{"id":1773,"date":"2026-04-07T15:55:15","date_gmt":"2026-04-07T07:55:15","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=1773"},"modified":"2026-04-07T16:29:04","modified_gmt":"2026-04-07T08:29:04","slug":"cmp-pad-groove-design-and-slurry-distribution-a-complete-technical-guide","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/zh\/blog\/cmp-pad-groove-design-and-slurry-distribution-a-complete-technical-guide\/","title":{"rendered":"CMP Pad Groove Design and Slurry Distribution: A Complete Technical Guide"},"content":{"rendered":"<!-- ============================================================\n     CLUSTER 6 \u2014 CMP Pad Groove Design and Slurry Distribution\n     Jizhi Electronic Technology Co., Ltd.\n     jeez-semicon.com  |  April 2026\n     Paste into WordPress Gutenberg \u2192 Custom HTML block\n     URL: \/blog\/CMP-Pad-Groove-Design-and-Slurry-Distribution\n     ============================================================ -->\n\n<style>\n@import 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rgba(0,0,0,.18);color:var(--c-primary)}\n.jz-btn-outline{background:transparent;color:#fff;border:2px solid rgba(255,255,255,.6);margin-left:12px}\n.jz-btn-outline:hover{background:rgba(255,255,255,.12);color:#fff}\n\n\/* FAQ *\/\n.jz-faq{margin:28px 0}\n.jz-faq-item{border:1px solid var(--c-border);border-radius:var(--radius);margin-bottom:12px;overflow:hidden;background:var(--c-surface)}\n.jz-faq-q{padding:16px 20px;font-weight:600;font-size:15px;color:var(--c-primary-dark);display:flex;justify-content:space-between;align-items:center}\n.jz-faq-q::after{content:'+';font-size:20px;font-weight:300;color:var(--c-accent);flex-shrink:0}\n.jz-faq-a{padding:0 20px 16px;font-size:15px;color:#3a4255;line-height:1.75}\n\n@media(max-width:640px){\n  .jz-hero{padding:36px 24px 32px}\n  .jz-cta-banner{padding:32px 22px}\n  .jz-related{padding:24px 18px}\n  .jz-btn-outline{margin-left:0;margin-top:10px;display:inline-block}\n}\n<\/style>\n\n<div class=\"jz-art\">\n\n<!-- Back to Pillar -->\n<a class=\"jz-back\" href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Polishing-Pads-The-Complete-Guide\/\" target=\"_blank\">Back to CMP Polishing Pads: The Complete Guide<\/a>\n\n<!-- Hero -->\n<div class=\"jz-hero\">\n  <div class=\"jz-hero-kicker\">Jizhi Electronic Technology \u2014 Engineering Series<\/div>\n  <p class=\"jz-hero-lead\">An engineer-level analysis of CMP polishing pad groove geometry \u2014 how groove pattern, depth, width, and pitch control slurry transport, heat dissipation, byproduct removal, and removal rate uniformity across the wafer surface.<\/p>\n  <div class=\"jz-hero-meta\">\n    <span>\ud83d\udcc5 April 2026<\/span>\n    <span>\u23f1 15 min read<\/span>\n    <span>\ud83c\udfed Jizhi Electronic Technology Co., Ltd.<\/span>\n  <\/div>\n<\/div>\n\n<!-- Tags -->\n<div class=\"jz-tags\">\n  <span class=\"jz-tag\">CMP Pad Groove<\/span>\n  <span class=\"jz-tag\">Groove Design<\/span>\n  <span class=\"jz-tag\">Slurry Distribution<\/span>\n  <span class=\"jz-tag\">K-Groove<\/span>\n  <span class=\"jz-tag\">XY Grid Groove<\/span>\n  <span class=\"jz-tag\">Spiral Groove<\/span>\n  <span class=\"jz-tag\">Slurry Transport<\/span>\n  <span class=\"jz-tag\">Pad Engineering<\/span>\n<\/div>\n\n<!-- Trust bar -->\n<div class=\"jz-trust\">\n  <div class=\"jz-trust-badge\">CFD<br>Modeled<\/div>\n  <div class=\"jz-trust-text\">\n    <strong>Written by Jizhi Electronic Technology Co., Ltd.<\/strong> \u2014 CMP pad manufacturer using computational fluid dynamics (CFD) modeling in groove pattern design. All groove geometry data and process impact analysis reflects our in-house R&amp;D findings and current April 2026 industry practice.\n  <\/div>\n<\/div>\n\n<!-- TOC -->\n<div class=\"jz-toc\">\n  <div class=\"jz-toc-title\">\ud83d\udccb \u76ee\u5f55<\/div>\n  <ol>\n    <li><a href=\"#why-grooves\">Why Grooves Are Essential<\/a><\/li>\n    <li><a href=\"#groove-functions\">The Five Functions of Pad Grooves<\/a><\/li>\n    <li><a href=\"#groove-patterns\">Groove Pattern Types: A Visual Guide<\/a><\/li>\n    <li><a href=\"#geometry-parameters\">Groove Geometry Parameters Explained<\/a><\/li>\n    <li><a href=\"#depth-width\">Depth, Width, and Pitch: How Each Affects Process<\/a><\/li>\n    <li><a href=\"#slurry-transport\">Slurry Transport Mechanics in Detail<\/a><\/li>\n    <li><a href=\"#thermal\">Thermal Management via Groove Design<\/a><\/li>\n    <li><a href=\"#endpoint\">Grooves and Optical Endpoint Detection<\/a><\/li>\n    <li><a href=\"#selection\">Choosing the Right Groove Pattern<\/a><\/li>\n    <li><a href=\"#faq\">FAQ<\/a><\/li>\n  <\/ol>\n<\/div>\n\n<!-- Intro -->\n<p>When process engineers discuss CMP polishing pad performance, the conversation usually centers on hardness, porosity, and material composition. Groove design receives far less attention \u2014 yet it is one of the most powerful engineering variables available for tuning CMP process behavior. The groove network on a pad surface is not decoration; it is a precision-engineered fluid transport system that governs how efficiently slurry reaches the wafer-pad contact interface, how uniformly it is distributed under the wafer, and how effectively spent slurry and polishing byproducts are evacuated.<\/p>\n\n<p>Get groove design wrong and the consequences are direct and measurable: slurry starvation at the wafer center, non-uniform removal rate profiles, thermal hotspots from poor heat dissipation, and elevated defect density from byproduct redeposition. Get it right and the groove network actively compensates for process non-idealities, improving both uniformity and yield.<\/p>\n\n<p>This guide provides a complete, engineering-level treatment of CMP pad groove design. If you are new to CMP pads and want broader context first, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/zh\/blog\/What-Is-a-CMP-Polishing-Pad-The-Ultimate-Guide\/\" target=\"_blank\">What Is a CMP Polishing Pad? The Ultimate Guide<\/a>.