliers, ask specifically about their edge treatment process and inspection methodology. A supplier who cannot describe these steps in detail is likely shipping templates without adequate fiber containment \u2014 a contamination risk that will not be apparent until scratch defects begin appearing in your polishing output.\n    <\/div>\n  <\/div>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 7 \u2550\u2550\u2550 -->\n  <h2 id=\"machining\">Machining &amp; Fabrication Considerations<\/h2>\n\n  <p>FR-4 and G-10 are both machinable with standard CNC tooling, but their glass fabric reinforcement creates specific tooling and process requirements that distinguish them from pure polymer materials. Understanding these requirements helps evaluate supplier fabrication quality and interpret the dimensional tolerances that are achievable in production.<\/p>\n\n  <h3>Tooling and Feed Rates<\/h3>\n  <p>The woven glass fabric in both laminates is highly abrasive and causes rapid wear of conventional high-speed steel tooling. Carbide or diamond-coated carbide end mills are standard for production template machining. Feed rate and cutting speed must be balanced to minimize heat generation (which causes epoxy softening and fiber pull-out) while maintaining dimensional precision. Typical parameters for work-hole machining are surface speeds of 100\u2013180 m\/min with feed rates of 0.05\u20130.15 mm\/tooth, adjusted for cutter diameter and work-hole depth.<\/p>\n\n  <h3>Dimensional Tolerance Achievability<\/h3>\n  <p>With proper tooling and process control, work-hole depth tolerances of \u00b15 \u00b5m and diameter tolerances of \u00b110 \u00b5m are routinely achievable in FR-4 and G-10 on CNC machining centers with temperature-controlled work fixtures. Carrier plate flatness (bow) of \u226410 \u00b5m across the working surface requires starting with a flat-lapped raw material panel and managing thermal input during machining to prevent stress-induced warp. For specifications tighter than \u00b13 \u00b5m on work-hole depth, in-process CMM verification and closed-loop CNC compensation are used.<\/p>\n\n  <h3>CXT Machining Differences<\/h3>\n  <p>CXT-grade materials machine similarly to G-10 in terms of tooling and feed parameters, but the seamless construction means that there is no laminate layer interface that could delaminate under cutting forces. This makes CXT somewhat more forgiving of aggressive cutting parameters and allows faster material removal rates without the delamination risk that limits aggressive machining of laminates. Edge sealing is not required for CXT because there is no glass fabric to expose at cut surfaces.<\/p>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 8 \u2550\u2550\u2550 -->\n  <h2 id=\"cxt\">When Neither FR-4 Nor G-10 Is Sufficient: CXT Grade<\/h2>\n\n  <p>Both FR-4 and G-10 are laminate materials \u2014 stacks of glass fabric layers bonded by resin, with discrete layer interfaces running through the thickness of the plate. This laminate structure is the fundamental source of their chemical vulnerability: once acid or oxidant chemistry penetrates the outer resin surface and reaches the fiber-resin interface, delamination propagates rapidly between layers, and the structural integrity of the carrier plate deteriorates quickly.<\/p>\n\n  <p>CXT-grade templates address this at the structural level by eliminating the laminate construction entirely. CXT is a seamless, monolithic material with a homogeneous cross-section \u2014 there are no layer interfaces to delaminate, no fiber bundles to expose at machined edges, and no epoxy matrix susceptible to the specific chemical attack mechanisms that limit FR-4 and G-10. The matrix resin is selected from inert polymer families that maintain dimensional stability across the full pH 2\u201313 range, including in the presence of strong oxidants.