{"id":1707,"date":"2026-03-16T09:43:44","date_gmt":"2026-03-16T01:43:44","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=1707"},"modified":"2026-03-16T09:43:44","modified_gmt":"2026-03-16T01:43:44","slug":"dicing-blade-specifications-guide-od-thickness-grit-size-and-exposure","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/zh\/blog\/dicing-blade-specifications-guide-od-thickness-grit-size-and-exposure\/","title":{"rendered":"Dicing Blade Specifications Guide OD Thickness Grit Size and Exposure"},"content":{"rendered":"<!-- ============================================================\n     CLUSTER A-03\n     H1 \/ URL slug: dicing-blade-specifications-guide-od-thickness-grit-size-and-exposure\n     Full URL: https:\/\/jeez-semicon.com\/blog\/dicing-blade-specifications-guide-od-thickness-grit-size-and-exposure\n     Pillar:   https:\/\/jeez-semicon.com\/blog\/diamond-dicing-blades\n     Company:  Jizhi Electronic Technology Co., Ltd.\n     Target:   ~1,800 words 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strong{color:#991b1b;}\n.jz-cta{background:linear-gradient(135deg,#003d82,#0072ce);border-radius:10px;padding:1.8rem 2rem;margin:2.5rem 0;text-align:center;color:#fff;}\n.jz-cta h3{color:#fff;margin:0 0 .5rem;font-size:1.25rem;font-family:'Trebuchet MS',sans-serif;}\n.jz-cta p{color:#d4e8ff;margin:0 0 1.1rem;font-size:.97rem;}\n.jz-cta a.jz-btn{display:inline-block;background:#fff;color:#003d82;font-family:'Trebuchet MS',sans-serif;font-weight:700;font-size:.93rem;padding:.65rem 1.6rem;border-radius:50px;text-decoration:none;margin:.25rem .35rem;}\n.jz-cta a.jz-btn:hover{background:#e0edff;}\n.jz-cta a.jz-btn.outline{background:transparent;color:#fff;border:2px solid rgba(255,255,255,.7);}\n.jz-faq-item{border:1px solid #d0e4f5;border-radius:8px;margin-bottom:.85rem;overflow:hidden;}\n.jz-faq-q{background:#f0f7ff;padding:.85rem 1.15rem;font-family:'Trebuchet MS',sans-serif;font-weight:600;font-size:.95rem;color:#0d2b55;}\n.jz-faq-a{padding:.8rem 1.15rem;font-size:.92rem;color:#374151;line-height:1.7;}\n.jz-back{font-size:.88rem;margin:0 0 1.75rem;color:#6b7280;}\n.jz-back a{color:#0072ce;}\n@media(max-width:600px){\n  .jz-art h1{font-size:1.6rem;}\n  .jz-art h2{font-size:1.3rem;}\n  .jz-intro-box,.jz-cta{padding:1.2rem 1.1rem;}\n}\n<\/style>\n\n<div class=\"jz-art\">\n\n<p class=\"jz-back\">\u2190 \u8fd4\u56de\uff1a <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/diamond-dicing-blades\/\" target=\"_blank\">\u94bb\u77f3\u5207\u5272\u5200\u7247\uff1a\u5b8c\u5168\u6307\u5357<\/a><\/p>\n\n\n<div class=\"jz-intro-box\">\n  <p>A dicing blade datasheet typically lists eight or more parameters, and choosing incorrectly on any one of them can result in excessive chipping, premature blade failure, incomplete singulation, or equipment damage. This guide translates each key specification into plain engineering language \u2014 what it means, how it affects your process, and how to select the right value for your application.<\/p>\n<\/div>\n\n<nav class=\"jz-toc\">\n  <div class=\"jz-toc-title\">\ud83d\udccb \u76ee\u5f55<\/div>\n  <ol>\n    <li><a href=\"#od-id\">Outer Diameter (OD) and Inner Diameter (ID \/ Bore)<\/a><\/li>\n    <li><a href=\"#thickness\">Blade Thickness (T) and Kerf Width<\/a><\/li>\n    <li><a href=\"#grit-size\">\u91d1\u521a\u77f3\u7c92\u5ea6<\/a><\/li>\n    <li><a href=\"#concentration\">\u94bb\u77f3\u6d53\u5ea6<\/a><\/li>\n    <li><a href=\"#exposure\">Blade Exposure<\/a><\/li>\n    <li><a href=\"#bond-type\">Bond Type Notation<\/a><\/li>\n    <li><a href=\"#quick-reference\">Quick Reference: Parameter Selection Table<\/a><\/li>\n    <li><a href=\"#faq\">\u5e38\u89c1\u95ee\u9898<\/a><\/li>\n  <\/ol>\n<\/nav>\n\n\n<h2 id=\"od-id\">1. Outer Diameter (OD) and Inner Diameter (ID \/ Bore)<\/h2>\n\n<p>The <strong>outer diameter (OD)<\/strong> of a dicing blade is the overall diameter of the disc including the abrasive rim, measured in millimetres. The OD must be large enough to provide the required cutting depth through the workpiece, tape, and any required clearance below the tape adhesive layer. Standard OD values used in the semiconductor industry are <strong>55.56 mm (2.187 inches)<\/strong> \u548c <strong>76.2 mm (3.0 inches)<\/strong>, with 55.56 mm being by far the most common for wafer dicing. Larger OD blades (76.2 mm) are used when greater cutting depth is required, such as for thick substrates or step-cut configurations.