<\/p>\n\n<div class=\"jz-stats\">\n  <div class=\"jz-stat\"><div class=\"jz-stat-num\">0.3\u20130.8<\/div><div class=\"jz-stat-label\">mm \u2014 typical groove depth range in production CMP pads<\/div><\/div>\n  <div class=\"jz-stat\"><div class=\"jz-stat-num\">1.5\u20136.0<\/div><div class=\"jz-stat-label\">mm \u2014 typical groove pitch (center-to-center spacing)<\/div><\/div>\n  <div class=\"jz-stat\"><div class=\"jz-stat-num\">15\u201340%<\/div><div class=\"jz-stat-label\">Fraction of pad surface area occupied by grooves (groove fraction)<\/div><\/div>\n  <div class=\"jz-stat\"><div class=\"jz-stat-num\">\u00b111%<\/div><div class=\"jz-stat-label\">Improvement in radial MRR uniformity achievable by groove optimization alone<\/div><\/div>\n<\/div>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 1 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"why-grooves\">1. Why Grooves Are Essential \u2014 and What Happens Without Them<\/h2>\n\n<p>To understand the value of groove design, consider what CMP polishing would look like without grooves. On a flat, groove-free pad surface, slurry dispensed at the pad edge would be carried radially inward by the centrifugal force of the rotating platen \u2014 but with nowhere to channel, it would form an uncontrolled, turbulent film that is thicker at the pad edge than the center. The wafer, pressed against this non-uniform film, would experience slurry starvation at the center and flooding at the edges. Material removal would be dramatically non-uniform, with edge-to-center MRR ratios of 3:1 or worse common on 300 mm wafers.<\/p>\n\n<p>Additionally, a grooveless pad would trap polishing byproducts \u2014 dissolved ions, spent abrasive particles, and film fragments \u2014 at the pad-wafer interface with no evacuation pathway. These byproducts re-deposit on the wafer surface, causing particle contamination defects, and can agglomerate into larger clusters that cause scratch defects. The thermal energy generated by pad-wafer friction would concentrate at the contact interface with no convective dissipation pathway.<\/p>\n\n<div class=\"jz-callout info\">\n  <div class=\"jz-callout-icon\">\u2139\ufe0f<\/div>\n  <div class=\"jz-callout-body\">\n    <strong>Historical Context: Early CMP Pads Were Groove-Free<\/strong>\n    The first CMP pads used in IC production in the early 1990s were adapted from optical polishing felts and were largely groove-free. The severe within-wafer non-uniformity that resulted was one of the primary technical challenges of early CMP and a major driver of the transition to engineered polyurethane pads with machined groove networks. Today, all production-grade CMP pads for semiconductor applications include precisely machined groove patterns \u2014 the specific design of those grooves is a significant engineering differentiator between pad suppliers.\n  <\/div>\n<\/div>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 2 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"groove-functions\">2. The Five Functions of Pad Grooves<\/h2>\n\n<div class=\"jz-card-grid\">\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udca7<\/div>\n    <h4>Slurry Delivery<\/h4>\n    <p>Groove channels carry fresh slurry from the pad perimeter (where it is dispensed) to the center of the pad-wafer contact zone. Without channels, centrifugal force would prevent slurry from reaching the wafer center on a rapidly rotating platen.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udd04<\/div>\n    <h4>Slurry Renewal<\/h4>\n    <p>As the pad rotates, groove channels that pass under the wafer edge continuously inject fresh slurry into the contact zone, replacing chemically depleted and particle-exhausted slurry. Groove pitch determines how frequently this renewal occurs per wafer revolution.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\uddd1\ufe0f<\/div>\n    <h4>Byproduct Removal<\/h4>\n    <p>Spent abrasive particles, dissolved film material, and polishing reaction products must be evacuated from the contact interface to prevent re-deposition defects. Grooves act as drainage channels, carrying byproducts away from the wafer-pad contact zone.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83c\udf21\ufe0f<\/div>\n    <h4>Heat Dissipation<\/h4>\n    <p>Flowing slurry in groove channels acts as a convective heat transfer medium, carrying frictional heat away from the polishing interface. Groove depth and flow rate determine how effectively thermal energy is dissipated, controlling pad surface temperature.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udcca<\/div>\n    <h4>Uniformity Tuning<\/h4>\n    <p>Asymmetric or zone-varying groove patterns can be used to deliberately bias slurry delivery toward under-served areas of the wafer (e.g., center or edge), providing a process engineering lever for correcting non-uniform removal rate profiles.<\/p>\n  <\/div>\n<\/div>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 3 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"groove-patterns\">3. Groove Pattern Types: A Visual Guide<\/h2>\n\n<p>Five primary groove pattern families are used in production CMP pads. Each has distinct fluid dynamics, slurry distribution characteristics, and process-step applicability. Understanding the geometry and behavior of each is fundamental to intelligent pad selection and specification.<\/p>\n\n<div class=\"jz-groove-grid\">\n\n  <!-- Concentric \/ K-groove -->\n  <div class=\"jz-groove-card\">\n    <div class=\"jz-groove-svg\">\n      <svg width=\"108\" height=\"108\" viewbox=\"0 0 108 108\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n        <circle cx=\"54\" cy=\"54\" r=\"10\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"20\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"30\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"40\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"50\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"3\" fill=\"#0b3d91\"\/>\n      <\/svg>\n    <\/div>\n    <div class=\"jz-groove-info\">\n      <div class=\"jz-groove-name\">Concentric (K-Groove)<\/div>\n      <div class=\"jz-groove-desc\">Concentric rings at constant pitch. Industry standard. Excellent radial slurry retention and uniform angular distribution. Best for oxide, W, general-purpose CMP.