{"id":1710,"date":"2026-03-16T09:43:48","date_gmt":"2026-03-16T01:43:48","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=1710"},"modified":"2026-03-16T09:43:48","modified_gmt":"2026-03-16T01:43:48","slug":"dicing-blade-material-compatibility-chart-silicon-sic-gaas-sapphire-and-more","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/ja\/blog\/dicing-blade-material-compatibility-chart-silicon-sic-gaas-sapphire-and-more\/","title":{"rendered":"Dicing Blade Material Compatibility Chart Silicon SiC GaAs Sapphire and More"},"content":{"rendered":"<!-- ============================================================\n     CLUSTER A-04\n     H1 \/ URL slug: dicing-blade-material-compatibility-chart-silicon-sic-gaas-sapphire-and-more\n     Full URL: https:\/\/jeez-semicon.com\/blog\/dicing-blade-material-compatibility-chart-silicon-sic-gaas-sapphire-and-more\n     Pillar:   https:\/\/jeez-semicon.com\/blog\/diamond-dicing-blades\n     Company:  Jizhi Electronic Technology Co., Ltd.\n     Target:   ~2,200 words visible body text\n     ============================================================ -->\n\n<style>\n.jz-art{font-family:'Georgia',serif;color:#1a1a2e;line-height:1.8;font-size:16px;max-width:860px;margin:0 auto;}\n.jz-art *{box-sizing:border-box;}\n.jz-art h1{font-family:'Trebuchet MS',sans-serif;font-size:2.1rem;color:#0d2b55;margin:0 0 1.5rem;line-height:1.25;font-weight:700;}\n.jz-art h2{font-family:'Trebuchet MS',sans-serif;font-size:1.65rem;color:#0d2b55;margin:2.5rem 0 1rem;border-left:4px solid #0072ce;padding-left:14px;line-height:1.3;}\n.jz-art h3{font-family:'Trebuchet MS',sans-serif;font-size:1.2rem;color:#004a9f;margin:1.75rem 0 0.6rem;}\n.jz-art p{margin:0 0 1.25rem;}\n.jz-art ul,.jz-art ol{margin:0 0 1.25rem;padding-left:1.6rem;}\n.jz-art li{margin-bottom:.45rem;}\n.jz-art a{color:#0072ce;text-decoration:underline;text-underline-offset:3px;}\n.jz-art a:hover{color:#004a9f;}\n.jz-art hr{border:none;border-top:2px solid #dde8f5;margin:2.5rem 0;}\n.jz-toc{background:#f0f6ff;border:1px solid #bdd4f0;border-radius:8px;padding:1.4rem 1.8rem;margin:1.75rem 0 2.25rem;}\n.jz-toc-title{font-family:'Trebuchet MS',sans-serif;font-weight:700;font-size:1rem;color:#0d2b55;margin:0 0 .6rem;}\n.jz-toc ol{margin:0;padding-left:1.3rem;}\n.jz-toc li{margin-bottom:.3rem;font-size:.93rem;}\n.jz-toc a{color:#0072ce;text-decoration:none;}\n.jz-toc a:hover{text-decoration:underline;}\n.jz-intro-box{background:linear-gradient(135deg,#0d2b55,#0072ce);color:#fff;border-radius:10px;padding:1.6rem 2rem;margin:0 0 2.25rem;}\n.jz-intro-box p{color:#e8f0ff;margin:0;font-size:1.03rem;line-height:1.75;}\n.jz-intro-box strong{color:#fff;}\n.jz-table-wrap{overflow-x:auto;margin:1.5rem 0 2rem;}\n.jz-table{width:100%;border-collapse:collapse;font-size:.89rem;}\n.jz-table thead tr{background:#0d2b55;color:#fff;}\n.jz-table thead th{padding:9px 12px;text-align:left;font-family:'Trebuchet MS',sans-serif;font-weight:600;}\n.jz-table tbody tr:nth-child(odd){background:#f5f9ff;}\n.jz-table tbody tr:nth-child(even){background:#fff;}\n.jz-table tbody td{padding:8px 12px;border-bottom:1px solid #d5e5f5;vertical-align:top;}\n.jz-mat-card{border:1px solid #c5d9f0;border-radius:9px;padding:1.2rem 1.5rem;margin:1.25rem 0;background:#fff;}\n.jz-mat-card .mc-header{display:flex;align-items:center;gap:.8rem;margin-bottom:.7rem;}\n.jz-mat-card .mc-name{font-family:'Trebuchet MS',sans-serif;font-weight:700;font-size:1.05rem;color:#0d2b55;}\n.jz-mat-card .mc-badge{font-size:.7rem;background:#e0edff;color:#004a9f;border-radius:20px;padding:.15rem .7rem;font-family:'Trebuchet MS',sans-serif;white-space:nowrap;}\n.jz-mat-card .mc-badge.hard{background:#fff0e0;color:#92400e;}\n.jz-mat-card .mc-badge.medium{background:#e0fff0;color:#166534;}\n.jz-mat-card p{font-size:.92rem;color:#374151;margin:0 0 .5rem;}\n.jz-tip{background:#fff8e1;border-left:4px solid #f59e0b;border-radius:0 6px 6px 0;padding:.9rem 1.2rem;margin:1.5rem 0;font-size:.94rem;}\n.jz-tip strong{color:#92400e;}\n.jz-note{background:#e8f5e9;border-left:4px solid #22c55e;border-radius:0 6px 6px 0;padding:.9rem 1.2rem;margin:1.5rem 0;font-size:.94rem;}\n.jz-note strong{color:#166534;}\n.jz-cta{background:linear-gradient(135deg,#003d82,#0072ce);border-radius:10px;padding:1.8rem 2rem;margin:2.5rem 0;text-align:center;color:#fff;}\n.jz-cta h3{color:#fff;margin:0 0 .5rem;font-size:1.25rem;font-family:'Trebuchet MS',sans-serif;}\n.jz-cta p{color:#d4e8ff;margin:0 0 1.1rem;font-size:.97rem;}\n.jz-cta a.jz-btn{display:inline-block;background:#fff;color:#003d82;font-family:'Trebuchet MS',sans-serif;font-weight:700;font-size:.93rem;padding:.65rem 1.6rem;border-radius:50px;text-decoration:none;margin:.25rem .35rem;}\n.jz-cta a.jz-btn:hover{background:#e0edff;}\n.jz-cta a.jz-btn.outline{background:transparent;color:#fff;border:2px solid rgba(255,255,255,.7);}\n.jz-faq-item{border:1px solid #d0e4f5;border-radius:8px;margin-bottom:.85rem;overflow:hidden;}\n.jz-faq-q{background:#f0f7ff;padding:.85rem 1.15rem;font-family:'Trebuchet MS',sans-serif;font-weight:600;font-size:.95rem;color:#0d2b55;}\n.jz-faq-a{padding:.8rem 1.15rem;font-size:.92rem;color:#374151;line-height:1.7;}\n.jz-back{font-size:.88rem;margin:0 0 1.75rem;color:#6b7280;}\n.jz-back a{color:#0072ce;}\n@media(max-width:600px){\n  .jz-art h1{font-size:1.55rem;}\n  .jz-art h2{font-size:1.3rem;}\n  .jz-intro-box,.jz-cta{padding:1.2rem 1.1rem;}\n  .jz-mat-card .mc-header{flex-wrap:wrap;}\n}\n<\/style>\n\n<div class=\"jz-art\">\n\n<p class=\"jz-back\">\u2190 Back to: <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/diamond-dicing-blades\/\" target=\"_blank\">Diamond Dicing Blades: The Complete Guide<\/a><\/p>\n\n\n<div class=\"jz-intro-box\">\n  <p>No single dicing blade specification works across all substrate materials. The mechanical properties of the workpiece \u2014 hardness, brittleness, fracture toughness, and thermal conductivity \u2014 each impose specific requirements on bond type, diamond grit size, blade thickness, and cutting parameters. This reference guide maps every major substrate to its recommended blade strategy, with individual notes on the key challenges and process adjustments each material demands.<\/p>\n<\/div>\n\n<nav class=\"jz-toc\">\n  <div class=\"jz-toc-title\">\u76ee\u6b21<\/div>\n  <ol>\n    <li><a href=\"#why-material-matters\">Why Material Properties Determine Blade Selection<\/a><\/li>\n    <li><a href=\"#master-chart\">Master Compatibility Chart<\/a><\/li>\n    <li><a href=\"#silicon\">\u30b1\u30a4\u7d20 (Si)<\/a><\/li>\n    <li><a href=\"#sic\">\u70ad\u5316\u30b1\u30a4\u7d20\uff08SiC\uff09<\/a><\/li>\n    <li><a href=\"#gaas\">\u30ac\u30ea\u30a6\u30e0\u30d2\u7d20\uff08GaAs\uff09<\/a><\/li>\n    <li><a href=\"#sapphire\">Sapphire (Al\u2082O\u2083 Single Crystal)<\/a><\/li>\n    <li><a href=\"#gan\">\u7a92\u5316\u30ac\u30ea\u30a6\u30e0\uff08GaN\uff09<\/a><\/li>\n    <li><a href=\"#glass\">Glass and Quartz<\/a><\/li>\n    <li><a href=\"#ceramics\">Alumina and Technical Ceramics<\/a><\/li>\n    <li><a href=\"#linbo3\">Lithium Niobate and Lithium Tantalate<\/a><\/li>\n    <li><a href=\"#packages\">IC Packages and Laminates<\/a><\/li>\n    <li><a href=\"#faq\">\u3088\u304f\u3042\u308b\u8cea\u554f<\/a><\/li>\n  <\/ol>\n<\/nav>\n\n\n<h2 id=\"why-material-matters\">1. Why Material Properties Determine Blade Selection<\/h2>\n\n<p>The dicing blade&#8217;s bond matrix must wear away at a rate that continuously exposes fresh, sharp diamond to the workpiece. This self-sharpening mechanism only functions correctly when there is an appropriate match between the <strong>hardness of the workpiece<\/strong> and the <strong>hardness of the bond matrix<\/strong>. A mismatch in either direction causes performance failure:<\/p>\n\n<ul>\n  <li><strong>Bond too hard for the material:<\/strong> The workpiece is not abrasive enough to erode the bond and expose fresh diamonds. The blade glazes \u2014 worn, polished grains remain at the surface, cutting forces escalate, and heat builds up. Chipping increases dramatically.