{"id":1776,"date":"2026-04-07T15:55:21","date_gmt":"2026-04-07T07:55:21","guid":{"rendered":"https:\/\/jeez-semicon.com\/?p=1776"},"modified":"2026-04-07T16:29:09","modified_gmt":"2026-04-07T08:29:09","slug":"cmp-pad-conditioning-and-lifespan-management-the-complete-operations-guide","status":"publish","type":"post","link":"https:\/\/jeez-semicon.com\/zh\/blog\/cmp-pad-conditioning-and-lifespan-management-the-complete-operations-guide\/","title":{"rendered":"CMP Pad Conditioning and Lifespan Management: The Complete Operations Guide"},"content":{"rendered":"<!-- ============================================================\n     CLUSTER 7 \u2014 CMP Pad Conditioning and Lifespan Management\n     Jizhi Electronic Technology Co., Ltd.\n     jeez-semicon.com  |  April 2026\n     URL: \/blog\/CMP-Pad-Conditioning-and-Lifespan-Management\n     ============================================================ -->\n<style>\n@import url('https:\/\/fonts.googleapis.com\/css2?family=Sora:wght@300;400;500;600;700&family=IBM+Plex+Mono:wght@400;500&display=swap');\n:root{--c-surface:#ffffff;--c-border:#e2e6ef;--c-primary:#0b3d91;--c-primary-dark:#072d6e;--c-accent:#0090d4;--c-accent-light:#e6f5fd;--c-gold:#c8910a;--c-gold-light:#fdf5e0;--c-text:#1a1f2e;--c-muted:#5a6278;--c-tag-bg:#c8d9f5;--c-tag-text:#0a2057;--c-tag-border:#8aaee0;--radius:10px;--radius-lg:16px;--shadow-card:0 2px 12px rgba(11,61,145,.07);--shadow-hover:0 6px 28px rgba(11,61,145,.13);--font-body:'Sora',sans-serif;--font-mono:'IBM Plex Mono',monospace;--max-w:860px}\n.jz-art *{box-sizing:border-box;margin:0;padding:0}\n.jz-art{font-family:var(--font-body);color:var(--c-text);background:transparent;line-height:1.75;font-size:16px;max-width:var(--max-w);margin:0 auto}\n.jz-art a{color:var(--c-accent);text-decoration:none;transition:color .2s}\n.jz-art a:hover{color:var(--c-primary);text-decoration:underline}\n.jz-hero{background:linear-gradient(135deg,#072d6e 0%,#0b3d91 45%,#0a5db5 100%);border-radius:var(--radius-lg);padding:52px 48px 48px;margin-bottom:40px;position:relative;overflow:hidden}\n.jz-hero::before{content:'';position:absolute;right:-60px;top:-60px;width:340px;height:340px;background:rgba(0,144,212,.18);border-radius:50%}\n.jz-hero::after{content:'';position:absolute;right:80px;bottom:-80px;width:200px;height:200px;background:rgba(0,144,212,.10);border-radius:50%}\n.jz-hero-kicker{font-family:var(--font-mono);font-size:12px;letter-spacing:.12em;text-transform:uppercase;color:rgba(255,255,255,.75);margin-bottom:14px}\n.jz-hero h1{font-size:clamp(24px,4vw,38px);font-weight:700;color:#fff;line-height:1.22;margin-bottom:18px;position:relative;z-index:1}\n.jz-hero-lead{font-size:17px;color:rgba(255,255,255,.90);line-height:1.72;max-width:620px;position:relative;z-index:1;margin-bottom:28px}\n.jz-hero-meta{display:flex;flex-wrap:wrap;gap:20px;font-size:13px;color:rgba(255,255,255,.90);position:relative;z-index:1}\n.jz-hero-meta span{display:flex;align-items:center;gap:6px}\n.jz-tags{display:flex;flex-wrap:wrap;gap:8px;margin-bottom:36px}\n.jz-tag{background:var(--c-tag-bg);color:var(--c-tag-text);font-size:12px;font-weight:700;padding:4px 14px;border-radius:20px;border:1px solid var(--c-tag-border);letter-spacing:.01em}\n.jz-back{display:inline-flex;align-items:center;gap:7px;font-size:13px;font-family:var(--font-mono);color:var(--c-muted);margin-bottom:28px;padding:8px 14px;background:var(--c-surface);border:1px solid var(--c-border);border-radius:6px;text-decoration:none;transition:border-color .2s,color .2s}\n.jz-back:hover{border-color:var(--c-accent);color:var(--c-accent);text-decoration:none}\n.jz-back::before{content:'\u2190';font-size:13px}\n.jz-toc{background:var(--c-surface);border:1px solid var(--c-border);border-left:4px solid var(--c-primary);border-radius:var(--radius);padding:28px 32px;margin-bottom:44px;box-shadow:var(--shadow-card)}\n.jz-toc-title{font-size:14px;font-weight:600;text-transform:uppercase;letter-spacing:.08em;color:var(--c-primary);margin-bottom:16px;font-family:var(--font-mono)}\n.jz-toc ol{padding-left:20px;display:grid;grid-template-columns:1fr 1fr;gap:4px 32px}\n.jz-toc ol li{font-size:14px;line-height:1.65;color:var(--c-muted)}\n.jz-toc ol li a{color:var(--c-primary);font-weight:500}\n.jz-toc ol li a:hover{color:var(--c-accent)}\n@media(max-width:620px){.jz-toc ol{grid-template-columns:1fr}}\n.jz-art h2{font-size:clamp(20px,3vw,26px);font-weight:700;color:var(--c-primary-dark);line-height:1.3;margin:52px 0 16px;padding-top:8px;border-top:2px solid var(--c-border)}\n.jz-art h3{font-size:18px;font-weight:600;color:var(--c-text);margin:28px 0 10px}\n.jz-art h4{font-size:16px;font-weight:600;color:var(--c-primary);margin:20px 0 8px}\n.jz-art p{margin-bottom:18px;color:#1e2435}\n.jz-art ul,.jz-art ol{margin-bottom:18px;padding-left:22px;color:#1e2435}\n.jz-art li{margin-bottom:7px;line-height:1.7}\n.jz-callout{border-radius:var(--radius);padding:20px 24px;margin:28px 0;display:flex;gap:16px;align-items:flex-start}\n.jz-callout-icon{font-size:22px;flex-shrink:0;margin-top:1px}\n.jz-callout-body{flex:1;font-size:15px;line-height:1.65;color:#1e2435}\n.jz-callout-body strong{display:block;font-weight:600;margin-bottom:4px;font-size:14px;color:#1a1f2e}\n.jz-callout.info{background:#e8f4fd;border-left:4px solid var(--c-accent)}\n.jz-callout.tip{background:var(--c-gold-light);border-left:4px solid var(--c-gold)}\n.jz-callout.warn{background:#fff4e5;border-left:4px solid #e07b00}\n.jz-callout.success{background:#eaf5ee;border-left:4px solid #2e9e55}\n.jz-callout.cta{background:linear-gradient(135deg,#e8f4fd,#edf1fb);border-left:4px solid var(--c-primary)}\n.jz-table-wrap{overflow-x:auto;margin:28px 0;border-radius:var(--radius);box-shadow:var(--shadow-card)}\n.jz-table{width:100%;border-collapse:collapse;font-size:14px;background:var(--c-surface)}\n.jz-table thead th{background:var(--c-primary);color:#fff;font-weight:600;padding:12px 16px;text-align:left;font-size:13px;letter-spacing:.03em}\n.jz-table tbody tr:nth-child(even){background:#f3f6fc}\n.jz-table tbody td{padding:11px 16px;border-bottom:1px solid var(--c-border);color:#1e2435;vertical-align:top;line-height:1.6}\n.jz-table tbody tr:hover td{background:#eaf0fb}\n.jz-card-grid{display:grid;grid-template-columns:repeat(auto-fit,minmax(210px,1fr));gap:20px;margin:28px 0}\n.jz-card{background:var(--c-surface);border:1px solid var(--c-border);border-radius:var(--radius);padding:22px 20px;box-shadow:var(--shadow-card);transition:transform .22s,box-shadow .22s}\n.jz-card:hover{transform:translateY(-3px);box-shadow:var(--shadow-hover)}\n.jz-card-icon{font-size:26px;margin-bottom:12px}\n.jz-card h4{font-size:15px;font-weight:600;color:var(--c-primary-dark);margin-bottom:8px}\n.jz-card p{font-size:14px;color:var(--c-muted);line-height:1.6;margin-bottom:0}\n.jz-steps{display:flex;flex-direction:column;gap:0;margin:28px 0}\n.jz-step{display:flex;gap:20px;padding:22px 0;border-bottom:1px solid