<\/div>\n    <\/div>\n  <\/div>\n\n  <!-- XY Grid -->\n  <div class=\"jz-groove-card\">\n    <div class=\"jz-groove-svg\">\n      <svg width=\"108\" height=\"108\" viewbox=\"0 0 108 108\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n        <line x1=\"14\" y1=\"14\" x2=\"14\" y2=\"94\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"34\" y1=\"14\" x2=\"34\" y2=\"94\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"54\" y1=\"14\" x2=\"54\" y2=\"94\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"74\" y1=\"14\" x2=\"74\" y2=\"94\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"94\" y1=\"14\" x2=\"94\" y2=\"94\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"14\" y1=\"14\" x2=\"94\" y2=\"14\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"14\" y1=\"34\" x2=\"94\" y2=\"34\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"14\" y1=\"54\" x2=\"94\" y2=\"54\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"14\" y1=\"74\" x2=\"94\" y2=\"74\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <line x1=\"14\" y1=\"94\" x2=\"94\" y2=\"94\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n      <\/svg>\n    <\/div>\n    <div class=\"jz-groove-info\">\n      <div class=\"jz-groove-name\">XY Cartesian Grid<\/div>\n      <div class=\"jz-groove-desc\">Orthogonal grid pattern. Bi-directional slurry flow, simple to characterize. Preferred for Cu BEOL and barrier metal CMP. Good byproduct removal in both axes.<\/div>\n    <\/div>\n  <\/div>\n\n  <!-- Spiral -->\n  <div class=\"jz-groove-card\">\n    <div class=\"jz-groove-svg\">\n      <svg width=\"108\" height=\"108\" viewbox=\"0 0 108 108\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n        <path d=\"M54,54 m0,-8 a8,8 0 1,1 -0.01,0 m0,-10 a18,18 0 1,1 -0.01,0 m0,-10 a28,28 0 1,1 -0.01,0 m0,-10 a38,38 0 1,1 -0.01,0 m0,-10 a48,48 0 1,1 -0.01,0\" fill=\"none\" stroke=\"#0090d4\" stroke-width=\"2.2\" stroke-linecap=\"round\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"3\" fill=\"#0090d4\"\/>\n      <\/svg>\n    <\/div>\n    <div class=\"jz-groove-info\">\n      <div class=\"jz-groove-name\">Spiral (Archimedean)<\/div>\n      <div class=\"jz-groove-desc\">Single or multi-arm spiral. Centrifugal pumping effect enhances radial slurry transport to the wafer center. Ideal for high-throughput and slurry-sensitive applications.<\/div>\n    <\/div>\n  <\/div>\n\n  <!-- Perforated -->\n  <div class=\"jz-groove-card\">\n    <div class=\"jz-groove-svg\">\n      <svg width=\"108\" height=\"108\" viewbox=\"0 0 108 108\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n        <circle cx=\"54\" cy=\"54\" r=\"30\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"17\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"28\" r=\"4\" fill=\"#0b3d91\" opacity=\".6\"\/>\n        <circle cx=\"54\" cy=\"80\" r=\"4\" fill=\"#0b3d91\" opacity=\".6\"\/>\n        <circle cx=\"28\" cy=\"54\" r=\"4\" fill=\"#0b3d91\" opacity=\".6\"\/>\n        <circle cx=\"80\" cy=\"54\" r=\"4\" fill=\"#0b3d91\" opacity=\".6\"\/>\n        <circle cx=\"33\" cy=\"33\" r=\"4\" fill=\"#0b3d91\" opacity=\".6\"\/>\n        <circle cx=\"75\" cy=\"75\" r=\"4\" fill=\"#0b3d91\" opacity=\".6\"\/>\n        <circle cx=\"75\" cy=\"33\" r=\"4\" fill=\"#0b3d91\" opacity=\".6\"\/>\n        <circle cx=\"33\" cy=\"75\" r=\"4\" fill=\"#0b3d91\" opacity=\".6\"\/>\n      <\/svg>\n    <\/div>\n    <div class=\"jz-groove-info\">\n      <div class=\"jz-groove-name\">Perforated (Hole Array)<\/div>\n      <div class=\"jz-groove-desc\">Through-holes in addition to concentric grooves. Maximum slurry uptake. Essential for optical endpoint detection windows. Used where in-situ film thickness monitoring is required.<\/div>\n    <\/div>\n  <\/div>\n\n  <!-- Asymmetric \/ Zone-varying -->\n  <div class=\"jz-groove-card\">\n    <div class=\"jz-groove-svg\">\n      <svg width=\"108\" height=\"108\" viewbox=\"0 0 108 108\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n        <circle cx=\"54\" cy=\"54\" r=\"10\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"18\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"26\" fill=\"none\" stroke=\"#0b3d91\" stroke-width=\"2.2\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"35\" fill=\"none\" stroke=\"#c8910a\" stroke-width=\"2.2\" stroke-dasharray=\"4 3\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"43\" fill=\"none\" stroke=\"#c8910a\" stroke-width=\"2.2\" stroke-dasharray=\"4 3\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"51\" fill=\"none\" stroke=\"#c8910a\" stroke-width=\"2.2\" stroke-dasharray=\"4 3\"\/>\n        <circle cx=\"54\" cy=\"54\" r=\"3\" fill=\"#0b3d91\"\/>\n      <\/svg>\n    <\/div>\n    <div class=\"jz-groove-info\">\n      <div class=\"jz-groove-name\">Zone-Varying (Asymmetric)<\/div>\n      <div class=\"jz-groove-desc\">Variable pitch or depth by radial zone \u2014 tighter inner zone (blue), wider outer zone (amber). Corrects radial MRR non-uniformity by delivering more slurry where removal is insufficient.<\/div>\n    <\/div>\n  <\/div>\n\n<\/div>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 4 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"geometry-parameters\">4. Groove Geometry Parameters: Definitions and Interdependencies<\/h2>\n\n<p>Every groove pattern is defined by a set of geometric parameters that collectively determine its fluid transport behavior. Understanding what each parameter controls \u2014 and how changing one affects the others \u2014 is essential for groove design and for interpreting supplier specifications.<\/p>\n\n<div class=\"jz-param-band\">\n  <div class=\"jz-param-cell\">\n    <div class=\"jz-param-label\">Groove Depth (d)<\/div>\n    <div class=\"jz-param-value\">0.3\u20130.8 mm<\/div>\n    <div class=\"jz-param-note\">Volume capacity of the channel. Determines slurry holding volume and pad usable life (grooves become ineffective when pad wears to groove floor).