<\/li>\n  <li><strong>Bond too soft for the material:<\/strong> The workpiece erodes the bond so aggressively that diamonds are shed before they have fully contributed their cutting potential. Blade life is extremely short, and kerf geometry becomes inconsistent.<\/li>\n<\/ul>\n\n<p>Beyond bond hardness, material <strong>fracture toughness<\/strong> determines how much subsurface damage each diamond impact generates, and <strong>thermal conductivity<\/strong> affects how much heat builds up at the cutting zone. Both factors feed into grit size and coolant requirements. A complete overview of blade parameters and how to read a datasheet is provided in our <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/dicing-blade-specifications-guide-od-thickness-grit-size-and-exposure\/\" target=\"_blank\">blade specifications guide<\/a>.<\/p>\n\n\n<h2 id=\"master-chart\">2. Master Compatibility Chart<\/h2>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead>\n      <tr>\n        <th>\u7d20\u6750<\/th>\n        <th>\u30e2\u30fc\u30b9\u786c\u5ea6<\/th>\n        <th>\u30d7\u30e9\u30a4\u30de\u30ea\u30fc\u30fb\u30c1\u30e3\u30ec\u30f3\u30b8<\/th>\n        <th>\u50b5\u5238\u306e\u7a2e\u985e<\/th>\n        <th>Grit Range<\/th>\n        <th>Typical Feed Rate<\/th>\n      <\/tr>\n    <\/thead>\n    <tbody>\n      <tr>\n        <td>\u30b1\u30a4\u7d20 (Si)<\/td>\n        <td>6.5<\/td>\n        <td>Brittle; subsurface damage<\/td>\n        <td>\u6a39\u8102<\/td>\n        <td>#600\u2013#2000<\/td>\n        <td>30\u2013100 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>\u70ad\u5316\u30b1\u30a4\u7d20\uff08SiC\uff09<\/td>\n        <td>9.5<\/td>\n        <td>Extreme hardness; blade wear<\/td>\n        <td>Metal \/ Special Resin<\/td>\n        <td>#200\u2013#600<\/td>\n        <td>1\u20138 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>\u30ac\u30ea\u30a6\u30e0\u30d2\u7d20\uff08GaAs\uff09<\/td>\n        <td>4.5<\/td>\n        <td>Soft; cleavage; toxic swarf<\/td>\n        <td>Resin (soft)<\/td>\n        <td>#800\u2013#2000<\/td>\n        <td>20\u201380 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>Sapphire (Al\u2082O\u2083)<\/td>\n        <td>9.0<\/td>\n        <td>Very hard; high wear rate<\/td>\n        <td>Metal \/ Resin hybrid<\/td>\n        <td>#320\u2013#800<\/td>\n        <td>3\u201315 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>GaN on Sapphire \/ Si \/ SiC<\/td>\n        <td>~8.5<\/td>\n        <td>Layered structure; delamination<\/td>\n        <td>Resin \/ Electroformed<\/td>\n        <td>#600\u2013#1200<\/td>\n        <td>5\u201330 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>Borosilicate Glass<\/td>\n        <td>6.0<\/td>\n        <td>Micro-cracks; edge quality<\/td>\n        <td>Metal \/ Resin<\/td>\n        <td>#400\u2013#1200<\/td>\n        <td>10\u201350 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>Fused Silica \/ Quartz<\/td>\n        <td>7.0<\/td>\n        <td>Stress cracking; low toughness<\/td>\n        <td>\u30e1\u30bf\u30eb<\/td>\n        <td>#400\u2013#800<\/td>\n        <td>5\u201330 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>Alumina Ceramic (Al\u2082O\u2083)<\/td>\n        <td>8.5\u20139.0<\/td>\n        <td>Porosity; irregular wear<\/td>\n        <td>\u30e1\u30bf\u30eb<\/td>\n        <td>#200\u2013#600<\/td>\n        <td>5\u201325 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>LiNbO\u2083 \/ LiTaO\u2083<\/td>\n        <td>5.5<\/td>\n        <td>Cleavage