{"id":2109,"date":"2026-05-19T14:10:05","date_gmt":"2026-05-19T06:10:05","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=2109"},"modified":"2026-05-19T14:15:54","modified_gmt":"2026-05-19T06:15:54","slug":"cmp-polishing-pad-types-selection-performance-guide","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/ru\/blog\/cmp-polishing-pad-types-selection-performance-guide\/","title":{"rendered":"CMP Polishing Pad:Types, Selection &#038; Performance Guide"},"content":{"rendered":"<!-- ============================================================\r\n     JEEZ \u2014 Cluster Article 04\r\n     CMP Polishing Pad: Types, Selection & Performance Guide\r\n     Updated: May 2026\r\n     ============================================================ -->\r\n<p><style>\r\n@import url('https:\/\/fonts.googleapis.com\/css2?family=Syne:wght@400;600;700;800&family=Inter:wght@400;500;600&display=swap');\r\n:root{--jeez-navy:#0a1628;--jeez-blue:#1a4fa8;--jeez-sky:#2d7dd2;--jeez-accent:#00c8a0;--jeez-light:#f0f5ff;--jeez-border:#d8e4f5;--jeez-text:#1e293b;--jeez-muted:#64748b;--jeez-white:#ffffff;--radius-sm:6px;--radius-md:12px;--radius-lg:20px;--shadow-sm:0 2px 8px rgba(26,79,168,.08);--shadow-md:0 6px 24px rgba(26,79,168,.12);--font-head:'Syne',sans-serif;--font-body:'Inter',sans-serif;--max-w:860px}\r\n.jc *{box-sizing:border-box;margin:0;padding:0}\r\n.jc{font-family:var(--font-body);color:var(--jeez-text);line-height:1.75;font-size:16px;max-width:var(--max-w);margin:0 auto}\r\n.jc-hero{background:linear-gradient(135deg,#0a1628 0%,#0f2d5e 55%,#1a4fa8 100%);border-radius:var(--radius-lg);padding:52px 44px;margin-bottom:44px;position:relative;overflow:hidden}\r\n.jc-hero::before{content:'';position:absolute;top:-50px;right:-50px;width:280px;height:280px;border-radius:50%;background:rgba(0,200,160,.07);pointer-events:none}\r\n.jc-hero-label{display:inline-block;font-size:11px;font-weight:600;letter-spacing:.12em;text-transform:uppercase;color:var(--jeez-accent);background:rgba(0,200,160,.12);border:1px solid rgba(0,200,160,.3);border-radius:20px;padding:4px 14px;margin-bottom:18px}\r\n.jc-hero h1{font-family:var(--font-head);font-size:clamp(22px,3.5vw,36px);font-weight:800;color:#fff;line-height:1.2;margin-bottom:16px;position:relative;z-index:1}\r\n.jc-hero h1 span{color:var(--jeez-accent)}\r\n.jc-hero-intro{font-size:16px;color:rgba(255,255,255,.82);max-width:620px;line-height:1.7;position:relative;z-index:1}\r\n.jc-hero-meta{display:flex;gap:20px;margin-top:24px;flex-wrap:wrap;position:relative;z-index:1}\r\n.jc-hero-meta span{font-size:12px;color:rgba(255,255,255,.6)}\r\n.jc-toc{background:var(--jeez-light);border:1.5px solid var(--jeez-border);border-left:5px solid var(--jeez-blue);border-radius:var(--radius-md);padding:26px 30px;margin-bottom:44px}\r\n.jc-toc-title{font-family:var(--font-head);font-size:13px;font-weight:700;color:var(--jeez-navy);text-transform:uppercase;letter-spacing:.08em;margin-bottom:14px}\r\n.jc-toc ol{list-style:none;counter-reset:tc;display:grid;grid-template-columns:1fr 1fr;gap:5px 28px}\r\n@media(max-width:560px){.jc-toc ol{grid-template-columns:1fr}}\r\n.jc-toc ol li{counter-increment:tc;display:flex;align-items:flex-start;gap:7px;font-size:13px;line-height:1.5}\r\n.jc-toc ol li::before{content:counter(tc,decimal-leading-zero);font-size:11px;font-weight:600;color:var(--jeez-blue);min-width:20px;margin-top:2px}\r\n.jc-toc ol li a{color:var(--jeez-blue);text-decoration:none}\r\n.jc-toc ol li a:hover{color:var(--jeez-accent);text-decoration:underline}\r\n.jc