<\/div>\n  <\/div>\n  <div class=\"jz-param-cell\">\n    <div class=\"jz-param-label\">Groove Width (w)<\/div>\n    <div class=\"jz-param-value\">0.25\u20131.0 mm<\/div>\n    <div class=\"jz-param-note\">Cross-sectional area for slurry flow. Wider grooves increase flow rate but reduce contact area between lands and wafer.<\/div>\n  <\/div>\n  <div class=\"jz-param-cell\">\n    <div class=\"jz-param-label\">Groove Pitch (p)<\/div>\n    <div class=\"jz-param-value\">1.5\u20136.0 mm<\/div>\n    <div class=\"jz-param-note\">Center-to-center spacing. Determines how frequently the wafer surface is exposed to a groove channel during one platen revolution.<\/div>\n  <\/div>\n  <div class=\"jz-param-cell\">\n    <div class=\"jz-param-label\">Land Width (p \u2212 w)<\/div>\n    <div class=\"jz-param-value\">1.0\u20135.0 mm<\/div>\n    <div class=\"jz-param-note\">Width of the solid pad surface between grooves. Larger lands increase contact area and polishing efficiency but reduce slurry transport frequency.<\/div>\n  <\/div>\n  <div class=\"jz-param-cell\">\n    <div class=\"jz-param-label\">Groove Fraction (w\/p)<\/div>\n    <div class=\"jz-param-value\">15\u201340%<\/div>\n    <div class=\"jz-param-note\">Percentage of pad surface occupied by grooves. Higher groove fraction = more slurry transport but less mechanical contact area.<\/div>\n  <\/div>\n  <div class=\"jz-param-cell\">\n    <div class=\"jz-param-label\">Cross-Section Profile<\/div>\n    <div class=\"jz-param-value\">Square \/ U \/ V<\/div>\n    <div class=\"jz-param-note\">Square (flat-bottomed) is most common. U-profile reduces particle trapping. V-profile self-cleans under rotation but has lower volume capacity.<\/div>\n  <\/div>\n<\/div>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 5 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"depth-width\">5. Depth, Width, and Pitch: How Each Parameter Affects Process Outcomes<\/h2>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead>\n      <tr>\n        <th>Parameter Change<\/th>\n        <th>Effect on Slurry Transport<\/th>\n        <th>Effect on MRR<\/th>\n        <th>Effect on Defects<\/th>\n        <th>Effect on Pad Life<\/th>\n      <\/tr>\n    <\/thead>\n    <tbody>\n      <tr>\n        <td><strong>Deeper grooves (\u2191d)<\/strong><\/td>\n        <td class=\"win\">Higher slurry volume capacity; longer effective transport path<\/td>\n        <td class=\"mid\">Slight increase from better slurry renewal<\/td>\n        <td class=\"win\">Improved byproduct removal; fewer re-deposition defects<\/td>\n        <td class=\"lose\">Reduced \u2014 less usable pad material above groove floor<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>Shallower grooves (\u2193d)<\/strong><\/td>\n        <td class=\"lose\">Lower capacity; risk of channel flooding and overflow<\/td>\n        <td class=\"mid\">Neutral to slight decrease<\/td>\n        <td class=\"mid\">Higher re-deposition risk if channels saturate<\/td>\n        <td class=\"win\">Extended \u2014 more usable pad thickness available<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>Wider grooves (\u2191w)<\/strong><\/td>\n        <td class=\"win\">Higher volumetric flow rate; better under-wafer coverage<\/td>\n        <td class=\"mid\">May decrease slightly \u2014 less contact area (land area \u2193)<\/td>\n        <td class=\"win\">Lower particle trapping in groove corners<\/td>\n        <td class=\"mid\">Neutral<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>Narrower grooves (\u2193w)<\/strong><\/td>\n        <td class=\"lose\">Lower flow; higher particle bridging risk across channel<\/td>\n        <td class=\"win\">Higher MRR \u2014 more land area in contact with wafer<\/td>\n        <td class=\"lose\">Higher particle trapping; scratch risk from debris<\/td>\n        <td class=\"mid\">Neutral<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>Closer pitch (\u2193p)<\/strong><\/td>\n        <td class=\"win\">More frequent slurry injection per revolution; better center delivery<\/td>\n        <td class=\"mid\">More uniform radial MRR profile<\/td>\n        <td class=\"win\">Better byproduct sweep frequency<\/td>\n        <td class=\"mid\">Neutral to slight reduction<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>Wider pitch (\u2191p)<\/strong><\/td>\n        <td class=\"lose\">Less frequent slurry injection; center starvation risk on large wafers<\/td>\n        <td class=\"win\">Higher peak MRR \u2014 larger land area<\/td>\n        <td class=\"lose\">Higher re-deposition risk between groove passes<\/td>\n        <td class=\"win\">Slightly extended \u2014 more land material<\/td>\n      <\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<div class=\"jz-callout tip\">\n  <div class=\"jz-callout-icon\">\ud83d\udca1<\/div>\n  <div class=\"jz-callout-body\">\n    <strong>The Groove Fraction Sweet Spot<\/strong>\n    Industry experience has converged on a groove fraction (groove area \/ total pad area) of 20\u201335% as the optimal range for most silicon CMP applications. Below 20%, slurry transport is insufficient and within-wafer uniformity suffers. Above 35%, mechanical contact area drops to a level where Preston&#8217;s equation breaks down \u2014 insufficient asperity contacts reduce MRR and increase process variability. Jizhi designs its standard groove patterns to target 25\u201330% groove fraction, with application-specific variants available outside this range for special process requirements.\n  <\/div>\n<\/div>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 6 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"slurry-transport\">6. Slurry Transport Mechanics: What Drives Flow Under the Wafer<\/h2>\n\n<p>Slurry transport in a CMP pad groove system is driven by three simultaneous physical mechanisms, each dominant in a different region of the pad-wafer system. Understanding these mechanisms explains why groove pattern choice matters so much for within-wafer uniformity.