planes; thermal shock<\/td>\n        <td>Resin (soft, fine)<\/td>\n        <td>#1200\u2013#2000<\/td>\n        <td>15\u201360 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>Ferrite Ceramic<\/td>\n        <td>5.5\u20136.5<\/td>\n        <td>Porosity; chipping at grain boundaries<\/td>\n        <td>\u6a39\u8102<\/td>\n        <td>#600\u2013#1500<\/td>\n        <td>10\u201340 mm\/s<\/td>\n      <\/tr>\n      <tr>\n        <td>FR4 \/ Organic Laminate<\/td>\n        <td>\u2014<\/td>\n        <td>Fibre pull-out; delamination<\/td>\n        <td>Metal (fine)<\/td>\n        <td>#200\u2013#400<\/td>\n        <td>20\u2013100 mm\/s<\/td>\n      <\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<p><em>Note: Feed rates are indicative starting points. Actual process optimisation requires empirical characterisation on your specific equipment, blade formulation, and wafer stack configuration.<\/em><\/p>\n\n\n<h2 id=\"silicon\">3. Silicon (Si)<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">\u30b1\u30a4\u7d20 (Si)<\/span>\n    <span class=\"mc-badge medium\">Mohs 6.5 \u2014 Moderate hardness<\/span>\n  <\/div>\n  <p>Silicon is by far the most widely diced substrate material, accounting for the majority of global wafer dicing volume. It is brittle with relatively low fracture toughness, which means diamond impact generates subsurface cracks that must be minimised to preserve die strength and reliability.<\/p>\n  <p><strong>Recommended blade:<\/strong> Resin bond, grit #600\u2013#2000 depending on chipping specification. Finer grit (#1200\u2013#2000) for advanced nodes with tight chipping budgets. Thinner blades (0.030\u20130.080 mm) for dense layouts.<\/p>\n  <p><strong>Key considerations:<\/strong> Spindle speed 30,000\u201350,000 RPM; feed rate 30\u2013100 mm\/s. Regular <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/how-to-dress-a-dicing-blade-step-by-step-tutorial\/\" target=\"_blank\">blade dressing<\/a> maintains self-sharpening behaviour and prevents chipping escalation.<\/p>\n<\/div>\n\n<h2 id=\"sic\">4. Silicon Carbide (SiC)<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">\u70ad\u5316\u30b1\u30a4\u7d20\uff08SiC\uff09<\/span>\n    <span class=\"mc-badge hard\">Mohs 9.5 \u2014 Extremely hard<\/span>\n  <\/div>\n  <p>SiC is the substrate of choice for high-voltage, high-temperature power devices in EV inverters and industrial power supplies. At Mohs 9.5, it is the hardest commercially diced substrate material. Blade wear rates on SiC are typically 5\u201320\u00d7 higher than on silicon, and feed rates must be dramatically reduced to manage heat and cutting force. A dedicated deep-dive on this material is provided in our <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/dicing-blade-for-sic-wafers-challenges-and-best-practices\/\" target=\"_blank\">SiC wafer dicing guide<\/a>.<\/p>\n  <p><strong>Recommended blade:<\/strong> Specialised metal bond or high-concentration resin bond specifically formulated for SiC. Standard Si blades are completely unsuitable. Diamond concentration C100 or above typically required.<\/p>\n  <p><strong>Key considerations:<\/strong> Feed rate 1\u20138 mm\/s; aggressive coolant flow essential; monitor spindle load current as an indicator of blade glazing. Step-cut approach (coarser Z1 + finer Z2) can improve both throughput and surface quality.<\/p>\n<\/div>\n\n<h2 id=\"gaas\">5. Gallium Arsenide (GaAs)<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">\u30ac\u30ea\u30a6\u30e0\u30d2\u7d20\uff08GaAs\uff09<\/span>\n    <span class=\"mc-badge medium\">Mohs 4.5 \u2014 Soft and brittle<\/span>\n  <\/div>\n  <p>GaAs is soft relative to silicon but extremely brittle, with pronounced cleavage planes along the {110} crystal direction. Cutting force must be minimised to avoid triggering cleavage fractures that propagate far beyond the intended kerf. Additionally, GaAs swarf contains arsenic compounds and requires appropriate coolant containment and waste treatment.