h2{font-family:var(--font-head);font-size:clamp(19px,2.8vw,25px);font-weight:700;color:var(--jeez-navy);margin:48px 0 16px;padding-bottom:11px;border-bottom:2px solid var(--jeez-border);scroll-margin-top:80px}\r\n.jc h2 .acc{display:inline-block;width:32px;height:4px;background:var(--jeez-accent);border-radius:2px;margin-right:9px;vertical-align:middle;margin-bottom:3px}\r\n.jc h3{font-family:var(--font-head);font-size:17px;font-weight:600;color:var(--jeez-navy);margin:28px 0 11px}\r\n.jc p{margin-bottom:16px}\r\n.jc strong{font-weight:600;color:var(--jeez-navy)}\r\n.jc a.jl{color:var(--jeez-sky);text-decoration:none;font-weight:500;border-bottom:1.5px solid rgba(45,125,210,.3);transition:color .2s,border-color .2s}\r\n.jc a.jl:hover{color:var(--jeez-accent);border-bottom-color:var(--jeez-accent)}\r\n.jc-highlight{background:linear-gradient(135deg,#e8f4ff 0%,#f0fff9 100%);border:1px solid var(--jeez-border);border-left:5px solid var(--jeez-accent);border-radius:var(--radius-md);padding:20px 24px;margin:24px 0;font-size:15px}\r\n.jc-card-grid{display:grid;grid-template-columns:repeat(auto-fit,minmax(200px,1fr));gap:14px;margin:24px 0}\r\n.jc-card{background:var(--jeez-white);border:1px solid var(--jeez-border);border-radius:var(--radius-md);padding:20px;box-shadow:var(--shadow-sm);transition:transform .2s,box-shadow .2s}\r\n.jc-card:hover{transform:translateY(-3px);box-shadow:var(--shadow-md)}\r\n.jc-card-icon{width:42px;height:42px;border-radius:9px;background:var(--jeez-light);display:flex;align-items:center;justify-content:center;margin-bottom:12px;font-size:20px}\r\n.jc-card h4{font-family:var(--font-head);font-size:14px;font-weight:700;color:var(--jeez-navy);margin-bottom:7px}\r\n.jc-card p{font-size:13px;color:var(--jeez-muted);margin:0;line-height:1.55}\r\n.jc-table-wrap{overflow-x:auto;margin:24px 0;border-radius:var(--radius-md);box-shadow:var(--shadow-sm)}\r\n.jc-table{width:100%;border-collapse:collapse;font-size:14px}\r\n.jc-table thead tr{background:var(--jeez-navy)}\r\n.jc-table thead th{padding:12px 16px;text-align:left;color:#fff;font-family:var(--font-head);font-size:12px;font-weight:600;letter-spacing:.04em}\r\n.jc-table tbody tr{border-bottom:1px solid var(--jeez-border)}\r\n.jc-table tbody tr:nth-child(odd){background:var(--jeez-light)}\r\n.jc-table tbody tr:nth-child(even){background:var(--jeez-white)}\r\n.jc-table tbody td{padding:12px 16px;color:var(--jeez-text);vertical-align:top}\r\n.jc-table tbody td:first-child{font-weight:600;color:var(--jeez-navy)}\r\n.jc-callout{background:var(--jeez-white);border:1px solid var(--jeez-border);border-radius:var(--radius-md);padding:22px 26px;margin:28px 0;display:flex;gap:16px;box-shadow:var(--shadow-sm)}\r\n.jc-callout-icon{font-size:26px;flex-shrink:0;line-height:1}\r\n.jc-callout-body 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a:hover{opacity:.85}\r\n.jc-tag{display:inline-block;font-size:11px;font-weight:600;letter-spacing:.07em;text-transform:uppercase;background:var(--jeez-light);color:var(--jeez-blue);border:1px solid var(--jeez-border);border-radius:4px;padding:3px 8px;margin-right:5px;margin-bottom:4px}\r\n<\/style><\/p>\r\n<div class=\"jc\">\r\n<div class=\"jc-hero\">\r\n<div class=\"jc-hero-label\">Materials Engineering \u00b7 Updated May 2026<\/div>\r\n<p class=\"jc-hero-intro\">Everything process engineers need to know about CMP polishing pads \u2014 covering material types, hardness trade-offs, groove geometry, pad conditioning, multi-stack configurations, lifetime management, and selection criteria for every major CMP application in semiconductor manufacturing.