<\/p>\n\n  <p>The manufacturing implications of seamless construction extend beyond chemical resistance. Because CXT templates are not laminate stacks, thickness uniformity across the carrier plate is achieved through precision machining rather than laminate pressing \u2014 giving tighter control over carrier plate bow for applications where \u22645 \u00b5m flatness is required. The absence of a fiber reinforcement phase also means that there is no differential CTE between fiber and matrix that can cause micro-cracking under thermal cycling.<\/p>\n\n  <p>The trade-off is cost and lead time: CXT templates are custom-fabricated items with longer production cycles than FR-4 or G-10 catalog templates. For applications where they are required \u2014 SiC CMP, aggressive oxide CMP, certain compound semiconductor polishing processes \u2014 this cost is non-negotiable. For applications where FR-4 or G-10 is chemically adequate, specifying CXT adds cost without process benefit. The full engineering case for SiC-specific template requirements is covered in our <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/SiC-Wafer-Polishing-Templates-Chemically-Resistant-Solutions-for-Silicon-Carbide-Processing\/\" target=\"_blank\" class=\"text-link-pill\">SiC wafer polishing templates guide<\/a>.<\/p>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 9 \u2550\u2550\u2550 -->\n  <h2 id=\"selection-matrix\">Material Selection Matrix by Application<\/h2>\n\n  <p>The following matrix consolidates the selection guidance from all previous sections into a quick-reference format organized by semiconductor polishing application. For applications not listed here, follow the pH and oxidant selection logic from Section 4, or contact our engineering team for an application-specific recommendation. For a broader understanding of how material selection fits into the complete specification process, see our <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/How-to-Specify-a-Polishing-Template-6-Parameters-Engineers-Must-Define\/\" target=\"_blank\" class=\"text-link-pill\">6-parameter template specification guide<\/a>.<\/p>\n\n  <div class=\"selection-matrix\">\n    <div class=\"sel-head\">\n      <span>\u7533\u3057\u8fbc\u307f<\/span>\n      <span>FR-4<\/span>\n      <span>G-10<\/span>\n      <span>CXT\u30b0\u30ec\u30fc\u30c9<\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">Si SSP \u2014 colloidal silica, pH 9\u201311<\/span>\n      <span><span class=\"badge badge-green\">Recommended<\/span><\/span>\n      <span><span class=\"badge badge-slate\">Acceptable<\/span><\/span>\n      <span><span class=\"badge badge-slate\">Overkill<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">Si SSP \u2014 slightly alkaline, pH 8\u20139<\/span>\n      <span><span class=\"badge badge-green\">Recommended<\/span><\/span>\n      <span><span class=\"badge badge-slate\">Acceptable<\/span><\/span>\n      <span><span class=\"badge badge-slate\">Overkill<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">Glass substrate \u2014 citric acid slurry, pH 5\u20136<\/span>\n      <span><span class=\"badge badge-amber\">Marginal<\/span><\/span>\n      <span><span class=\"badge badge-green\">Recommended<\/span><\/span>\n      <span><span class=\"badge badge-slate\">Optional<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">Sapphire \u2014 HNO\u2083-buffered diamond slurry, pH 4\u20136<\/span>\n      <span><span class=\"badge badge-red\">Not suitable<\/span><\/span>\n      <span><span class=\"badge badge-amber\">Marginal<\/span><\/span>\n      <span><span class=\"badge badge-green\">Recommended<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">GaAs \u2014 bromine methanol slurry, pH 5\u20137<\/span>\n      <span><span class=\"badge badge-amber\">Marginal<\/span><\/span>\n      <span><span class=\"badge badge-green\">Acceptable<\/span><\/span>\n      <span><span class=\"badge badge-green\">Recommended<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">SiC CMP \u2014 KMnO\u2084 slurry, pH 2\u20134<\/span>\n      <span><span