<\/p>\n\n<p>The <strong>inner diameter (ID)<\/strong>, also called the bore size, is the diameter of the central hole through which the spindle shaft passes. ID must precisely match the spindle hub diameter of your dicing saw. Common bore sizes are <strong>19.05 mm (0.75 inches)<\/strong> \u548c <strong>40.0 mm<\/strong>. Any mismatch between blade ID and spindle hub diameter causes the blade to run off-centre, generating excessive runout, chipping, and potential spindle bearing damage.<\/p>\n\n<div class=\"jz-warning\">\n  <strong>\u26a0\ufe0f Important:<\/strong> Bore diameter tolerance is critical. A blade with an ID that is even 10\u201320 \u00b5m larger than the spindle hub will exhibit measurable runout that translates directly into kerf width variation and chipping. Always specify blade ID to match your exact spindle hub diameter.\n<\/div>\n\n\n<h2 id=\"thickness\">2. Blade Thickness (T) and Kerf Width<\/h2>\n\n<p>Blade thickness (T) is one of the most consequential parameters in dicing process design. It is the nominal width of the abrasive rim and directly governs the width of material removed during cutting \u2014 the <strong>kerf width<\/strong>. The relationship between blade thickness and actual kerf width is not one-to-one: because diamond grains protrude laterally beyond the blade face, and because the blade oscillates slightly during cutting, the actual kerf is always wider than the nominal blade thickness.<\/p>\n\n<div class=\"jz-spec-box\">\n  <div class=\"sb-label\">Kerf Width Estimation<\/div>\n  <div class=\"sb-formula\">Kerf Width \u2248 Blade Thickness (T) + 0.010 mm to 0.025 mm<\/div>\n  <p style=\"margin:.4rem 0 0;font-size:.9rem;color:#374151;\">Actual offset depends on blade bond type, diamond grit size, spindle runout, and cutting parameters. Characterise empirically for each process.<\/p>\n<\/div>\n\n<p>Blade thickness selection is primarily driven by the <strong>street width<\/strong> in the die layout design. The street width must accommodate the kerf plus edge exclusion zones on both sides of the cut. As die size shrinks and street widths approach 50\u201380 \u00b5m in advanced layouts, blade thickness becomes a yield-limiting variable that must be minimised. Electroformed nickel bond blades, available down to 0.015 mm, are the only viable option when streets fall below 50 \u00b5m.<\/p>\n\n<p>Thinner blades also generate lower lateral cutting forces, which benefits fragile substrates. However, thinner blades are more susceptible to lateral deflection under load, and their reduced mass means they cool less effectively \u2014 making coolant optimisation more important. Our guide to <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/dicing-blade-coolant-why-water-alone-is-not-enough\/\" target=\"_blank\">dicing coolant selection<\/a> covers this interaction in detail.<\/p>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead>\n      <tr>\n        <th>\u5e94\u7528<\/th>\n        <th>Typical Street Width<\/th>\n        <th>Recommended Blade Thickness<\/th>\n      <\/tr>\n    <\/thead>\n    <tbody>\n      <tr>\n        <td>Standard Si wafer (logic, memory)<\/td>\n        <td>80\u2013150 \u00b5m<\/td>\n        <td>0.040\u20130.100 mm<\/td>\n      <\/tr>\n      <tr>\n        <td>High-density Si (advanced nodes)<\/td>\n        <td>50\u201380 \u00b5m<\/td>\n        <td>0.020\u20130.040 mm<\/td>\n      <\/tr>\n      <tr>\n        <td>QFN \/ BGA package singulation<\/td>\n        <td>200\u2013400 \u00b5m<\/td>\n        <td>0.150\u20130.300 mm<\/td>\n      <\/tr>\n      <tr>\n        <td>LED (GaN on sapphire)<\/td>\n        <td>20\u201360 \u00b5m<\/td>\n        <td>0.015\u20130.030 mm (electroformed)<\/td>\n      <\/tr>\n      <tr>\n        <td>Glass \/ quartz substrate<\/td>\n        <td>100-300 \u5fae\u7c73<\/td>\n        <td>0.100\u20130.250 mm<\/td>\n      <\/tr>\n      <tr>\n        <td>SiC power device<\/td>\n        <td>100\u2013200 \u00b5m<\/td>\n        <td>0.080\u20130.150 mm<\/td>\n      <\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n\n<h2 id=\"grit-size\">3. Diamond Grit Size<\/h2>\n\n<p>Grit size describes the average particle size of the diamond abrasive embedded in the blade matrix. It is expressed either as a <strong>mesh number<\/strong> (ANSI\/FEPA standard, where higher numbers indicate finer particles) or as a <strong>micron particle size<\/strong>. The two scales run in opposite directions: a #325 mesh grit is approximately 45 \u00b5m particle size, while a #2000 mesh grit is approximately 7 \u00b5m.