<\/p>\r\n<div class=\"jc-hero-meta\">\u23f1 12 min read\ud83d\udccb ~2,800 words\ud83c\udfed By JEEZ Technical Team<\/div>\r\n<\/div>\r\n<div class=\"jc-toc\">\r\n<div class=\"jc-toc-title\">\u041e\u0433\u043b\u0430\u0432\u043b\u0435\u043d\u0438\u0435<\/div>\r\n<ol>\r\n<li><a href=\"#pad-function\">The Role of the Polishing Pad<\/a><\/li>\r\n<li><a href=\"#pad-materials\">Pad Materials and Construction<\/a><\/li>\r\n<li><a href=\"#hardness-tradeoff\">Hardness Trade-Off: Performance vs Defects<\/a><\/li>\r\n<li><a href=\"#groove-geometry\">Groove Geometry and Slurry Transport<\/a><\/li>\r\n<li><a href=\"#pad-types-table\">Pad Types Comparison Table<\/a><\/li>\r\n<li><a href=\"#conditioning\">Pad Conditioning: The Critical Variable<\/a><\/li>\r\n<li><a href=\"#pad-lifetime\">Pad Lifetime Management<\/a><\/li>\r\n<li><a href=\"#multi-stack\">Multi-Stack and Fixed-Abrasive Pads<\/a><\/li>\r\n<li><a href=\"#selection-guide\">Pad Selection Guide by Application<\/a><\/li>\r\n<\/ol>\r\n<\/div>\r\n<h2 id=\"pad-function\">The Role of the Polishing Pad in CMP<\/h2>\r\n<p>The polishing pad is the physical interface between the slurry and the wafer \u2014 yet it is far more than a passive carrier. The pad&#8217;s mechanical properties govern how uniformly polishing pressure is distributed across the wafer; its surface texture determines how efficiently slurry is transported to and retained at the polishing interface; and its conditioning response defines how removal rate stability evolves over the pad&#8217;s lifetime.<\/p>\r\n<p>In the CMP process, the pad and the slurry function as an inseparable system. A well-chosen slurry paired with a poorly matched pad will underperform relative to either component&#8217;s individual capability. Conversely, a meticulously formulated slurry can be compromised by a glazed, worn, or incorrectly conditioned pad. For this reason, polishing pad qualification should always be performed in conjunction with slurry qualification, never independently. See the <a class=\"jl\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/cmp-semiconductor-the-complete-guide-to-chemical-mechanical-planarization\/\" target=\"_blank\" rel=\"noopener\">CMP Complete Guide<\/a> and the <a class=\"jl\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/CMP-Slurry-Guide-Types-Selection-Optimization\/\" target=\"_blank\" rel=\"noopener\">CMP Slurry Guide<\/a> for the broader context.<\/p>\r\n<div class=\"jc-highlight\"><strong>Core principle:<\/strong> The polishing pad controls <em>how<\/em> the slurry meets the wafer. Pad hardness controls global planarization efficiency; pad surface texture controls removal rate and uniformity; pad conditioning controls rate stability over time. Getting all three right simultaneously is the challenge of pad process engineering.<\/div>\r\n<h2 id=\"pad-materials\">Pad Materials and Construction<\/h2>\r\n<p>The vast majority of production CMP pads are constructed from polyurethane \u2014 a polymer whose mechanical properties (modulus, hardness, viscoelasticity) can be precisely tuned through formulation chemistry to meet the requirements of different CMP applications. Polyurethane pads are manufactured by casting the polymer into a sheet form, then cutting or punching to the required platen size (typically 20\u201322 inches diameter for 300 mm tools).