<\/p>\n\n<div class=\"jz-steps\">\n  <div class=\"jz-step\">\n    <div class=\"jz-step-num\">1<\/div>\n    <div class=\"jz-step-body\">\n      <h4>Centrifugal Pumping (Primary Macro-Transport)<\/h4>\n      <p>The rotation of the platen creates centrifugal acceleration that drives slurry radially outward from the pad center toward the perimeter. Grooves aligned with a radial component (spiral patterns, radial-cut asymmetric patterns) enhance this centrifugal pumping, delivering fresh slurry more effectively to the center of a large-diameter wafer than purely circumferential (concentric) grooves. For 300 mm wafers on modern high-speed platens (60\u2013120 rpm), centrifugal pumping is the dominant transport mechanism at radial distances beyond 50 mm from the pad center.<\/p>\n    <\/div>\n  <\/div>\n  <div class=\"jz-step\">\n    <div class=\"jz-step-num\">2<\/div>\n    <div class=\"jz-step-body\">\n      <h4>Hydrodynamic Pressure-Driven Flow (Under-Wafer Transport)<\/h4>\n      <p>Beneath the wafer, slurry flow is driven by the pressure gradient between groove channels and the pad-wafer contact interface. When a groove channel sweeps under the wafer edge, fresh slurry is injected into the contact zone under the hydrodynamic pressure generated by the relative motion between groove walls and wafer surface. The injection rate per groove pass is proportional to groove width, depth, and relative velocity \u2014 all of which are design variables. Computational fluid dynamics (CFD) modeling of this mechanism is how Jizhi engineers its groove patterns before physical prototyping.<\/p>\n    <\/div>\n  <\/div>\n  <div class=\"jz-step\">\n    <div class=\"jz-step-num\">3<\/div>\n    <div class=\"jz-step-body\">\n      <h4>Capillary Action (Pore-to-Interface Micro-Transport)<\/h4>\n      <p>At the micro-scale, slurry stored in pad pores between grooves is drawn to the pad-wafer contact interface by capillary forces. This mechanism is slower than groove-driven macro-transport but provides continuous, distributed slurry replenishment between groove passes. Poreless pads lack this mechanism entirely, relying exclusively on groove-driven transport \u2014 which is why poreless pads require more precise and stable slurry flow control. For details on this pore-groove interaction, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/zh\/blog\/Poreless-CMP-Pads-vs-Porous-Structure\/\" target=\"_blank\">Poreless CMP Pads vs. Porous Structure<\/a>.<\/p>\n    <\/div>\n  <\/div>\n<\/div>\n\n<h3>Slurry Starvation: The Most Common Groove-Related Process Failure<\/h3>\n<p>Slurry starvation \u2014 insufficient fresh slurry reaching the pad-wafer contact interface \u2014 is the most common groove design-related process failure mode. It manifests as a center-low removal rate profile on 300 mm wafers, where the wafer center is farthest from the pad edge and most dependent on effective groove transport. Slurry starvation signatures include:<\/p>\n\n<ul>\n  <li>Within-wafer removal rate profile that is concave \u2014 higher at the edge, lower at the center<\/li>\n  <li>MRR that increases when slurry flow rate is increased (confirming slurry-limited, not pressure-limited, process)<\/li>\n  <li>Post-CMP inspection showing higher scratch density at the wafer center (abrasive particle reuse without replenishment)<\/li>\n  <li>MRR that drops faster than expected as pad ages and grooves shallow from wear<\/li>\n<\/ul>\n\n<p>Groove design solutions for center starvation include: switching from concentric to spiral pattern (adds centrifugal pumping component), reducing groove pitch in the inner zone (zone-varying design), or increasing groove depth. For how groove design interacts with material removal rate modeling, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Material-Removal-Rate-and-Pad-Parameters\/\" target=\"_blank\">CMP Material Removal Rate and Pad Parameters<\/a>.<\/p>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 7 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"thermal\">7. Thermal Management via Groove Design<\/h2>\n\n<p>Frictional heat generation at the pad-wafer interface is a significant and often underappreciated process variable in CMP. Pad surface temperatures of 40\u201380\u00b0C are common in production oxide CMP; SiC CMP can reach 80\u2013100\u00b0C. These temperatures matter because polyurethane&#8217;s mechanical properties \u2014 and therefore the Preston coefficient Kp \u2014 are temperature-dependent. A pad that softens during polishing due to thermal load delivers a progressively different removal rate as the run progresses, creating drift that process engineers must account for.<\/p>\n\n<p>Groove channels provide the primary convective cooling pathway in CMP. Slurry flowing through grooves carries heat away from the pad surface through two mechanisms: direct conductive heat transfer from the polymer to the flowing slurry, and convective heat removal as the heated slurry is ejected at the pad edge and replaced by fresh slurry at ambient temperature.<\/p>\n\n<div class=\"jz-two-col\">\n  <div class=\"jz-col-box\">\n    <h4>\ud83c\udf21\ufe0f Groove Parameters That Aid Cooling<\/h4>\n    <ul>\n      <li>Deeper grooves \u2014 larger wetted area for heat transfer to slurry<\/li>\n      <li>Higher slurry flow rate \u2014 faster convective removal of heated slurry<\/li>\n      <li>Spiral or radial groove components \u2014 centrifugal pumping increases bulk slurry velocity in channels<\/li>\n      <li>Wider groove pitch \u2014 more land area for thermal conduction into flowing slurry at channel walls<\/li>\n      <li>Lower slurry inlet temperature \u2014 increases the thermal driving force for convective cooling<\/li>\n    <\/ul>\n  <\/div>\n  <div class=\"jz-col-box\">\n    <h4>\u26a0\ufe0f Process Conditions That Worsen Thermal Load<\/h4>\n    <ul>\n      <li>High down-force pressure \u2014 more frictional power generated at asperity contacts<\/li>\n      <li>High platen\/carrier velocity \u2014 higher relative sliding speed generates more heat<\/li>\n      <li>Low slurry flow rate \u2014 inadequate thermal mass flow for cooling<\/li>\n      <li>High ambient temperature \u2014 reduces the effective temperature differential for cooling<\/li>\n      <li>SiC or hard-film CMP \u2014 more mechanical resistance = more heat per unit removal<\/li>\n    <\/ul>\n  <\/div>\n<\/div>\n\n<p>For process steps where thermal management is critical \u2014 high-pressure oxide CMP, SiC polishing, or any step where MRR drift over a long run is observed \u2014 Jizhi can specify groove depth and pattern modifications to improve convective cooling without compromising slurry distribution uniformity.