{"id":1716,"date":"2026-03-16T09:43:56","date_gmt":"2026-03-16T01:43:56","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=1716"},"modified":"2026-03-16T09:43:56","modified_gmt":"2026-03-16T01:43:56","slug":"dicing-blade-coolant-why-water-alone-is-not-enough","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/ru\/blog\/dicing-blade-coolant-why-water-alone-is-not-enough\/","title":{"rendered":"\u041e\u0445\u043b\u0430\u0436\u0434\u0430\u044e\u0449\u0430\u044f \u0436\u0438\u0434\u043a\u043e\u0441\u0442\u044c \u0434\u043b\u044f \u043b\u0435\u0437\u0432\u0438\u0439: \u043f\u043e\u0447\u0435\u043c\u0443 \u043e\u0434\u043d\u043e\u0439 \u0432\u043e\u0434\u044b \u043d\u0435\u0434\u043e\u0441\u0442\u0430\u0442\u043e\u0447\u043d\u043e"},"content":{"rendered":"<!-- ============================================================\n     CLUSTER B-02\n     H1 \/ URL slug: dicing-blade-coolant-why-water-alone-is-not-enough\n     Full URL: https:\/\/jeez-semicon.com\/blog\/dicing-blade-coolant-why-water-alone-is-not-enough\n     Pillar:   https:\/\/jeez-semicon.com\/blog\/diamond-dicing-blades\n     Company:  Jizhi Electronic Technology Co., Ltd.\n     Target:   ~1,800 words visible body text\n     ============================================================ -->\n\n<style>\n.jz-art{font-family:'Georgia',serif;color:#1a1a2e;line-height:1.8;font-size:16px;max-width:860px;margin:0 auto;}\n.jz-art *{box-sizing:border-box;}\n.jz-art h1{font-family:'Trebuchet MS',sans-serif;font-size:2.1rem;color:#0d2b55;margin:0 0 1.5rem;line-height:1.25;font-weight:700;}\n.jz-art h2{font-family:'Trebuchet MS',sans-serif;font-size:1.65rem;color:#0d2b55;margin:2.5rem 0 1rem;border-left:4px solid #0072ce;padding-left:14px;line-height:1.3;}\n.jz-art h3{font-family:'Trebuchet MS',sans-serif;font-size:1.2rem;color:#004a9f;margin:1.75rem 0 0.6rem;}\n.jz-art p{margin:0 0 1.25rem;}\n.jz-art ul,.jz-art ol{margin:0 0 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.fc-desc{font-size:.82rem;color:#4b5563;line-height:1.5;}\n.jz-tip{background:#fff8e1;border-left:4px solid #f59e0b;border-radius:0 6px 6px 0;padding:.9rem 1.2rem;margin:1.5rem 0;font-size:.94rem;}\n.jz-tip strong{color:#92400e;}\n.jz-note{background:#e8f5e9;border-left:4px solid #22c55e;border-radius:0 6px 6px 0;padding:.9rem 1.2rem;margin:1.5rem 0;font-size:.94rem;}\n.jz-note strong{color:#166534;}\n.jz-warning{background:#fff1f2;border-left:4px solid #ef4444;border-radius:0 6px 6px 0;padding:.9rem 1.2rem;margin:1.5rem 0;font-size:.94rem;}\n.jz-warning strong{color:#991b1b;}\n.jz-cta{background:linear-gradient(135deg,#003d82,#0072ce);border-radius:10px;padding:1.8rem 2rem;margin:2.5rem 0;text-align:center;color:#fff;}\n.jz-cta h3{color:#fff;margin:0 0 .5rem;font-size:1.25rem;font-family:'Trebuchet MS',sans-serif;}\n.jz-cta p{color:#d4e8ff;margin:0 0 1.1rem;font-size:.97rem;}\n.jz-cta a.jz-btn{display:inline-block;background:#fff;color:#003d82;font-family:'Trebuchet MS',sans-serif;font-weight:700;font-size:.93rem;padding:.65rem 1.6rem;border-radius:50px;text-decoration:none;margin:.25rem .35rem;}\n.jz-cta a.jz-btn:hover{background:#e0edff;}\n.jz-cta a.jz-btn.outline{background:transparent;color:#fff;border:2px solid rgba(255,255,255,.7);}\n.jz-faq-item{border:1px solid #d0e4f5;border-radius:8px;margin-bottom:.85rem;overflow:hidden;}\n.jz-faq-q{background:#f0f7ff;padding:.85rem 1.15rem;font-family:'Trebuchet MS',sans-serif;font-weight:600;font-size:.95rem;color:#0d2b55;}\n.jz-faq-a{padding:.8rem 1.15rem;font-size:.92rem;color:#374151;line-height:1.7;}\n.jz-back{font-size:.88rem;margin:0 0 1.75rem;color:#6b7280;}\n.jz-back a{color:#0072ce;}\n@media(max-width:600px){\n  .jz-art h1{font-size:1.6rem;}\n  .jz-art h2{font-size:1.3rem;}\n  .jz-intro-box,.jz-cta{padding:1.2rem 1.1rem;}\n  .jz-function-grid{grid-template-columns:1fr 1fr;}\n}\n<\/style>\n\n<div class=\"jz-art\">\n\n<p class=\"jz-back\">\u2190 Back to: <a href=\"https:\/\/jeez-semicon.com\/ru\/blog\/diamond-dicing-blades\/\" target=\"_blank\">Diamond Dicing Blades: The Complete Guide<\/a><\/p>\n\n<div class=\"jz-intro-box\">\n  <p>Deionised water is cheap, clean, and universally available \u2014 so why do semiconductor manufacturers formulate specialised coolant additives for dicing? Because the cutting zone of a dicing blade is not just a wet surface: it is a high-temperature, high-velocity abrasion interface where surface chemistry, heat transfer, particle dynamics, and electrochemical effects all interact simultaneously. This guide explains what DI water cannot do, what a properly formulated coolant additive can, and how to choose the right coolant for your substrate and blade type.<\/p>\n<\/div>\n\n<nav class=\"jz-toc\">\n  <div class=\"jz-toc-title\">\ud83d\udccb \u041e\u0433\u043b\u0430\u0432\u043b\u0435\u043d\u0438\u0435<\/div>\n  <ol>\n    <li><a href=\"#four-functions\">The Four Functions of Dicing Coolant<\/a><\/li>\n    <li><a href=\"#limits-of-di-water\">The Limits of Pure DI Water<\/a><\/li>\n    <li><a href=\"#what-additives-do\">What Coolant Additives Actually Do<\/a><\/li>\n    <li><a href=\"#material-requirements\">Coolant Requirements by Substrate Material<\/a><\/li>\n    <li><a href=\"#concentration\">Concentration, Mixing, and Maintenance<\/a><\/li>\n    <li><a href=\"#blade-compatibility\">Coolant and Blade Compatibility<\/a><\/li>\n    <li><a href=\"#nozzle-setup\">Nozzle Setup and Flow Rate<\/a><\/li>\n    <li><a href=\"#faq\">\u0427\u0430\u0441\u0442\u043e \u0437\u0430\u0434\u0430\u0432\u0430\u0435\u043c\u044b\u0435 \u0432\u043e\u043f\u0440\u043e\u0441\u044b<\/a><\/li>\n  <\/ol>\n<\/nav>\n\n\n<h2 id=\"four-functions\">1. The Four Functions of Dicing Coolant<\/h2>\n\n<p>Regardless of whether plain DI water or a formulated coolant is used, any dicing fluid must simultaneously fulfil four distinct functions at the cutting zone. Understanding these functions is the starting point for understanding why DI water alone is inadequate for demanding applications.<\/p>\n\n<div class=\"jz-function-grid\">\n  <div class=\"jz-function-card\">\n    <div class=\"fc-icon\">\ud83c\udf21\ufe0f<\/div>\n    <div class=\"fc-title\">Thermal Management<\/div>\n    <div class=\"fc-desc\">Remove heat generated by friction between diamond grains and substrate to prevent thermal damage and subsurface cracking.<\/div>\n  <\/div>\n  <div class=\"jz-function-card\">\n    <div class=\"fc-icon\">\ud83d\udd27<\/div>\n    <div class=\"fc-title\">Lubrication<\/div>\n    <div class=\"fc-desc\">Reduce friction at the blade\u2013workpiece interface, lowering cutting forces and heat generation per unit cut length.<\/div>\n  <\/div>\n  <div class=\"jz-function-card\">\n    <div class=\"fc-icon\">\ud83c\udf0a<\/div>\n    <div class=\"fc-title\">Swarf Flushing<\/div>\n    <div class=\"fc-desc\">Carry cut debris out of the kerf to prevent it from re-embedding in the blade matrix (loading) or scratching the die surface.<\/div>\n  <\/div>\n  <div class=\"jz-function-card\">\n    <div class=\"fc-icon\">\u26a1<\/div>\n    <div class=\"fc-title\">Static Control<\/div>\n    <div class=\"fc-desc\">Dissipate electrostatic charge generated by high-speed abrasion, which would otherwise attract contamination particles to sensitive die surfaces.<\/div>\n  <\/div>\n<\/div>\n\n<p>DI water performs the thermal management and swarf flushing functions adequately for many standard silicon applications. It is the other two functions \u2014 lubrication and static control \u2014 where its limitations become apparent, and where coolant additives deliver measurable process improvements.