class=\"badge badge-red\">Not suitable<\/span><\/span>\n      <span><span class=\"badge badge-red\">Not suitable<\/span><\/span>\n      <span><span class=\"badge badge-green\">Required<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">SiC CMP \u2014 H\u2082O\u2082 slurry, pH 3\u20135<\/span>\n      <span><span class=\"badge badge-red\">Not suitable<\/span><\/span>\n      <span><span class=\"badge badge-red\">Not suitable<\/span><\/span>\n      <span><span class=\"badge badge-green\">Required<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">Oxide CMP \u2014 alkaline, pH 10\u201311, no oxidant<\/span>\n      <span><span class=\"badge badge-green\">Acceptable<\/span><\/span>\n      <span><span class=\"badge badge-green\">Acceptable<\/span><\/span>\n      <span><span class=\"badge badge-slate\">Optional<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">Metal CMP \u2014 H\u2082O\u2082 + abrasive, pH 3\u20135<\/span>\n      <span><span class=\"badge badge-red\">Not suitable<\/span><\/span>\n      <span><span class=\"badge badge-amber\">Marginal<\/span><\/span>\n      <span><span class=\"badge badge-green\">Recommended<\/span><\/span>\n    <\/div>\n    <div class=\"sel-row\">\n      <span class=\"scenario\">KOH-based compound semiconductor etch-polish, pH 12\u201313<\/span>\n      <span><span class=\"badge badge-amber\">Marginal<\/span><\/span>\n      <span><span class=\"badge badge-amber\">Marginal<\/span><\/span>\n      <span><span class=\"badge badge-green\">Recommended<\/span><\/span>\n    <\/div>\n  <\/div>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 SECTION 10 \u2550\u2550\u2550 -->\n  <h2 id=\"common-mistakes\">Common Material Selection Mistakes<\/h2>\n\n  <h3>Mistake 1: Defaulting to FR-4 for Every Application Without Checking Slurry pH<\/h3>\n  <p>FR-4 is the lowest-cost option and the correct default for alkaline silicon polishing. But it is also the most commonly mis-specified material for non-alkaline applications. Engineers who specify templates primarily based on dimensional requirements and leave material selection to &#8220;standard FR-4&#8221; without verifying slurry chemistry compatibility create template failure timelines of 40\u201360 cycles rather than the 100\u2013200+ cycles achievable with the correct material. The template replacement cost and process disruption are typically far higher than the cost difference between FR-4 and G-10 or CXT.<\/p>\n\n  <h3>Mistake 2: Using G-10 as a Conservative &#8220;Upgrade&#8221; When CXT Is Required<\/h3>\n  <p>G-10 is meaningfully better than FR-4 in mildly acidic environments. It is not meaningfully better than FR-4 in strongly acidic or oxidant-containing environments. For SiC CMP with KMnO\u2084 slurry at pH 2\u20134, G-10 fails at approximately the same cycle count as FR-4 \u2014 perhaps 15\u201320% later, but still catastrophically early compared to CXT. Specifying G-10 as a conservative upgrade for SiC applications is a false economy; only CXT provides genuine chemical resistance in that environment.<\/p>\n\n  <h3>Mistake 3: Ignoring the Slurry Oxidant Component When Selecting Material<\/h3>\n  <p>pH is a good primary filter for material selection, but oxidant chemistry is an independent variable that overrides pH-based decisions. A slurry at pH 7 (neutral) that contains 2% H\u2082O\u2082 is more aggressive toward FR-4 and G-10 epoxy matrices than a pH 5 slurry with no oxidant. Engineers who select material based on pH alone without checking oxidant components will find that templates fail far earlier than the pH-based prediction suggests. Always provide the complete slurry chemistry \u2014 pH, oxidant type, oxidant concentration, any chelating or surfactant additives \u2014 when requesting a material selection recommendation.