SiC Polishing Pad / Composite Non-Woven Pad / Domestic Alternative to SUBA 800

Product Category

JIZHI Electronics · Polishing Pads

Product Thickness

1.2–3 mm (customizable)

Groove Specifications

10 × 10–20 × 20 (Customizable)

Product Diameter

φ300–φ1300 mm (customizable)

Product Features

JIZHI Electronics polishing pads meet the polishing requirements of low-, medium-, and high-hardness materials. For the four-step SiC polishing process, different polishing pad models are matched accordingly, including grinding pads, fine grinding pads, rough polishing pads, and fine polishing pads. They offer advantages such as high removal rate, high flatness, low defectivity, and high cost performance.

Product Process and Applications: Made with a special fiber structure and highly wear-resistant polishing material, the pads are suitable for polishing SiC substrates, reclaimed wafers, various III-V and II-VI compound semiconductor wafers, such as sapphire, gallium arsenide, and aluminum nitride. They are also suitable for achieving high flatness on various substrates, window wafers, and glass wafers.

Features of JIZHI Electronics SiC Polishing Pads

1.Combining the advantages of both hard and soft grinding/polishing pads, they can balance workpiece flatness and uniformity.
2.Provide faster break-in and global flatness, improving the process stability and dimensional precision of SiC wafers.
3.With embossing and grooving processes, the pad maintains good polishing slurry/grinding slurry flowability, reduces sticking, and is easier to clean.
4.Made with special fiber materials, it is durable, wear-resistant, acid- and alkali-resistant, and highly cost-effective.

JIZHI Electronics SiC Substrate CMP Rough Polishing Process Results

In the actual application of the SiC rough polishing process, after polishing with JIZHI Electronics SiC polishing slurry (JZ-8010) and JZ3020 polishing pad, the SiC surface achieved an Ra value of 0.13 nm.

SiC Substrate CMP Fine Polishing Process
Verification Equipment	Double-Sided 36B
Wafer	6″SiC
Polishing Slurry	JZ-8010
Polishing Pad	JZ-3020
Pressure	350 g/cm2
Rotation Speed	40 rpm
Polishing Rate	2.5 µm/H
Surface Roughness	0.13 nm

JIZHI Electronics Damping Cloth Fine Polishing Pad Products

SiC Polishing Pad Auxiliary Material Parameters

Polishing Pad Back Adhesive:
Each JIZHI Electronics polishing pad can be supplied with back adhesive according to customer requirements, including 3M or domestic adhesive options. The adhesive provides firm bonding during use and can be easily peeled off from the platen surface after use.
Applications of Back Adhesive:
Fixing grinding cloth and grinding pads for LCD glass substrates.
Fixing grinding cloth for wafers, hard disk substrates, and other materials.
Fixing CMP pads.
Fixing rubbing cloth and other related materials.
High-Elastic Cushion Pads and Adsorption Pads:
Cushion pads and adsorption pads can be provided according to customer requirements. The cushion pad is made of high-foam silicone sponge developed through advanced polymer industrial technology. With features such as heat resistance, cold resistance, and low flammability that ordinary foam does not have, it can be laminated with polishing damping cloth to produce polishing pads of different thicknesses, thereby improving the polishing effect and better protecting the workpiece during polishing.

JIZHI Electronics SiC polishing pads offer cost-effective pricing

JIZHI Electronics polishing pads are manufactured using imported technology and can match the performance of imported polishing pads, PAD products, and damping cloth polishing pads, including Politex, Fujiba, SUBA, and Universal alternatives, with stable and reliable quality.

Choose JIZHI Electronics polishing pad products for more competitive pricing, lower costs than imported polishing pads/fine polishing pads, stable delivery times, and higher cost performance!