<\/p>\r\n<h3>Closed-Pore vs Open-Pore Structures<\/h3>\r\n<p>Conventional polyurethane CMP pads have a <strong>closed-pore microstructure<\/strong> created by incorporating hollow microspheres (typically polymethyl methacrylate, PMMA, or blown using chemical foaming agents) into the polymer matrix during casting. These pores serve two critical functions: they reduce the effective modulus of the pad surface layer, improving surface contact uniformity; and as the pad is conditioned and the surface is abraded away, newly opened pores continuously refresh the pad surface texture, maintaining slurry hold-up and transport capability.<\/p>\r\n<p>The pore size, density, and distribution within the pad are tightly controlled manufacturing parameters. Larger pores and higher pore density create a softer, more compliant pad with better slurry retention but reduced planarization efficiency. Smaller, denser pores give a harder pad with better planarization but reduced slurry retention and potentially higher defect density.<\/p>\r\n<h3>Felt \/ Impregnated Pads<\/h3>\r\n<p>A second category of CMP pads uses a polyurethane-impregnated non-woven felt structure. These pads are significantly softer and more compliant than cast polyurethane pads and are used primarily as <strong>sub-pads<\/strong> in two-layer pad stacks or as final-buff pads for surface finish improvement. Their high compliance allows them to conform closely to local surface topography, making them effective at removing haze and light surface defects but poor at global planarization.<\/p>\r\n<h2 id=\"hardness-tradeoff\">The Hardness Trade-Off: Planarization vs Defects<\/h2>\r\n<p>Pad hardness is the most critical single parameter in pad selection, and it embodies the fundamental tension in CMP process engineering: the same hardness that delivers superior planarization efficiency also tends to increase scratch defect density.<\/p>\r\n<div class=\"jc-two-col\">\r\n<div class=\"jc-col-box\">\r\n<h4>Hard Pads (e.g., IC1000 class)<\/h4>\r\n<ul>\r\n<li>Shore D hardness: 55\u201365<\/li>\r\n<li>High global planarization efficiency<\/li>\r\n<li>Excellent within-wafer uniformity on raised features<\/li>\r\n<li>Less conformance to local topography \u2014 reduces dishing<\/li>\r\n<li>Higher contact stress at asperities \u2192 higher scratch risk<\/li>\r\n<li>Preferred for: oxide ILD, STI, tungsten plug CMP<\/li>\r\n<\/ul>\r\n<\/div>\r\n<div class=\"jc-col-box\">\r\n<h4>Soft Pads (e.g., Politex \/ SUBA class)<\/h4>\r\n<ul>\r\n<li>Shore A hardness: 30\u201350<\/li>\r\n<li>High conformance to local and global topography<\/li>\r\n<li>Lower contact stress \u2192 fewer scratches, better surface finish<\/li>\r\n<li>Lower planarization efficiency \u2014 higher dishing in wide features<\/li>\r\n<li>Better slurry retention<\/li>\r\n<li>Preferred for: copper buff\/finish step, final surface cleaning<\/li>\r\n<\/ul>\r\n<\/div>\r\n<\/div>\r\n<p>The solution to this trade-off in production is the <strong>two-platen approach<\/strong>: the primary polishing platen uses a hard pad for bulk material removal and planarization, while the secondary platen uses a soft pad for a brief over-polish \/ buff step that removes surface defects introduced by the hard pad without re-introducing planarization non-uniformity. This approach is standard in copper CMP modules at all advanced fabs.<\/p>\r\n<h2 id=\"groove-geometry\">Groove Geometry and Slurry Transport<\/h2>\r\n<p>Polishing pads are manufactured with a pattern of grooves on their surface that serve the critical function of distributing slurry evenly across the pad surface and transporting it to the pad-wafer contact zone. Without grooves, slurry would pool in the centre of the pad and starve the outer radii, creating severe radial removal rate non-uniformity.