<\/p>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead>\n      <tr>\n        <th>Mesh Number<\/th>\n        <th>Approx. Particle Size (\u00b5m)<\/th>\n        <th>Cutting Rate<\/th>\n        <th>Surface Finish<\/th>\n        <th>Chipping Risk<\/th>\n      <\/tr>\n    <\/thead>\n    <tbody>\n      <tr>\n        <td>#200 \u2013 #325<\/td>\n        <td>45\u201375 \u00b5m<\/td>\n        <td>\u975e\u5e38\u9ad8<\/td>\n        <td>Rough<\/td>\n        <td>\u9ad8<\/td>\n      <\/tr>\n      <tr>\n        <td>#400 \u2013 #600<\/td>\n        <td>25\u201345 \u00b5m<\/td>\n        <td>\u9ad8<\/td>\n        <td>\u4e2d\u5ea6<\/td>\n        <td>\u4e2d\u5ea6<\/td>\n      <\/tr>\n      <tr>\n        <td>#800 \u2013 #1200<\/td>\n        <td>10\u201325 \u00b5m<\/td>\n        <td>\u4e2d\u5ea6<\/td>\n        <td>\u826f\u597d<\/td>\n        <td>\u4f4e<\/td>\n      <\/tr>\n      <tr>\n        <td>#1500 \u2013 #2000<\/td>\n        <td>5\u201310 \u00b5m<\/td>\n        <td>\u4f4e<\/td>\n        <td>\u4f18\u79c0<\/td>\n        <td>Very low<\/td>\n      <\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<p>The optimal grit size balances three factors: <strong>material hardness<\/strong>, <strong>required surface finish<\/strong>, \u548c <strong>production throughput<\/strong>. For hard materials like SiC or sapphire, coarser grits are needed because finer-grit blades cannot remove material fast enough without excessive heat buildup \u2014 a challenge detailed in our <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/dicing-blade-for-sic-wafers-challenges-and-best-practices\/\" target=\"_blank\">SiC dicing guide<\/a>. For Si and GaAs, where the primary concern is chipping rather than cutting rate, finer grits (#800 and above) are the standard.<\/p>\n\n<div class=\"jz-tip\">\n  <strong>\ud83d\udca1 Two-Step Approach:<\/strong> For demanding applications requiring both speed and surface quality, consider a step-cut process: a coarser-grit blade (Z1 pass) removes the bulk of material at high feed rate, and a finer-grit thinner blade (Z2 pass) completes the singulation with the surface quality cut. This decouples throughput and finish requirements.\n<\/div>\n\n\n<h2 id=\"concentration\">4. Diamond Concentration<\/h2>\n\n<p>Diamond concentration is expressed as a percentage or a standardised concentration number (e.g., C50, C75, C100) representing the volume fraction of diamond within the bond matrix. Higher concentration means more diamond particles per unit volume of blade rim.<\/p>\n\n<p>Concentration interacts directly with bond type and material hardness to determine cutting behaviour. For hard materials, <strong>higher concentration<\/strong> spreads the cutting load across more diamond grains, reducing wear per grain and extending blade life. For soft or ductile materials, <strong>lower concentration<\/strong> with a harder bond may be preferred to prevent the blade from cutting too aggressively and loading with swarf.<\/p>\n\n<p>SiC dicing is a notable case where extremely high diamond concentration (often C100 or above in proprietary formulations) is essential \u2014 the material is so hard that a standard-concentration blade would wear to exhaustion within metres of cut. This is one of several reasons why SiC cannot simply be diced with blades specified for silicon.<\/p>\n\n\n<h2 id=\"exposure\">5. Blade Exposure<\/h2>\n\n<p>Blade exposure is the distance by which the abrasive rim of the blade protrudes below the lowest face of the mounting flanges \u2014 effectively, the available cutting depth. Setting the correct exposure is essential for achieving <strong>complete singulation without grinding into the dicing tape<\/strong>.