var(--c-border)}\n.jz-step:last-child{border-bottom:none}\n.jz-step-num{flex-shrink:0;width:40px;height:40px;background:var(--c-primary);color:#fff;border-radius:50%;display:flex;align-items:center;justify-content:center;font-weight:700;font-size:15px;margin-top:2px}\n.jz-step-body h4{font-size:16px;font-weight:600;color:#1a1f2e;margin-bottom:7px}\n.jz-step-body p{font-size:15px;color:#3a4255;margin-bottom:0;line-height:1.7}\n.jz-stats{display:grid;grid-template-columns:repeat(auto-fit,minmax(148px,1fr));gap:16px;margin:28px 0}\n.jz-stat{background:var(--c-surface);border:1px solid var(--c-border);border-radius:var(--radius);padding:18px 16px;text-align:center;box-shadow:var(--shadow-card)}\n.jz-stat-num{font-size:26px;font-weight:700;color:var(--c-primary);font-family:var(--font-mono);line-height:1}\n.jz-stat-label{font-size:12px;color:var(--c-muted);margin-top:6px;line-height:1.4}\n.jz-trust{background:#f0f4ff;border-radius:var(--radius);padding:20px 24px;display:flex;align-items:center;gap:18px;margin:40px 0;border:1px solid #d0daee}\n.jz-trust-badge{background:var(--c-primary);color:#fff;border-radius:8px;padding:10px 14px;font-size:12px;font-weight:700;text-align:center;line-height:1.3;flex-shrink:0;font-family:var(--font-mono)}\n.jz-trust-text{font-size:14px;color:#3a4255;line-height:1.65}\n.jz-trust-text strong{color:var(--c-text)}\n.jz-link-chip{display:inline-flex;align-items:center;gap:5px;background:var(--c-accent-light);color:var(--c-accent);font-size:13px;font-weight:500;padding:3px 11px 3px 8px;border-radius:20px;border:1px solid #b3ddf5;text-decoration:none;transition:background .2s,color .2s}\n.jz-link-chip:hover{background:var(--c-accent);color:#fff;text-decoration:none}\n.jz-link-chip::before{content:'\u2192';font-size:11px}\n\/* Pad life curve \u2014 new component *\/\n.jz-lifecycle{display:grid;grid-template-columns:1fr 1fr 1fr;gap:0;margin:28px 0;border:1px solid var(--c-border);border-radius:var(--radius-lg);overflow:hidden;box-shadow:var(--shadow-card)}\n.jz-lifecycle-phase{padding:24px 20px}\n.jz-lifecycle-phase:nth-child(1){background:linear-gradient(160deg,#fff4e5,#fef0dc)}\n.jz-lifecycle-phase:nth-child(2){background:linear-gradient(160deg,#eaf5ee,#ddf3e4);border-left:1px solid var(--c-border);border-right:1px solid var(--c-border)}\n.jz-lifecycle-phase:nth-child(3){background:linear-gradient(160deg,#fce8e8,#fad8d8)}\n.jz-lifecycle-label{font-size:11px;font-weight:700;font-family:var(--font-mono);text-transform:uppercase;letter-spacing:.08em;margin-bottom:8px}\n.jz-lifecycle-phase:nth-child(1) .jz-lifecycle-label{color:#8a5000}\n.jz-lifecycle-phase:nth-child(2) .jz-lifecycle-label{color:#1a5c2e}\n.jz-lifecycle-phase:nth-child(3) .jz-lifecycle-label{color:#8a1f1f}\n.jz-lifecycle-title{font-size:15px;font-weight:700;color:#1a1f2e;margin-bottom:10px}\n.jz-lifecycle-desc{font-size:13px;color:#3a4255;line-height:1.6}\n.jz-lifecycle-wafers{font-size:12px;font-family:var(--font-mono);font-weight:600;margin-top:10px;padding-top:10px;border-top:1px solid rgba(0,0,0,.08)}\n.jz-lifecycle-phase:nth-child(1) .jz-lifecycle-wafers{color:#8a5000}\n.jz-lifecycle-phase:nth-child(2) .jz-lifecycle-wafers{color:#1a5c2e}\n.jz-lifecycle-phase:nth-child(3) .jz-lifecycle-wafers{color:#8a1f1f}\n@media(max-width:600px){.jz-lifecycle{grid-template-columns:1fr}.jz-lifecycle-phase:nth-child(2){border-left:none;border-right:none;border-top:1px solid var(--c-border);border-bottom:1px solid var(--c-border)}}\n.jz-related{background:var(--c-surface);border:1px solid var(--c-border);border-radius:var(--radius-lg);padding:32px 