<\/p>\r\n<h3>Common Groove Patterns<\/h3>\r\n<ul class=\"jc-ul\">\r\n<li><strong>Concentric rings:<\/strong> Simple circular grooves concentric with the pad centre. Provide effective radial slurry distribution but limited circumferential mixing. The most common pattern for general oxide and STI CMP.<\/li>\r\n<li><strong>X-Y grid (perforated):<\/strong> Square or rectangular grid pattern. Provides excellent slurry distribution in all directions and effective transport of slurry reaction by-products away from the polishing interface. Preferred for copper CMP where reaction product removal is important.<\/li>\r\n<li><strong>Spiral:<\/strong> Continuous spiral groove from pad centre to edge. Combines properties of concentric and grid patterns. Provides smooth, continuous slurry renewal. Used in some tungsten and barrier CMP applications.<\/li>\r\n<li><strong>Radial:<\/strong> Grooves running from centre to edge. Promotes centrifugal slurry transport. Can cause circumferential removal rate variation if not combined with other groove elements.<\/li>\r\n<\/ul>\r\n<p>Groove width and depth also matter: wider and deeper grooves provide more slurry reservoir capacity and allow larger slurry flow rates, but they also reduce the effective pad contact area (the &#8220;land&#8221; area between grooves), which can reduce removal rate. Typical groove width is 0.5\u20131.5 mm; depth is 0.4\u20131.0 mm.<\/p>\r\n<h2 id=\"pad-types-table\">CMP Pad Types: Comparison Table<\/h2>\r\n<div class=\"jc-table-wrap\">\r\n<table class=\"jc-table\">\r\n<thead>\r\n<tr>\r\n<th>\u0422\u0438\u043f \u043a\u043e\u043b\u043e\u0434\u043a\u0438<\/th>\r\n<th>Construction<\/th>\r\n<th>\u0422\u0432\u0435\u0440\u0434\u043e\u0441\u0442\u044c<\/th>\r\n<th>Planarization<\/th>\r\n<th>\u0420\u0438\u0441\u043a \u0434\u0435\u0444\u0435\u043a\u0442\u043e\u0432<\/th>\r\n<th>\u0422\u0438\u043f\u043e\u0432\u043e\u0435 \u043f\u0440\u0438\u043c\u0435\u043d\u0435\u043d\u0438\u0435<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>IC1000 class (hard)<\/td>\r\n<td>Cast polyurethane, closed-pore<\/td>\r\n<td>Shore D 58\u201365<\/td>\r\n<td>\u041f\u0440\u0435\u0432\u043e\u0441\u0445\u043e\u0434\u043d\u043e<\/td>\r\n<td>Medium\u2013High<\/td>\r\n<td>Oxide ILD, STI, W plug, Cu bulk<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>IC1010 \/ IC1400 (medium)<\/td>\r\n<td>Cast polyurethane, closed-pore<\/td>\r\n<td>Shore D 50\u201358<\/td>\r\n<td>\u0425\u043e\u0440\u043e\u0448\u043e<\/td>\r\n<td>\u0421\u0440\u0435\u0434\u043d\u0438\u0439<\/td>\r\n<td>General purpose, Cu barrier step<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Politex \/ SUBA (soft)<\/td>\r\n<td>PU-impregnated felt<\/td>\r\n<td>Shore A 35\u201350<\/td>\r\n<td>\u041d\u0438\u0437\u043a\u0438\u0439<\/td>\r\n<td>\u041e\u0447\u0435\u043d\u044c \u043d\u0438\u0437\u043a\u0438\u0439<\/td>\r\n<td>Cu buff\/finish, final polish, low-k<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Two-layer stack (hard\/soft)<\/td>\r\n<td>Hard polyurethane + soft sub-pad<\/td>\r\n<td>Composite<\/td>\r\n<td>\u041e\u0447\u0435\u043d\u044c \u0445\u043e\u0440\u043e\u0448\u043e<\/td>\r\n<td>Low\u2013Medium<\/td>\r\n<td>Cu dual-damascene, barrier CMP<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Fixed-abrasive pad<\/td>\r\n<td>Abrasive embedded in polymer matrix<\/td>\r\n<td>\u0412\u044b\u0441\u043e\u043a\u0438\u0439<\/td>\r\n<td>\u041f\u0440\u0435\u0432\u043e\u0441\u0445\u043e\u0434\u043d\u043e<\/td>\r\n<td>Very Low (no free abrasive)<\/td>\r\n<td>STI (slurry-free), oxide, specialty<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>Microreplication pad<\/td>\r\n<td>PU with 3D-structured