<\/p>\n\n<div class=\"jz-spec-box\">\n  <div class=\"sb-label\">Exposure Calculation<\/div>\n  <div class=\"sb-formula\">Required Exposure = Wafer Thickness + Tape Thickness + 0.05\u20130.10 mm clearance<\/div>\n  <p style=\"margin:.4rem 0 0;font-size:.9rem;color:#374151;\">Example: 300 \u00b5m Si wafer + 100 \u00b5m dicing tape = 0.40 mm minimum exposure, so set to 0.45\u20130.50 mm.<\/p>\n<\/div>\n\n<p>Insufficient exposure results in incomplete cuts \u2014 dies remain connected by a thin layer of uncut substrate, causing tearing during pick-up and die edge damage. Excessive exposure causes the blade to cut into the tape adhesive, loading the blade with adhesive material, increasing chipping, and potentially damaging the tape frame. Exposure that is excessively large also increases the unsupported blade length, amplifying vibration and runout.<\/p>\n\n\n<h2 id=\"bond-type\">6. Bond Type Notation in Datasheets<\/h2>\n\n<p>Most blade datasheets use an alphanumeric notation system to describe the full specification. While notation varies between manufacturers, a common format is:<\/p>\n\n<div class=\"jz-spec-box\">\n  <div class=\"sb-label\">Example Notation<\/div>\n  <div class=\"sb-formula\">NBC-ZH 27HECC 100 \u00d7 0.030 \u00d7 19.05<\/div>\n  <p style=\"margin:.5rem 0 0;font-size:.9rem;color:#374151;\">\n    <strong>NBC-ZH<\/strong> = Blade series \/ bond type identifier<br>\n    <strong>27HECC<\/strong> = Diamond grit and concentration grade<br>\n    <strong>100<\/strong> = OD (mm) or series indicator<br>\n    <strong>0.030<\/strong> = Blade thickness (mm)<br>\n    <strong>19.05<\/strong> = Bore ID (mm)\n  <\/p>\n<\/div>\n\n<p>Always request a full datasheet from your blade supplier and confirm every parameter before running production. If in doubt about any notation, consult the manufacturer directly. A full explanation of how bond type interacts with all the parameters above is available in our <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/types-of-dicing-blades-resin-vs-metal-vs-nickel-bond-explained\/\" target=\"_blank\">bond type comparison guide<\/a>.<\/p>\n\n\n<h2 id=\"quick-reference\">7. Quick Reference: Parameter Selection Table<\/h2>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead>\n      <tr>\n        <th>\u53c2\u6570<\/th>\n        <th>Key Consideration<\/th>\n        <th>If Too Large \/ Too Coarse<\/th>\n        <th>If Too Small \/ Too Fine<\/th>\n      <\/tr>\n    <\/thead>\n    <tbody>\n      <tr>\n        <td>OD<\/td>\n        <td>Must exceed wafer + tape + clearance depth<\/td>\n        <td>Excess blade rim increases runout risk<\/td>\n        <td>\u4e0d\u5b8c\u5168\u5355\u4e00\u5316<\/td>\n      <\/tr>\n      <tr>\n        <td>Blade Thickness (T)<\/td>\n        <td>Must fit within street width minus exclusion zones<\/td>\n        <td>Removes too much material; kerf too wide<\/td>\n        <td>Blade deflection; fragility<\/td>\n      <\/tr>\n      <tr>\n        <td>Grit Size<\/td>\n        <td>Balance between surface finish and cutting rate<\/td>\n        <td>High chipping; rough surface<\/td>\n        <td>Slow cutting; loading risk on soft materials<\/td>\n      <\/tr>\n      <tr>\n        <td>Concentration<\/td>\n        <td>Match to material hardness and bond type<\/td>\n        <td>Overcutting on soft materials; loading<\/td>\n        <td>Rapid wear on hard materials<\/td>\n      <\/tr>\n      <tr>\n        <td>Exposure<\/td>\n        <td>Wafer thickness + tape thickness + clearance<\/td>\n        <td>Cuts into tape; blade loading; chipping<\/td>\n        <td>Incomplete singulation; die tearing at pick-up<\/td>\n      <\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<p>For substrate-specific parameter recommendations, the <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/dicing-blade-material-compatibility-chart-silicon-sic-gaas-sapphire-and-more\/\" target=\"_blank\">material compatibility chart<\/a> maps common substrates to recommended bond type, grit, and thickness ranges.<\/p>\n\n<hr>\n\n<div class=\"jz-cta\">\n  <h3>Need a Custom Blade Specification?<\/h3>\n  <p>Jizhi Electronic Technology can help you determine the exact OD, thickness, grit, and bond type for your substrate and dicing saw. Request a specification consultation at no obligation.