32px 28px;margin:48px 0 32px;box-shadow:var(--shadow-card)}\n.jz-related-title{font-size:14px;font-weight:600;text-transform:uppercase;letter-spacing:.08em;color:var(--c-primary);margin-bottom:20px;font-family:var(--font-mono)}\n.jz-related-grid{display:grid;grid-template-columns:repeat(auto-fill,minmax(230px,1fr));gap:14px}\n.jz-related-item{background:#f3f6fc;border-radius:8px;padding:14px 16px;border:1px solid var(--c-border);transition:background .2s,box-shadow .2s}\n.jz-related-item:hover{background:var(--c-accent-light);box-shadow:var(--shadow-card)}\n.jz-related-item a{font-size:14px;font-weight:500;color:var(--c-primary);text-decoration:none;line-height:1.45;display:block}\n.jz-related-item a:hover{color:var(--c-accent);text-decoration:none}\n.jz-related-cat{font-size:11px;font-family:var(--font-mono);color:var(--c-muted);margin-bottom:5px;letter-spacing:.05em}\n.jz-cta-banner{background:linear-gradient(135deg,#072d6e 0%,#0b3d91 60%,#0a5db5 100%);border-radius:var(--radius-lg);padding:44px 40px;text-align:center;margin:48px 0;position:relative;overflow:hidden}\n.jz-cta-banner::before{content:'';position:absolute;left:-40px;top:-40px;width:220px;height:220px;background:rgba(0,144,212,.15);border-radius:50%}\n.jz-cta-banner h2{color:#fff;font-size:clamp(20px,3vw,28px);margin-bottom:12px;border:none;padding-top:0;position:relative;z-index:1}\n.jz-cta-banner p{color:rgba(255,255,255,.90);font-size:16px;margin-bottom:28px;position:relative;z-index:1}\n.jz-btn{display:inline-block;padding:13px 32px;border-radius:8px;font-weight:600;font-size:15px;text-decoration:none;transition:transform .2s,box-shadow .2s}\n.jz-btn:hover{transform:translateY(-2px);text-decoration:none}\n.jz-btn-white{background:#fff;color:var(--c-primary)}\n.jz-btn-white:hover{box-shadow:0 4px 20px rgba(0,0,0,.18);color:var(--c-primary)}\n.jz-btn-outline{background:transparent;color:#fff;border:2px solid rgba(255,255,255,.6);margin-left:12px}\n.jz-btn-outline:hover{background:rgba(255,255,255,.12);color:#fff}\n.jz-faq{margin:28px 0}\n.jz-faq-item{border:1px solid var(--c-border);border-radius:var(--radius);margin-bottom:12px;overflow:hidden;background:var(--c-surface)}\n.jz-faq-q{padding:16px 20px;font-weight:600;font-size:15px;color:var(--c-primary-dark);display:flex;justify-content:space-between;align-items:center}\n.jz-faq-q::after{content:'+';font-size:20px;font-weight:300;color:var(--c-accent);flex-shrink:0}\n.jz-faq-a{padding:0 20px 16px;font-size:15px;color:#3a4255;line-height:1.75}\n@media(max-width:640px){.jz-hero{padding:36px 24px 32px}.jz-cta-banner{padding:32px 22px}.jz-related{padding:24px 18px}.jz-btn-outline{margin-left:0;margin-top:10px;display:inline-block}}\n<\/style>\n\n<div class=\"jz-art\">\n<a class=\"jz-back\" href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Polishing-Pads-The-Complete-Guide\/\" target=\"_blank\">Back to CMP Polishing Pads: The Complete Guide<\/a>\n\n<div class=\"jz-hero\">\n  <div class=\"jz-hero-kicker\">Jizhi Electronic Technology \u2014 Operations Series<\/div>\n  <p class=\"jz-hero-lead\">Everything process engineers and fab operations teams need to know about CMP pad conditioning \u2014 break-in protocols, in-situ vs. ex-situ conditioning, conditioner disk selection, end-of-life indicators, and pad lifespan optimization strategies.<\/p>\n  <div class=\"jz-hero-meta\">\n    <span>\ud83d\udcc5 April 2026<\/span>\n    <span>\u23f1 14 min read<\/span>\n    <span>\ud83c\udfed Jizhi Electronic Technology Co., Ltd.