<\/p>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 8 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"endpoint\">8. Grooves and Optical Endpoint Detection<\/h2>\n\n<p>Modern CMP tools use in-situ optical endpoint detection \u2014 measuring film thickness in real time by shining a laser or broadband light through a transparent window in the platen and pad. This allows the CMP process to be stopped precisely when the target film has been removed to the desired remaining thickness, rather than relying on timed polishing that cannot account for pad-to-pad or wafer-to-wafer removal rate variation.<\/p>\n\n<p>Optical endpoint detection imposes specific requirements on groove design that can conflict with optimal slurry transport design:<\/p>\n\n<div class=\"jz-card-grid\">\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udd2d<\/div>\n    <h4>Transparent Window Requirement<\/h4>\n    <p>A transparent polyurethane window (or hole) in the pad must align with the optical sensor&#8217;s field of view as the pad rotates. This window must be positioned in a groove-free land area of sufficient size to accommodate the beam diameter \u2014 typically 3\u20138 mm \u2014 which can conflict with closely spaced groove designs.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udca7<\/div>\n    <h4>Slurry Film on Window<\/h4>\n    <p>For accurate optical measurement, the slurry film on the window surface must be thin and uniform during the measurement moment. Groove channels adjacent to the window can create slurry flooding over the window, scattering the optical signal. Window placement relative to groove channels requires careful design to minimize this effect.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udd04<\/div>\n    <h4>Perforated Pad Advantage<\/h4>\n    <p>Through-holes in perforated pad designs serve dual functions: enhanced slurry uptake (primary function) and optical access through the hole for endpoint detection (secondary function). Perforated pads eliminate the need for a separate window insert and are preferred for processes requiring continuous endpoint monitoring.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udcd0<\/div>\n    <h4>Window-to-Groove Spacing<\/h4>\n    <p>When a separate transparent window insert is used, the groove pattern must be designed with an appropriate land zone around the window. A minimum 2 mm groove-free zone around the window perimeter is the standard specification. Zone-varying groove designs can maintain good slurry distribution in the window zone without compromising overall uniformity.<\/p>\n  <\/div>\n<\/div>\n\n<div class=\"jz-callout info\">\n  <div class=\"jz-callout-icon\">\u2139\ufe0f<\/div>\n  <div class=\"jz-callout-body\">\n    <strong>Jizhi&#8217;s Window-Compatible Groove Designs<\/strong>\n    All standard Jizhi CMP pad groove patterns are available in window-compatible variants, with pre-cut window cavities positioned for Applied Materials Reflexion, Ebara FREX, and other major tool platforms. Window inserts are available in standard transparent PU (for broadband optical endpoint) and UV-transparent PU (for UV interferometry systems). Please specify your tool model and optical endpoint system when ordering to ensure correct window placement.\n  <\/div>\n<\/div>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 SECTION 9 \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2 id=\"selection\">9. Choosing the Right Groove Pattern for Your Application<\/h2>\n\n<p>With the mechanics and trade-offs fully characterized, the practical question is: which groove pattern is right for a specific CMP step? The following matrix provides application-specific recommendations.<\/p>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead>\n      <tr>\n        <th>CMP Application<\/th>\n        <th>Recommended Pattern<\/th>\n        <th>Preferred Pitch<\/th>\n        <th>Preferred Depth<\/th>\n        <th>Rationale<\/th>\n      <\/tr>\n    <\/thead>\n    <tbody>\n      <tr>\n        <td><strong>Oxide ILD \/ STI<\/strong><\/td>\n        <td class=\"win\">Concentric (K-groove)<\/td>\n        <td>2.0\u20133.0 mm<\/td>\n        <td>0.5\u20130.7 mm<\/td>\n        <td>Proven uniformity on large oxide steps; ceria slurry works well with concentric channels<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>Cu bulk removal (BEOL Step 1)<\/strong><\/td>\n        <td class=\"win\">XY Grid or Concentric<\/td>\n        <td>2.5\u20134.0 mm<\/td>\n        <td>0.5\u20130.6 mm<\/td>\n        <td>Bi-directional flow helps with non-uniform incoming Cu topography from electroplating<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>Cu \/ barrier buff (BEOL Step 2)<\/strong><\/td>\n        <td class=\"win\">Concentric, fine pitch<\/td>\n        <td>1.5\u20132.5 mm<\/td>\n        <td>0.3\u20130.5 mm<\/td>\n        <td>Fine pitch maximizes slurry renewal frequency for this defect-critical finishing step<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>W plug CMP<\/strong><\/td>\n        <td class=\"win\">Concentric or XY Grid<\/td>\n        <td>2.0\u20133.5 mm<\/td>\n        <td>0.5\u20130.7 mm<\/td>\n        <td>Good byproduct removal needed; W polishing generates substantial tungsten oxide debris<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>High-throughput oxide<\/strong><\/td>\n        <td class=\"win\">Spiral (Archimedean)<\/td>\n        <td>2.0\u20133.0 mm<\/td>\n        <td>0.6\u20130.8 mm<\/td>\n        <td>Centrifugal pumping maximizes slurry delivery rate for high-speed polishing