<\/p>\n  <a href=\"https:\/\/jeez-semicon.com\/zh\/contact\/\" target=\"_blank\" class=\"jz-btn\">Get a Specification<\/a>\n  <a href=\"https:\/\/jeez-semicon.com\/zh\/semi-categories\/dicing_blade\/\" target=\"_blank\" class=\"jz-btn outline\">Browse Blade Products<\/a>\n<\/div>\n\n<h2 id=\"faq\">8. Frequently Asked Questions<\/h2>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">What happens if I use the wrong bore (ID) size?<\/div>\n  <div class=\"jz-faq-a\">An oversized bore allows the blade to shift off-centre on the spindle, causing runout that directly increases kerf width variation and chipping. An undersized bore physically cannot be mounted and risks damaging the blade if forced. Bore size must match the spindle hub diameter exactly \u2014 there is no acceptable tolerance for mismatch in the direction that causes runout.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">How much does kerf width increase as the blade wears?<\/div>\n  <div class=\"jz-faq-a\">As a hubless blade wears, its OD decreases, which reduces the available cutting depth (requiring exposure re-adjustment) but does not directly widen the kerf. Kerf width is more affected by changes in diamond protrusion as the blade wears \u2014 in practice, kerf width tends to narrow slightly as the blade ages and diamond exposure reduces. Monitoring kerf width trend over a blade&#8217;s service life is a useful process control indicator; see our article on <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/kerf-width-variation-in-wafer-dicing-root-causes-and-control-methods\/\" target=\"_blank\">kerf width variation<\/a> for a detailed SPC approach.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">Is a finer grit always better for surface quality?<\/div>\n  <div class=\"jz-faq-a\">Not universally. Finer grit does produce lower chipping on most brittle materials, but on very hard substrates (SiC, sapphire), extremely fine grits cut so slowly that heat accumulation and blade loading can actually increase surface damage. There is a material-specific optimal grit range where cutting rate and surface quality are both acceptable \u2014 this range must be determined empirically for each substrate.<\/div>\n<\/div>\n\n<div class=\"jz-faq-item\">\n  <div class=\"jz-faq-q\">How do I calculate the correct exposure setting after installing a new blade?<\/div>\n  <div class=\"jz-faq-a\">Measure your wafer thickness (or substrate stack thickness) and tape thickness with a micrometer, sum the two values, then add 0.05\u20130.10 mm of clearance. Set the exposure on your dicing saw to this value. After setting, perform a test cut through scrap material and tape, then inspect the tape underside to verify the blade has cut fully through without leaving uncut material and without excessive tape adhesive removal. Adjust exposure in 0.02 mm increments until confirmed.<\/div>\n<\/div>\n\n<p style=\"margin-top:2rem;font-size:.9rem;color:#6b7280;\">\u8fd4\u56de\u5b8c\u6574\u6307\u5357\uff1a <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/diamond-dicing-blades\/\" target=\"_blank\">\u94bb\u77f3\u5207\u5272\u5200\u7247 - \u5b8c\u6574\u6307\u5357<\/a><\/p>\n\n<\/div><!-- \/.jz-art -->","protected":false},"excerpt":{"rendered":"<p>\u2190 Back to: Diamond Dicing Blades: The Complete Guide A dicing blade datasheet typically lists eight or more parameters, and choosing incorrectly on any one of them can result in  &#8230;<\/p>","protected":false},"author":1,"featured_media":1743,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-1707","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1707","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/comments?post=1707"}],"version-history":[{"count":2,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1707\/revisions"}],"predecessor-version":[{"id":1709,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1707\/revisions\/1709"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/media\/1743"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/media?parent=1707"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/categories?post=1707"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/tags?post=1707"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}