<\/p>\n\n\n<h2 id=\"limits-of-di-water\">2. The Limits of Pure DI Water<\/h2>\n\n<h3>High Surface Tension<\/h3>\n<p>DI water has a surface tension of approximately <strong>72 mN\/m<\/strong> \u2014 one of the highest of any common liquid. In the narrow kerf created by a dicing blade (often 30\u2013200 \u00b5m wide), high surface tension impedes the coolant&#8217;s ability to wet the cutting surface fully and flush swarf efficiently. The result is that debris accumulates in the kerf more readily, increasing blade loading and back-side chipping.<\/p>\n\n<h3>No Boundary Lubrication<\/h3>\n<p>Pure water provides hydrodynamic lubrication (a thin fluid film) but essentially no <strong>boundary lubrication<\/strong> \u2014 the chemical adsorption of lubricant molecules onto solid surfaces that reduces metal-to-metal and diamond-to-substrate contact friction. Without boundary lubrication, cutting forces are higher, heat generation per grain impact is greater, and blade bond matrix wear is accelerated.<\/p>\n\n<h3>Electrostatic Charge Accumulation<\/h3>\n<p>High-speed abrasion at the cutting zone generates triboelectric charge on both the diced die surfaces and the suspended swarf particles. DI water&#8217;s very low ion concentration \u2014 which makes it electrically pure \u2014 paradoxically makes it a poor medium for charge dissipation. On materials such as LiNbO\u2083 (pyroelectric) and high-resistivity silicon, charge accumulation attracts contamination particles to die surfaces in ways that are not removed by subsequent rinsing.<\/p>\n\n<h3>No Corrosion Protection<\/h3>\n<p>Metal bond blades contain sintered metallic matrices \u2014 typically copper, tin, cobalt, or iron alloys. Prolonged exposure to DI water accelerates corrosion of exposed metal surfaces at the blade rim, gradually degrading the bond integrity and shortening blade life. Plain DI water offers no corrosion inhibition.<\/p>\n\n\n<h2 id=\"what-additives-do\">3. What Coolant Additives Actually Do<\/h2>\n\n<p>A properly formulated dicing coolant additive addresses each of the DI water limitations described above through specific chemical mechanisms:<\/p>\n\n<ul>\n  <li><strong>Surfactants (surface-active agents):<\/strong> Reduce surface tension from ~72 mN\/m to as low as 25\u201335 mN\/m, dramatically improving kerf wetting, swarf flushing, and coolant penetration to the blade\u2013workpiece interface. The practical result is lower back-side chipping and reduced blade loading on fine-kerf cuts.<\/li>\n  <li><strong>Boundary lubricant molecules:<\/strong> Polar molecules that adsorb onto the substrate surface and diamond grains, forming a thin molecular film that reduces friction without impeding coolant flow. This lowers cutting force, reduces heat generation per cut, and improves blade life \u2014 particularly on hard materials where cutting forces are already high.<\/li>\n  <li><strong>Anti-static agents:<\/strong> Low-concentration ionic or non-ionic compounds that provide sufficient conductivity to dissipate triboelectric charge without introducing ionic contamination that could affect device electrical performance. Critical for LiNbO\u2083, high-resistivity Si, and certain MEMS applications.<\/li>\n  <li><strong>Corrosion inhibitors:<\/strong> Film-forming agents that passivate exposed metal surfaces on metal bond blades, preventing oxidation and extending blade life. Important for any application using metal bond blades in continuous or high-volume production.<\/li>\n  <li><strong>Foam suppressants:<\/strong> Prevent excessive foam formation at high flow rates that can obstruct vision system cameras and flow sensors, particularly in enclosed dicing saw designs.