recipes<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>With optical endpoint<\/strong><\/td>\n        <td class=\"win\">Perforated or Concentric + window<\/td>\n        <td>2.0\u20133.0 mm<\/td>\n        <td>0.5\u20130.7 mm<\/td>\n        <td>Through-holes provide optical access without compromising groove transport<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>SiC \/ GaN CMP<\/strong><\/td>\n        <td class=\"win\">Wide-pitch Concentric or Spiral<\/td>\n        <td>3.0\u20136.0 mm<\/td>\n        <td>0.6\u20130.8 mm<\/td>\n        <td>Wider grooves prevent diamond slurry agglomerate trapping; deep grooves maximize thermal dissipation<\/td>\n      <\/tr>\n      <tr>\n        <td><strong>Non-uniform radial MRR correction<\/strong><\/td>\n        <td class=\"win\">Zone-Varying Asymmetric<\/td>\n        <td>Zone-specific<\/td>\n        <td>0.5\u20130.7 mm<\/td>\n        <td>Pitch tightened in under-removing zones (typically center) to increase local slurry delivery<\/td>\n      <\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<div class=\"jz-callout success\">\n  <div class=\"jz-callout-icon\">\u2705<\/div>\n  <div class=\"jz-callout-body\">\n    <strong>Jizhi CFD-Assisted Groove Design Service<\/strong>\n    For customers with non-standard uniformity requirements or novel process applications, Jizhi&#8217;s engineering team offers a CFD-assisted groove design service. We model slurry film thickness and velocity distribution under your specific tool conditions (platen diameter, RPM, carrier RPM, slurry flow rate) and iterate groove geometry until the simulated slurry distribution meets your WIWNU target \u2014 before any physical pad is manufactured. This reduces process development cycles and tooling cost for custom groove specifications. <a href=\"https:\/\/jeez-semicon.com\/zh\/contact\/\" target=\"_blank\">Contact us to discuss your requirements<\/a>.\n  <\/div>\n<\/div>\n\n<!-- \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 FAQ \u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550 -->\n<h2>10. Frequently Asked Questions<\/h2>\n\n<div class=\"jz-faq\">\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">Why do groove dimensions change over pad lifetime?<\/div>\n    <div class=\"jz-faq-a\">Groove dimensions change because both conditioning and polishing consume pad material from the top surface, progressively shallowing the grooves. A pad installed with 0.6 mm deep grooves may have grooves only 0.3 mm deep at end-of-life, having lost half the groove depth to cumulative surface wear. This reduction in groove depth reduces slurry transport capacity and byproduct removal efficiency, contributing to the MRR decline and uniformity degradation characteristic of pad end-of-life. Tracking groove depth \u2014 via profilometer measurement at regular intervals \u2014 is a useful leading indicator of pad end-of-life, supplementing hardness and removal rate monitoring.<\/div>\n  <\/div>\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">Can groove pattern be changed without changing the pad material?<\/div>\n    <div class=\"jz-faq-a\">Yes. Groove patterns are machined into the pad surface after the polyurethane is cast and cured, using precision CNC machining or laser cutting. The same pad blank (same polymer formulation, hardness, pore structure) can be supplied with different groove patterns by changing the machining program. This means that if you want to evaluate a different groove pattern \u2014 for example, switching from K-groove to spiral \u2014 you can test the groove design change independently from the material change, isolating the variable. Jizhi maintains the flexibility to machine any standard groove pattern into any of our pad formulations.<\/div>\n  <\/div>\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">Does groove direction matter (clockwise vs. counter-clockwise spiral)?<\/div>\n    <div class=\"jz-faq-a\">Yes, for spiral patterns. The direction of the spiral relative to the platen rotation direction determines whether the groove acts as a centrifugal pump (driving slurry outward) or a centripetal pump (drawing slurry inward). In most CMP tools with counter-clockwise platen rotation, a clockwise spiral groove (when viewed from above) creates a centrifugal pumping action that drives slurry outward \u2014 which increases the delivery rate to the wafer-pad interface as the groove sweeps under the wafer edge. The optimal spiral direction must be specified relative to your tool&#8217;s platen rotation direction. Jizhi confirms this specification at the time of order placement.<\/div>\n  <\/div>\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">How does groove design affect post-CMP cleaning?<\/div>\n    <div class=\"jz-faq-a\">Groove design affects post-CMP cleaning indirectly, by determining how much slurry and byproduct residue remains on the wafer surface after polishing. Pads with effective groove transport and byproduct evacuation leave less residue \u2014 shorter post-CMP brush cleaning cycles are needed, and defect density after cleaning is lower. Fine-pitch grooves and spiral patterns that maximize slurry renewal frequency tend to deliver cleaner post-CMP surfaces. Perforated pads, with their very high slurry uptake, can deliver a slightly higher residue load but also provide the endpoint detection benefit that often justifies their use.<\/div>\n  <\/div>\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">What is the difference between a K-groove and a standard concentric groove?<\/div>\n    <div class=\"jz-faq-a\">&#8220;K-groove&#8221; is a trademarked designation for a specific concentric groove geometry developed by Cabot Microelectronics (now Entegris) for the IC1000 pad series. In general usage, &#8220;K-groove&#8221; refers to concentric grooves with a pitch of approximately 2.0\u20133.0 mm and a depth of approximately 0.5\u20130.6 mm \u2014 specifications that have become de facto industry standards for oxide CMP. &#8220;Concentric groove&#8221; is the broader category. When suppliers refer to a &#8220;K-groove equivalent&#8221; pad, they mean a concentric groove pattern with geometry matched to the IC1000 K-groove specification. Jizhi&#8217;s JZ-H60 and JZ-H65 series are available in K-groove-equivalent configurations for direct process substitution qualification.