surface features<\/td>\r\n<td>Tunable<\/td>\r\n<td>\u041f\u0440\u0435\u0432\u043e\u0441\u0445\u043e\u0434\u043d\u043e<\/td>\r\n<td>\u041d\u0438\u0437\u043a\u0438\u0439<\/td>\r\n<td>Advanced nodes, hybrid bonding prep<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<h2 id=\"conditioning\">Pad Conditioning: The Critical Variable<\/h2>\r\n<p>Pad conditioning is the process of mechanically abrading the pad surface with a diamond-tipped conditioner disk during or between wafer polishing runs to restore the surface texture that degrades through &#8220;glazing.&#8221; It is not an optional maintenance step \u2014 without conditioning, CMP removal rates typically drop 20\u201340% after the first 10\u201320 wafer passes as the pad asperities are progressively flattened by polishing contact.<\/p>\r\n<h3>Glazing Mechanism<\/h3>\r\n<p>During polishing, mechanical contact between the pad and wafer, combined with the heat generated by friction, causes the pad surface asperities to plastically deform and flatten. Simultaneously, slurry reaction by-products and abraded material can fill and clog the pad&#8217;s pores. Both effects reduce the effective surface roughness that allows slurry to be trapped and transported at the polishing interface \u2014 this is &#8220;glazing.&#8221; A glazed pad has a characteristically smooth, shiny appearance and delivers substantially reduced removal rate.<\/p>\r\n<h3>Diamond Conditioner Disk Design<\/h3>\r\n<p>The conditioner disk is a metal substrate embedded with diamond grit particles \u2014 typically 100\u2013500 \u00b5m in size \u2014 that abrade the pad surface as the disk sweeps across it under controlled downforce (typically 2\u20136 lbs). Diamond grit size and distribution density determine the aggressiveness of conditioning and the surface roughness (Ra) of the conditioned pad. Coarser grit conditions more aggressively, maintaining higher removal rates, but generates more pad wear debris that can contribute to defects. Finer grit conditioning is gentler and preferred for applications where defect density is the primary concern.<\/p>\r\n<h3>In-Situ vs Ex-Situ Conditioning<\/h3>\r\n<p>In-situ conditioning occurs simultaneously with wafer polishing \u2014 the conditioner disk sweeps the pad surface while the wafer is being polished on a different zone of the same platen. This approach maintains steady-state pad surface roughness and removal rate and is the production standard. Ex-situ conditioning performs a conditioning sweep between wafer runs, while the platen is idle. Ex-situ conditioning is gentler and is used for final pad break-in or for applications where in-situ conditioning debris is a defect concern.<\/p>\r\n<h2 id=\"pad-lifetime\">Pad Lifetime Management<\/h2>\r\n<p>CMP pad lifetime \u2014 measured in number of wafer passes or polishing time \u2014 is determined by the progressive degradation of pad thickness through conditioning wear, the accumulation of slurry residue and by-products within the pad structure, and the evolution of pad mechanical properties with use. Expired pads must be replaced on a defined schedule before their performance degrades below specification, but premature replacement wastes expensive consumable material.<\/p>\r\n<ul class=\"jc-ul\">\r\n<li><strong>Thickness monitoring:<\/strong> Pads have a minimum usable thickness specification (typically 50% of new pad thickness). Continuous pad thickness monitoring \u2014 using in-situ optical sensors or periodic manual measurement \u2014 enables data-driven replacement scheduling.