<\/li>\n<\/ul>\n\n<div class=\"jz-note\">\n  <strong>\ud83d\udccc Quantified Benefit:<\/strong> Published process studies on silicon wafer dicing have reported reductions in back-side chipping of 20\u201340% and blade life extensions of 15\u201330% when switching from plain DI water to an optimised coolant additive formulation \u2014 with no change to blade type, spindle speed, or feed rate.\n<\/div>\n\n\n<h2 id=\"material-requirements\">4. Coolant Requirements by Substrate Material<\/h2>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead>\n      <tr>\n        <th>\u041c\u0430\u0442\u0435\u0440\u0438\u0430\u043b<\/th>\n        <th>Primary Coolant Requirement<\/th>\n        <th>Recommended Additive Function<\/th>\n      <\/tr>\n    <\/thead>\n    <tbody>\n      <tr>\n        <td>\u041a\u0440\u0435\u043c\u043d\u0438\u0439 (Si)<\/td>\n        <td>Swarf flushing; moderate heat removal<\/td>\n        <td>Surfactant + mild lubricant<\/td>\n      <\/tr>\n      <tr>\n        <td>\u041a\u0430\u0440\u0431\u0438\u0434 \u043a\u0440\u0435\u043c\u043d\u0438\u044f (SiC)<\/td>\n        <td>High heat removal; blade protection<\/td>\n        <td>High-lubricity additive + corrosion inhibitor; high flow rate essential<\/td>\n      <\/tr>\n      <tr>\n        <td>\u0410\u0440\u0441\u0435\u043d\u0438\u0434 \u0433\u0430\u043b\u043b\u0438\u044f (GaAs)<\/td>\n        <td>Arsenic swarf containment; low force<\/td>\n        <td>Surfactant for swarf capture; anti-static<\/td>\n      <\/tr>\n      <tr>\n        <td>\u0421\u0430\u043f\u0444\u0438\u0440<\/td>\n        <td>High heat removal; fine swarf<\/td>\n        <td>High-lubricity + surfactant; high flow rate<\/td>\n      <\/tr>\n      <tr>\n        <td>LiNbO\u2083 \/ LiTaO\u2083<\/td>\n        <td>Anti-static; thermal shock prevention<\/td>\n        <td>Anti-static agent; consistent flow rate critical<\/td>\n      <\/tr>\n      <tr>\n        <td>Glass \/ Quartz<\/td>\n        <td>Micro-crack prevention; clean surface<\/td>\n        <td>Surfactant + lubricant<\/td>\n      <\/tr>\n      <tr>\n        <td>QFN \/ Laminate Package<\/td>\n        <td>Copper swarf management; clean cuts<\/td>\n        <td>Surfactant; anti-foam to protect vision system<\/td>\n      <\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<p>For SiC dicing in particular, coolant performance is not optional \u2014 the extreme heat generated at Mohs 9.5 hardness makes thermal management at the cutting interface a direct determinant of both die edge quality and blade life. Our detailed <a href=\"https:\/\/jeez-semicon.com\/ru\/blog\/dicing-blade-for-sic-wafers-challenges-and-best-practices\/\" target=\"_blank\">SiC dicing guide<\/a> covers coolant configuration in the context of the full SiC process parameter set.<\/p>\n\n\n<h2 id=\"concentration\">5. Concentration, Mixing, and Maintenance<\/h2>\n\n<p>Most dicing coolant additives are supplied as a concentrate to be diluted with DI water at the point of use. Typical use concentrations range from <strong>0.1% to 1.0% by volume<\/strong>, depending on the additive formulation and the substrate being cut. Operating at below the recommended concentration reduces the lubrication and anti-static benefits; operating above it may cause foam accumulation, leave residue on die surfaces, or \u2014 in the case of ionic anti-static agents \u2014 introduce contamination concerns.<\/p>\n\n<h3>Practical Maintenance Guidelines<\/h3>\n<ul>\n  <li>Prepare fresh coolant solutions at the start of each production shift \u2014 do not reuse coolant that has accumulated significant swarf loading.<\/li>\n  <li>Use the coolant manufacturer&#8217;s recommended DI water resistivity (typically &gt;1 M\u03a9\u00b7cm) to avoid introducing ion contamination from the diluent water.