<\/p>\n  <p><strong>Recommended blade:<\/strong> Soft resin bond, fine grit (#1200\u2013#2000). Blade must self-sharpen readily because GaAs is not hard enough to erode a medium or hard bond effectively.<\/p>\n  <p><strong>Key considerations:<\/strong> Cut street width must be aligned with cleavage plane orientation to minimise off-axis fracture. Coolant flow must be adequate for arsenic swarf capture and containment.<\/p>\n<\/div>\n\n<h2 id=\"sapphire\">6. Sapphire (Al\u2082O\u2083 Single Crystal)<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">\u30b5\u30d5\u30a1\u30a4\u30a2<\/span>\n    <span class=\"mc-badge hard\">Mohs 9.0 \u2014 Very hard<\/span>\n  <\/div>\n  <p>Sapphire is widely used as a substrate for LED epitaxial growth (GaN-on-sapphire) and optical components. Its high hardness demands a blade capable of sustained cutting without rapid wear, while its relatively low fracture toughness means fine chipping is still a concern at die edges.<\/p>\n  <p><strong>Recommended blade:<\/strong> Metal bond or resin-metal hybrid, grit #320\u2013#800. High diamond concentration essential for reasonable blade life. Coolant with adequate lubricity reduces heat-induced subsurface cracking.<\/p>\n  <p><strong>Key considerations:<\/strong> Sapphire has significant anisotropic hardness \u2014 cutting parallel vs. perpendicular to the c-axis orientation can require different parameters. Align cut direction with the lower-hardness crystal orientation where die layout permits.<\/p>\n<\/div>\n\n<h2 id=\"gan\">7. Gallium Nitride (GaN) Epitaxial Wafers<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">GaN on Si \/ SiC \/ Sapphire<\/span>\n    <span class=\"mc-badge hard\">Mohs ~8.5 \u2014 Hard epitaxial layer<\/span>\n  <\/div>\n  <p>GaN power and RF devices are typically produced on heterogeneous wafer stacks \u2014 GaN epitaxial layers on silicon, SiC, or sapphire substrates. The dicing blade must simultaneously cut through the GaN device layer and the substrate without delaminating the interface between them. Delamination at the GaN-substrate boundary is the primary failure mode specific to this material combination.<\/p>\n  <p><strong>Recommended blade:<\/strong> Resin bond or electroformed nickel bond, grit #600\u2013#1200. Lower feed rates reduce inter-layer shear stress. Step-cut approach with Z1 scribing through the GaN layer and Z2 completing the substrate cut can prevent delamination.<\/p>\n<\/div>\n\n<h2 id=\"glass\">8. Glass and Quartz<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">Borosilicate Glass \/ Fused Silica \/ Quartz<\/span>\n    <span class=\"mc-badge medium\">Mohs 6.0\u20137.0<\/span>\n  <\/div>\n  <p>Glass substrates are used in MEMS, optical sensors, display panels, and interposers. They have moderate hardness but low fracture toughness \u2014 making micro-crack propagation a significant concern that limits acceptable feed rates and grit coarseness. Fused silica and quartz are harder and more thermally sensitive than standard borosilicate glass, requiring additional care in coolant selection to prevent thermal shock cracking.<\/p>\n  <p><strong>Recommended blade:<\/strong> Metal bond for long life on high-volume glass dicing; resin bond where surface quality is the primary requirement. Grit #400\u2013#1200 depending on quality specification.<\/p>\n  <p><strong>Key considerations:<\/strong> Coolant with good wetting and heat removal properties is important for fused silica. See our <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/dicing-blade-coolant-why-water-alone-is-not-enough\/\" target=\"_blank\">coolant guide<\/a> for formulation recommendations.