<\/li>\r\n<li><strong>Removal rate trending:<\/strong> Plotting mean removal rate per wafer run over pad life as a statistical process control (SPC) chart reveals performance degradation trends that predict approaching end-of-life before the pad actually fails specification.<\/li>\r\n<li><strong>Conditioner disk replacement:<\/strong> Conditioner disk wear directly impacts the quality of pad conditioning and, hence, pad performance. Disk replacement intervals must be defined and adhered to.<\/li>\r\n<li><strong>Pad storage:<\/strong> Unused pads must be stored flat in a cool, dry environment. Stack storage on their edges causes permanent pad distortion. Follow manufacturer storage guidelines strictly.<\/li>\r\n<\/ul>\r\n<h2 id=\"multi-stack\">Multi-Stack and Fixed-Abrasive Pads<\/h2>\r\n<h3>Two-Layer Pad Stacks<\/h3>\r\n<p>A two-layer pad stack combines a hard, closed-pore polyurethane polishing layer on top with a softer, more compressible sub-pad underneath. The sub-pad acts as a mechanical compliance layer that dampens thickness variations in the platen surface and allows the hard polishing layer to maintain more uniform contact across the wafer. The combined mechanical response provides better global planarization than a soft pad alone while reducing the contact stress peaks that cause scratches with a purely rigid hard pad. Two-layer stacks are the dominant configuration for copper dual-damascene CMP in advanced fabs.<\/p>\r\n<h3>Fixed-Abrasive Pads<\/h3>\r\n<p>Fixed-abrasive (FA) pads embed the abrasive particles directly into the pad surface in a structured polymer matrix, eliminating the need for free abrasive slurry during polishing. The pad surface contains millions of precisely shaped abrasive &#8220;caps&#8221; that are gradually consumed during polishing, continuously releasing fresh abrasive. FA pads offer extremely low defect density (since there are no free large particles in the polishing environment) and excellent pattern density-independent removal \u2014 making them attractive for STI CMP. Their primary limitation is cost and the complexity of the conditioning process required to activate the abrasive surface.<\/p>\r\n<h2 id=\"selection-guide\">Pad Selection Guide by Application<\/h2>\r\n<p>Selecting the correct pad for a specific CMP application requires balancing planarization efficiency, defect density, removal rate, and pad lifetime requirements. The table below provides application-specific guidance. Always validate pad selection in combination with the slurry system \u2014 refer to the <a class=\"jl\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/CMP-Slurry-Guide-Types-Selection-Optimization\/\" target=\"_blank\" rel=\"noopener\">CMP Slurry Guide<\/a> for the companion slurry selection guidance.<\/p>\r\n<div class=\"jc-callout\">\r\n<div class=\"jc-callout-icon\">\ud83d\udcbf<\/div>\r\n<div class=\"jc-callout-body\">\r\n<h4>JEEZ CMP Polishing Pads<\/h4>\r\n<p>JEEZ supplies hard, soft, and multi-layer CMP pad configurations covering oxide ILD, STI, copper dual-damascene, and advanced packaging applications. Custom groove patterns and dimensions are available. <a class=\"jl\" href=\"https:\/\/jeez-semicon.com\/ru\/contact\/\" target=\"_blank\" rel=\"noopener\">Contact JEEZ<\/a> to discuss your pad requirements, or explore the <a class=\"jl\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/CMP-Defect-Types-Root-Causes-Yield-Improvement\/\" target=\"_blank\" rel=\"noopener\">CMP Defect Guide<\/a> to understand how pad selection impacts yield.