<\/li>\n  <li>Inspect coolant delivery nozzles for blockage before each production run. Blocked nozzles are a common cause of sudden chipping escalation mid-lot.<\/li>\n  <li>Clean the saw coolant tank and delivery lines at the frequency specified by the saw manufacturer \u2014 coolant residue and biological growth can block filters and nozzles.<\/li>\n<\/ul>\n\n<div class=\"jz-tip\">\n  <strong>\ud83d\udca1 Concentration Verification:<\/strong> Use a refractometer to verify coolant concentration at the point of use, especially after tank refills. A refractometer provides a quick, non-destructive check that the dilution ratio is within specification.\n<\/div>\n\n\n<h2 id=\"blade-compatibility\">6. Coolant and Blade Compatibility<\/h2>\n\n<p>Not all coolant additives are compatible with all blade bond types. Key compatibility considerations include:<\/p>\n\n<ul>\n  <li><strong>Resin bond blades:<\/strong> Strongly alkaline coolant formulations (pH above ~9) can accelerate degradation of some resin bond matrices over extended exposure. Verify pH compatibility with the blade manufacturer before switching coolant formulations.<\/li>\n  <li><strong>Metal bond blades:<\/strong> Benefit most from corrosion inhibitor additives. Avoid chloride-containing additives that can accelerate corrosion of copper-based bond alloys.<\/li>\n  <li><strong>Electroformed nickel bond blades:<\/strong> Nickel is relatively corrosion-resistant but can be affected by strongly acidic or strongly oxidising coolant additives. Use pH-neutral to mildly alkaline formulations.<\/li>\n<\/ul>\n\n<p>At Jizhi Electronic Technology, our coolant formulations are developed and tested in conjunction with our resin bond, metal bond, and nickel bond dicing blade product lines to ensure full compatibility across the consumable system. This integrated approach eliminates the guesswork of matching independently sourced coolant additives to blade specifications.<\/p>\n\n\n<h2 id=\"nozzle-setup\">7. Nozzle Setup and Flow Rate<\/h2>\n\n<p>Even the best coolant formulation delivers no benefit if it is not reaching the cutting zone effectively. Nozzle setup is a frequently overlooked process variable with a direct impact on chipping and blade life.<\/p>\n\n<ul>\n  <li><strong>Nozzle positioning:<\/strong> Both the front nozzle (upstream of the cut) and rear nozzle (downstream) should be directed at the blade\u2013workpiece contact point, not at the wafer surface away from the cut. Typical nozzle-to-blade clearance is 3\u20138 mm.<\/li>\n  <li><strong>Flow rate:<\/strong> Standard recommendation is 1.0\u20131.5 L\/min per nozzle for silicon dicing; increase to 1.5\u20132.5 L\/min for hard materials (SiC, sapphire) where heat generation is higher.<\/li>\n  <li><strong>Nozzle inspection:<\/strong> Clean nozzles with DI water flush before each production run and replace any nozzle showing scaling, blockage, or spray pattern distortion.<\/li>\n<\/ul>\n\n<hr>\n\n<div class=\"jz-cta\">\n  <h3>Coolant and Blade \u2014 Engineered Together<\/h3>\n  <p>Jizhi Electronic Technology offers dicing blade and coolant additive solutions developed and qualified as a system. Contact our team to discuss the right coolant formulation for your substrate, blade type, and production environment.<\/p>\n  <a href=\"https:\/\/jeez-semicon.com\/ru\/contact\/\" target=\"_blank\" class=\"jz-btn\">Request a Coolant Recommendation<\/a>\n  <a href=\"https:\/\/jeez-semicon.com\/ru\/semi-categories\/dicing_blade\/\" target=\"_blank\" class=\"jz-btn outline\">View Dicing Blades<\/a>\n<\/div>\n\n\n<h2 id=\"faq\">\u0427\u0430\u0441\u0442\u043e \u0437\u0430\u0434\u0430\u0432\u0430\u0435\u043c\u044b\u0435 \u0432\u043e\u043f\u0440\u043e\u0441\u044b<\/h2>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Can coolant additives leave residue on die surfaces that affects downstream bonding?