<\/p>\n\n  <h3>Mistake 4: Accepting Templates Without Specifying or Verifying Edge Treatment<\/h3>\n  <p>The most common cause of glass fiber contamination in polishing operations is not material grade \u2014 it is inadequate edge sealing on otherwise acceptable FR-4 or G-10 templates. A G-10 template with poor edge treatment will shed more contamination in service than an FR-4 template with excellent edge sealing. When qualifying a new template supplier or a new template design, always include a wafer-level particle count test in the first qualification lot \u2014 this is the only reliable way to verify that edge treatment quality meets production requirements.<\/p>\n\n  <!-- Related articles -->\n  <div class=\"related-box\">\n    <h3>\ud83d\udcd6 Related Technical Articles<\/h3>\n    <p>Deepen your understanding of polishing template materials, processes, and substrate applications:<\/p>\n    <div class=\"related-links\">\n      <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/Polishing-Templates-for-Semiconductor-Silicon-Wafer-Processing\/\" target=\"_blank\">Polishing Templates: Complete Guide<\/a>\n      <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/Waxless-Polishing-Templates-vs-Wax-Mounting-Cost-Quality-Process-Comparison\/\" target=\"_blank\">\u30ef\u30c3\u30af\u30b9\u306a\u3057\u3068\u30ef\u30c3\u30af\u30b9\u53d6\u308a\u4ed8\u3051<\/a>\n      <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/Role-of-Polishing-Templates-in-CMP-How-Fixture-Design-Impacts-Wafer-Flatness\/\" target=\"_blank\">CMP\u30d7\u30ed\u30bb\u30b9\u306b\u304a\u3051\u308b\u30c6\u30f3\u30d7\u30ec\u30fc\u30c8<\/a>\n      <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/SiC-Wafer-Polishing-Templates-Chemically-Resistant-Solutions-for-Silicon-Carbide-Processing\/\" target=\"_blank\">SiC Polishing Templates<\/a>\n      <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/Polishing-Templates-for-Compound-Semiconductor-Wafers-GaAs-InP-Sapphire\/\" target=\"_blank\">GaAs \/ InP \/ \u30b5\u30d5\u30a1\u30a4\u30a2\u30fb\u30c6\u30f3\u30d7\u30ec\u30fc\u30c8<\/a>\n      <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/How-to-Specify-a-Polishing-Template-6-Parameters-Engineers-Must-Define\/\" target=\"_blank\">6\u30d1\u30e9\u30e1\u30fc\u30bf\u4ed5\u69d8\u30ac\u30a4\u30c9<\/a>\n      <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/Contamination-Control-in-Polishing-Templates-Clean-Room-Assembly-Particle-Prevention\/\" target=\"_blank\">Contamination Control<\/a>\n    <\/div>\n  <\/div>\n\n  <hr class=\"divider\" \/>\n\n  <!-- \u2550\u2550\u2550 FAQ \u2550\u2550\u2550 -->\n  <h2 id=\"faq\">\u3088\u304f\u3042\u308b\u8cea\u554f<\/h2>\n\n  <div class=\"faq-item\">\n    <div class=\"faq-q\">What is the difference between FR-4 and G-10 in polishing templates?<\/div>\n    <div class=\"faq-a\">FR-4 and G-10 are both woven glass fabric \/ epoxy laminate composites with nearly identical mechanical and dimensional properties. The key difference is that FR-4 contains a brominated flame retardant in the epoxy matrix, while G-10 does not. In polishing template applications, this makes G-10 marginally more resistant to mildly acidic slurry environments (pH 5\u20137). For standard alkaline silicon polishing slurries (pH 8\u201312), the performance difference is negligible and FR-4 is the recommended choice due to its lower cost and wider availability.<\/div>\n  <\/div>\n\n  <div class=\"faq-item\">\n    <div class=\"faq-q\">Can FR-4 polishing templates be used with SiC CMP slurries?<\/div>\n    <div class=\"faq-a\">No. SiC CMP typically uses KMnO\u2084-based or H\u2082O\u2082-based oxidant slurries at pH 2\u20134, which are chemically incompatible with both FR-4 and G-10 epoxy matrices. These conditions cause progressive delamination, dimensional swelling, and contamination of the slurry with carrier plate material fragments within 40\u201360 cycles. CXT-grade chemically resistant templates with seamless single-shell construction are required for SiC CMP applications.<\/div>\n  <\/div>\n\n  <div class=\"faq-item\">\n    <div class=\"faq-q\">Why do FR-4 and G-10 polishing templates need edge sealing?