<\/div>\n  <\/div>\n<\/div>\n\n<!-- Related Articles -->\n<div class=\"jz-related\">\n  <div class=\"jz-related-title\">\ud83d\udcda Continue Reading \u2014 CMP Pad Deep Dives<\/div>\n  <div class=\"jz-related-grid\">\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">PILLAR \u2014 COMPLETE GUIDE<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Polishing-Pads-The-Complete-Guide\/\" target=\"_blank\">CMP Polishing Pads: The Complete Guide<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">FUNDAMENTALS<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/What-Is-a-CMP-Polishing-Pad-The-Ultimate-Guide\/\" target=\"_blank\">What Is a CMP Polishing Pad? The Ultimate Guide<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">FUNDAMENTALS<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/How-CMP-Polishing-Pads-Work\/\" target=\"_blank\">How CMP Polishing Pads Work<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">MATERIALS<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Pad-Materials-Polyurethane-vs-Other-Options\/\" target=\"_blank\">CMP Pad Materials: Polyurethane vs Other Options<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">SELECTION<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/Hard-vs-Soft-CMP-Polishing-Pads-Selection-Guide\/\" target=\"_blank\">Hard vs. Soft CMP Polishing Pads: Selection Guide<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">APPLICATIONS<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/SiC-CMP-Polishing-Pads-for-Third-Generation-Semiconductors\/\" target=\"_blank\">SiC CMP Polishing Pads for Third-Generation Semiconductors<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">TECHNOLOGY<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/Poreless-CMP-Pads-vs-Porous-Structure\/\" target=\"_blank\">Poreless CMP Pads vs. Porous Structure<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">OPERATIONS<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Pad-Conditioning-and-Lifespan-Management\/\" target=\"_blank\">CMP Pad Conditioning and Lifespan Management<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">PROCESS<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Material-Removal-Rate-and-Pad-Parameters\/\" target=\"_blank\">CMP Material Removal Rate and Pad Parameters<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">QUALITY<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Pad-Defect-Control-Scratches-and-Uniformity\/\" target=\"_blank\">CMP Pad Defect Control: Scratches and Uniformity<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">SOURCING<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Polishing-Pad-Brands-Comparison\/\" target=\"_blank\">CMP Polishing Pad Brands Comparison<\/a>\n    <\/div>\n    <div class=\"jz-related-item\">\n      <div class=\"jz-related-cat\">PROCUREMENT<\/div>\n      <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Polishing-Pad-Price-Factors-and-Buying-Guide\/\" target=\"_blank\">CMP Polishing Pad Price Factors and Buying Guide<\/a>\n    <\/div>\n  <\/div>\n<\/div>\n\n<!-- CTA -->\n<div class=\"jz-cta-banner\">\n  <h2>Groove Design Engineered for Your Process \u2014 Not Just Standard Patterns<\/h2>\n  <p>Jizhi Electronic Technology offers all major groove patterns \u2014 concentric K-groove, XY grid, spiral, perforated, and zone-varying asymmetric \u2014 across our full pad hardness range. CFD-assisted custom groove design available for non-standard uniformity requirements.<\/p>\n  <a class=\"jz-btn jz-btn-white\" href=\"https:\/\/jeez-semicon.com\/zh\/semi-categories\/polishing-pad\/\" target=\"_blank\">Browse CMP Polishing Pads<\/a>\n  <a class=\"jz-btn jz-btn-outline\" href=\"https:\/\/jeez-semicon.com\/zh\/contact\/\" target=\"_blank\">Request Custom Groove Design<\/a>\n<\/div>\n\n<!--\n  \u2554\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\n  \u2551  SEO NOTES \u2014 Cluster 6\n  \u2560\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\n  \u2551  Title tag:  CMP Pad Groove Design and Slurry Distribution (2026) | Jizhi\n  \u2551  Meta desc:  Complete engineering guide to CMP polishing pad groove design \u2014\n  \u2551              pattern types (K-groove, XY, spiral), depth\/width\/pitch effects,\n  \u2551              slurry transport mechanics, thermal management, and endpoint detection.\n  \u2551  Focus KW:   CMP pad groove design\n  \u2551  Secondary:  CMP pad groove pattern, K-groove CMP, slurry distribution CMP pad,\n  \u2551              CMP pad groove depth, spiral groove CMP pad\n  \u2551  Schema:     Article + FAQPage\n  \u2551  Intent:     Informational \/ Technical research\n  \u255a\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\u2550\n-->\n\n<\/div><!-- .jz-art -->","protected":false},"excerpt":{"rendered":"<p>Back to CMP Polishing Pads: The Complete Guide Jizhi Electronic Technology \u2014 Engineering Series An engineer-level analysis of CMP polishing pad groove geometry \u2014 how groove pattern, depth, width, and  &#8230;<\/p>","protected":false},"author":1,"featured_media":1811,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-1773","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1773","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/comments?post=1773"}],"version-history":[{"count":2,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1773\/revisions"}],"predecessor-version":[{"id":1775,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1773\/revisions\/1775"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/media\/1811"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/media?parent=1773"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/categories?post=1773"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/tags?post=1773"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}