<\/div>\n  <div class=\"jz-faq-a\">Poorly formulated or over-concentrated coolant additives can leave organic residue on die surfaces that interferes with wire bond adhesion or flip-chip underfill wetting. A well-formulated additive at the correct concentration should rinse cleanly from die surfaces with the standard DI water rinse cycle. If residue is a concern, request surface cleanliness data from the additive supplier and run a die surface cleanliness qualification before production use.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Does coolant temperature affect dicing performance?<\/div>\n  <div class=\"jz-faq-a\">Yes. Coolant delivered at significantly above ambient temperature (e.g., from a warm supply tank) reduces the temperature differential between the cutting zone and the coolant, diminishing heat removal effectiveness. For hard-material dicing (SiC, sapphire) where thermal management is critical, chilling the coolant to 15\u201318\u00b0C can measurably improve die edge quality and blade life. For standard Si dicing, ambient-temperature coolant is generally sufficient.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Is there a risk of biological growth in diluted coolant solutions?<\/div>\n  <div class=\"jz-faq-a\">Yes, particularly in warm, low-circulation coolant tanks. Biological growth produces biofilm that can block nozzles and filters, generate odour, and introduce organic contamination to the dicing process. Use coolant solutions within the recommended pot life (typically 24\u201372 hours after preparation), clean tanks regularly, and choose additive formulations with biostatic properties if tank changeover frequency is limited.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Does using a coolant additive change the required blade dressing frequency?<\/div>\n  <div class=\"jz-faq-a\">In most cases, a good coolant additive reduces the required dressing frequency. Better lubrication reduces the heat-driven bond hardening that causes glazing, and better swarf flushing reduces loading \u2014 both of which are primary triggers for dressing. Some processes report going from dressing every 10 wafers to every 20\u201330 wafers after switching from DI water to an optimised coolant additive, with equivalent or better chipping performance. This varies by material and blade type.<\/div>\n<\/div>\n\n<p style=\"margin-top:2rem;font-size:.9rem;color:#6b7280;\">\u21a9 Return to the full guide: <a href=\"https:\/\/jeez-semicon.com\/ru\/blog\/diamond-dicing-blades\/\" target=\"_blank\">Diamond Dicing Blades \u2014 The Complete Guide<\/a><\/p>\n\n<\/div><!-- \/.jz-art -->","protected":false},"excerpt":{"rendered":"<p>\u2190 Back to: Diamond Dicing Blades: The Complete Guide Deionised water is cheap, clean, and universally available \u2014 so why do semiconductor manufacturers formulate specialised coolant additives for dicing? Because  &#8230;<\/p>","protected":false},"author":1,"featured_media":1746,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-1716","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/posts\/1716","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/comments?post=1716"}],"version-history":[{"count":2,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/posts\/1716\/revisions"}],"predecessor-version":[{"id":1718,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/posts\/1716\/revisions\/1718"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/media\/1746"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/media?parent=1716"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/categories?post=1716"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/tags?post=1716"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}