<\/div>\n    <div class=\"faq-a\">Both materials are woven glass fabric laminates. When machined to create work holes and the outer profile, the cut exposes glass fiber bundle ends at the machined surface. These fibers can fray during polishing and shed sub-micron glass particles into the slurry, causing scratch defects on the wafer surface. Edge sealing \u2014 finish-milling followed by epoxy sealant coating \u2014 encapsulates all exposed fiber ends and prevents particle shedding. This step is mandatory for production-grade templates and should be verified with your supplier before qualification.<\/div>\n  <\/div>\n\n  <div class=\"faq-item\">\n    <div class=\"faq-q\">What is CXT-grade polishing template material?<\/div>\n    <div class=\"faq-a\">CXT-grade is a chemically resistant polishing template material using a seamless single-shell construction rather than the laminate layer approach of FR-4 and G-10. The inert matrix resin resists the full pH range (2\u201313) including strong oxidants such as KMnO\u2084. Because CXT templates have no laminate interface, there is no delamination failure mode and no fiber-shedding risk at machined edges. CXT-grade templates are the standard choice for SiC CMP and other aggressive slurry applications where FR-4 and G-10 are chemically inadequate.<\/div>\n  <\/div>\n\n  <div class=\"faq-item\">\n    <div class=\"faq-q\">Is G-10 always a better choice than FR-4 for polishing templates?<\/div>\n    <div class=\"faq-a\">No. G-10 is the better choice only for mildly acidic slurry environments (pH 5\u20137), where its non-halogenated epoxy matrix provides marginally better acid resistance. For the most common semiconductor polishing application \u2014 alkaline colloidal silica slurry at pH 9\u201311 for silicon wafer SSP \u2014 FR-4 and G-10 perform identically, and FR-4 is preferred on cost grounds. Automatically specifying G-10 as a &#8220;higher quality&#8221; option in alkaline applications adds cost without any process benefit.<\/div>\n  <\/div>\n\n  <!-- CTA -->\n  <div class=\"cta-banner\">\n    <h2>\u7814\u78e8\u30c6\u30f3\u30d7\u30ec\u30fc\u30c8\u306e\u304a\u898b\u7a4d\u308a<\/h2>\n    <p>Tell us your substrate type, slurry chemistry, and pH range \u2014 our engineering team will confirm the right carrier plate material and provide a competitive quote within 48 hours.<\/p>\n    <a href=\"https:\/\/jeez-semicon.com\/ja\/contact\/\" class=\"cta-btn\" target=\"_blank\">\n      \u304a\u898b\u7a4d\u3082\u308a\u306f\u3053\u3061\u3089 \u2192 \u304a\u554f\u3044\u5408\u308f\u305b\n    <\/a>\n  <\/div>\n\n  <!-- Back to pillar -->\n  <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/Polishing-Templates-for-Semiconductor-Silicon-Wafer-Processing\/\" target=\"_blank\" class=\"back-to-pillar\">\n    Back to Polishing Templates: Complete Guide\n  <\/a>\n\n<\/div>\n<\/body>\n<\/html>","protected":false},"excerpt":{"rendered":"<p>Material Engineering Guide Two materials. Nearly identical names. Genuinely different performance envelopes. This guide explains exactly when each is the right choice \u2014 and when neither is sufficient. By Jizhi  &#8230;<\/p>","protected":false},"author":1,"featured_media":1685,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-1649","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/posts\/1649","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/comments?post=1649"}],"version-history":[{"count":2,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/posts\/1649\/revisions"}],"predecessor-version":[{"id":1651,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/posts\/1649\/revisions\/1651"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/media\/1685"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/media?parent=1649"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/categories?post=1649"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/tags?post=1649"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}