<\/p>\r\n<\/div>\r\n<\/div>\r\n<div class=\"jc-related\">\r\n<div class=\"jc-related-title\">Related Articles in This Series<\/div>\r\n<div class=\"jc-related-grid\"><a class=\"jc-related-link\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/cmp-semiconductor-the-complete-guide-to-chemical-mechanical-planarization\/\" target=\"_blank\" rel=\"noopener\"><span class=\"ico\">\ud83d\udcd6<\/span>CMP Complete Guide (Pillar)<\/a> <a class=\"jc-related-link\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/CMP-Slurry-Guide-Types-Selection-Optimization\/\" target=\"_blank\" rel=\"noopener\"><span class=\"ico\">\ud83e\uddea<\/span>CMP Slurry Guide<\/a> <a class=\"jc-related-link\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/CMP-Process-Step-by-Step-How-Wafer-Polishing-Works\/\" target=\"_blank\" rel=\"noopener\"><span class=\"ico\">\u2699\ufe0f<\/span>CMP Process Step-by-Step<\/a> <a class=\"jc-related-link\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/CMP-Defect-Types-Root-Causes-Yield-Improvement\/\" target=\"_blank\" rel=\"noopener\"><span class=\"ico\">\ud83d\udd0d<\/span>CMP Defects &amp; Yield<\/a> <a class=\"jc-related-link\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/Copper-CMP-vs-Tungsten-CMP-vs-Oxide-CMP-Full-Comparison\/\" target=\"_blank\" rel=\"noopener\"><span class=\"ico\">\u2696\ufe0f<\/span>Cu vs W vs Oxide CMP<\/a> <a class=\"jc-related-link\" href=\"https:\/\/jeez-semicon.com\/ru\/blog\/Post-CMP-Cleaning-Methods-Challenges-Best-Practices\/\" target=\"_blank\" rel=\"noopener\"><span class=\"ico\">\ud83e\udee7<\/span>Post-CMP Cleaning<\/a><\/div>\r\n<\/div>\r\n<div class=\"jc-cta\">\r\n<h3>Find the Right CMP Pad for Your Application<\/h3>\r\n<p>JEEZ engineers are ready to help you select and qualify the optimal polishing pad for your CMP process. Contact us for samples or technical consultation.<\/p>\r\n<a href=\"https:\/\/jeez-semicon.com\/ru\/contact\/\" target=\"_blank\" rel=\"noopener\">Contact JEEZ \u2192<\/a><\/div>\r\n<div style=\"margin-top: 28px;\"><span class=\"jc-tag\">CMP Polishing Pad<\/span> <span class=\"jc-tag\">\u041a\u043e\u043d\u0434\u0438\u0446\u0438\u043e\u043d\u0438\u0440\u043e\u0432\u0430\u043d\u0438\u0435 \u043f\u043e\u0432\u0435\u0440\u0445\u043d\u043e\u0441\u0442\u0438<\/span> <span class=\"jc-tag\">IC1000<\/span> <span class=\"jc-tag\">Pad Hardness<\/span> <span class=\"jc-tag\">Fixed Abrasive<\/span> <span class=\"jc-tag\">Pad Glazing<\/span> <span class=\"jc-tag\">Groove Geometry<\/span><\/div>\r\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Materials Engineering \u00b7 Updated May 2026 Everything process engineers need to know about CMP polishing pads \u2014 covering material types, hardness trade-offs, groove geometry, pad conditioning, multi-stack configurations, lifetime management,  &#8230;<\/p>","protected":false},"author":1,"featured_media":2111,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-2109","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/posts\/2109","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/comments?post=2109"}],"version-history":[{"count":3,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/posts\/2109\/revisions"}],"predecessor-version":[{"id":2136,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/posts\/2109\/revisions\/2136"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/media\/2111"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/media?parent=2109"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/categories?post=2109"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/ru\/wp-json\/wp\/v2\/tags?post=2109"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}