<\/p>\n<\/div>\n\n<h2 id=\"ceramics\">9. Alumina and Technical Ceramics<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">Al\u2082O\u2083 Ceramic \/ AlN \/ Si\u2083N\u2084<\/span>\n    <span class=\"mc-badge hard\">Mohs 8.5\u20139.5<\/span>\n  <\/div>\n  <p>Alumina (Al\u2082O\u2083) ceramic substrates are widely used in RF packages, power modules, and automotive electronics. Aluminium nitride (AlN) is used where high thermal conductivity is required. Both materials are hard, brittle, and porous at the microstructure level \u2014 porosity causes irregular blade wear and intermittent chipping at grain boundary pull-out sites.<\/p>\n  <p><strong>Recommended blade:<\/strong> Metal bond, grit #200\u2013#600. Higher diamond concentration to sustain cutting performance against the hard matrix. Regular dressing intervals to prevent loading in porous regions.<\/p>\n<\/div>\n\n<h2 id=\"linbo3\">10. Lithium Niobate (LiNbO\u2083) and Lithium Tantalate (LiTaO\u2083)<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">LiNbO\u2083 \/ LiTaO\u2083<\/span>\n    <span class=\"mc-badge medium\">Mohs 5.5 \u2014 Soft with cleavage<\/span>\n  <\/div>\n  <p>These piezoelectric crystals are the substrate material for surface acoustic wave (SAW) filters used in smartphone RF front-ends. They are soft, have defined cleavage planes, and are highly sensitive to thermal shock \u2014 the latter making coolant selection and flow rate particularly important. They also exhibit pyroelectric behaviour, meaning temperature changes during dicing can generate surface charge that attracts contamination.<\/p>\n  <p><strong>Recommended blade:<\/strong> Soft resin bond, fine grit (#1200\u2013#2000). Very low cutting forces essential to avoid cleavage fractures. Anti-static coolant additives can help manage charge accumulation.<\/p>\n<\/div>\n\n<h2 id=\"packages\">11. IC Packages and Organic Laminates<\/h2>\n\n<div class=\"jz-mat-card\">\n  <div class=\"mc-header\">\n    <span class=\"mc-name\">QFN \/ BGA \/ FR4 Laminate<\/span>\n    <span class=\"mc-badge medium\">Multi-material stack<\/span>\n  <\/div>\n  <p>Package singulation requires cutting through heterogeneous stacks of copper, solder mask, FR4 laminate, and mould compound \u2014 materials with widely different properties. The primary quality concerns are copper burr formation on exposed pads, delamination at copper-laminate interfaces, and fibre pull-out from glass-reinforced laminates. For wettable QFN packages, copper burr on the wettable flank directly affects AOI pass rates and solder joint reliability. Our dedicated guide on <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/qfn-package-dicing-blade-selection-and-process-parameters\/\" target=\"_blank\">QFN package dicing<\/a> covers blade selection and parameter optimisation for these applications.<\/p>\n  <p><strong>Recommended blade:<\/strong> Fine metal bond, grit #200\u2013#400. Blade must simultaneously cut all layers without loading on the organic or copper material.<\/p>\n<\/div>\n\n<hr>\n\n<div class=\"jz-cta\">\n  <h3>Looking for a Blade Specification for Your Substrate?<\/h3>\n  <p>Jizhi Electronic Technology supplies dicing blades qualified for all major semiconductor and electronics substrates. Share your material, thickness, and street width and our application team will recommend the right blade.<\/p>\n  <a href=\"https:\/\/jeez-semicon.com\/ja\/contact\/\" target=\"_blank\" class=\"jz-btn\">Request a Blade Recommendation<\/a>\n  <a href=\"https:\/\/jeez-semicon.com\/ja\/semi-categories\/dicing_blade\/\" target=\"_blank\" class=\"jz-btn outline\">View Products<\/a>\n<\/div>\n\n<h2 id=\"faq\">12. Frequently Asked Questions<\/h2>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Can I use the same blade for both GaN-on-Si and GaN-on-SiC wafers?<\/div>\n  <div class=\"jz-faq-a\">Not typically, because the substrates differ significantly \u2014 silicon is relatively soft (Mohs 6.5) while SiC is extremely hard (Mohs 9.5). The GaN epitaxial layer itself is similar in both cases, but the substrate dominates blade wear and parameter requirements. A blade qualified for GaN-on-Si will wear extremely rapidly on GaN-on-SiC. Separate blade qualifications are required.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Why is GaAs diced at lower feed rates than silicon despite being softer?<\/div>\n  <div class=\"jz-faq-a\">GaAs has pronounced crystallographic cleavage planes that allow fractures to propagate rapidly along preferred directions when cutting force exceeds a threshold. While the material is softer and requires less force to cut, the consequence of excessive force is not just chipping but catastrophic cleavage fractures that can split an entire die. Lower feed rates keep cutting forces below the cleavage threshold even as the blade engages the material.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">How does LiNbO\u2083 dicing differ from silicon dicing in terms of coolant requirements?<\/div>\n  <div class=\"jz-faq-a\">LiNbO\u2083 is pyroelectric \u2014 temperature changes generate surface charge. Standard DI water as coolant can promote charge accumulation and electrostatic attraction of contaminant particles to the diced surface. A coolant additive with anti-static properties, as discussed in our <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/dicing-blade-coolant-why-water-alone-is-not-enough\/\" target=\"_blank\">coolant selection guide<\/a>, helps mitigate this. Additionally, LiNbO\u2083 is sensitive to thermal shock, so coolant flow must be sufficient and consistent throughout the cut to prevent temperature spikes at the cutting zone.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Is there a single &#8220;universal&#8221; dicing blade that works across multiple substrate types?<\/div>\n  <div class=\"jz-faq-a\">No. The fundamental requirement that bond hardness must be matched to workpiece hardness means that no single blade specification can perform optimally across the full range of substrate materials. Some moderate-hardness materials (certain glass types, some ceramics) may accept the same blade type, but hard materials like SiC and soft materials like GaAs require fundamentally different blade formulations. Always qualify blades individually for each substrate in your production mix.<\/div>\n<\/div>\n\n<p style=\"margin-top:2rem;font-size:.9rem;color:#6b7280;\">\u21a9 Return to the full guide: <a href=\"https:\/\/jeez-semicon.com\/ja\/blog\/diamond-dicing-blades\/\" target=\"_blank\">Diamond Dicing Blades \u2014 The Complete Guide<\/a><\/p>\n\n<\/div><!-- \/.jz-art -->","protected":false},"excerpt":{"rendered":"<p>\u2190 Back to: Diamond Dicing Blades: The Complete Guide No single dicing blade specification works across all substrate materials. The mechanical properties of the workpiece \u2014 hardness, brittleness, fracture toughness,  &#8230;<\/p>","protected":false},"author":1,"featured_media":1744,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-1710","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/posts\/1710","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/comments?post=1710"}],"version-history":[{"count":2,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/posts\/1710\/revisions"}],"predecessor-version":[{"id":1712,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/posts\/1710\/revisions\/1712"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/media\/1744"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/media?parent=1710"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/categories?post=1710"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/ja\/wp-json\/wp\/v2\/tags?post=1710"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}