<\/span>\n  <\/div>\n<\/div>\n\n<div class=\"jz-tags\">\n  <span class=\"jz-tag\">CMP Pad Conditioning<\/span>\n  <span class=\"jz-tag\">Pad Break-In<\/span>\n  <span class=\"jz-tag\">Conditioner Disk<\/span>\n  <span class=\"jz-tag\">Pad Lifespan<\/span>\n  <span class=\"jz-tag\">End-of-Life<\/span>\n  <span class=\"jz-tag\">Pad Glazing<\/span>\n  <span class=\"jz-tag\">In-Situ Conditioning<\/span>\n  <span class=\"jz-tag\">MRR Stability<\/span>\n<\/div>\n\n<div class=\"jz-trust\">\n  <div class=\"jz-trust-badge\">Ops<br>Verified<\/div>\n  <div class=\"jz-trust-text\"><strong>Written by Jizhi Electronic Technology Co., Ltd.<\/strong> \u2014 CMP pad manufacturer providing conditioning protocol recommendations with every pad shipment. All lifespan and conditioning data in this guide reflects our in-house characterization and current April 2026 fab best practice.<\/div>\n<\/div>\n\n<div class=\"jz-toc\">\n  <div class=\"jz-toc-title\">\ud83d\udccb \u76ee\u5f55<\/div>\n  <ol>\n    <li><a href=\"#why-conditioning\">Why Conditioning Is Non-Negotiable<\/a><\/li>\n    <li><a href=\"#degradation\">Three Pad Degradation Mechanisms<\/a><\/li>\n    <li><a href=\"#pad-lifecycle\">The Three-Phase Pad Lifecycle<\/a><\/li>\n    <li><a href=\"#break-in\">Break-In Protocol: Getting the Pad Ready<\/a><\/li>\n    <li><a href=\"#insitu-exsitu\">In-Situ vs. Ex-Situ Conditioning<\/a><\/li>\n    <li><a href=\"#conditioner-disk\">Conditioner Disk Selection<\/a><\/li>\n    <li><a href=\"#parameters\">Conditioning Parameters and Their Effects<\/a><\/li>\n    <li><a href=\"#eol\">End-of-Life Indicators and Monitoring<\/a><\/li>\n    <li><a href=\"#lifespan-optimization\">Lifespan Optimization Strategies<\/a><\/li>\n    <li><a href=\"#faq\">FAQ<\/a><\/li>\n  <\/ol>\n<\/div>\n\n<p>A CMP polishing pad straight from its packaging is not ready to deliver stable, production-grade performance. And a pad that has been running in production for weeks will not maintain the same performance it had on day one without active management. Pad conditioning \u2014 the process of mechanically renewing the pad surface using a diamond disk dresser \u2014 is the single most important operational variable that fab engineers control during ongoing CMP production. Yet it is also the most commonly under-specified and under-monitored aspect of CMP process management.<\/p>\n\n<p>This guide provides everything needed to manage CMP pad conditioning and lifespan effectively, from first installation through end-of-life replacement. For context on how pad properties relate to the underlying CMP removal mechanism, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/zh\/blog\/How-CMP-Polishing-Pads-Work\/\" target=\"_blank\">How CMP Polishing Pads Work<\/a>.<\/p>\n\n<div class=\"jz-stats\">\n  <div class=\"jz-stat\"><div class=\"jz-stat-num\">30\u201340%<\/div><div class=\"jz-stat-label\">MRR decline on an unconditioned pad after just 20 wafer passes<\/div><\/div>\n  <div class=\"jz-stat\"><div class=\"jz-stat-num\">500\u20132,000<\/div><div class=\"jz-stat-label\">Wafers per pad lifetime under standard oxide CMP conditions<\/div><\/div>\n  <div class=\"jz-stat\"><div class=\"jz-stat-num\">60\u2013100<\/div><div class=\"jz-stat-label\">Conditioning sweeps recommended for new-pad break-in before first production wafer<\/div><\/div>\n  <div class=\"jz-stat\"><div class=\"jz-stat-num\">&lt;5%<\/div><div class=\"jz-stat-label\">Target coefficient of variation in MRR across a well-managed pad lifetime<\/div><\/div>\n<\/div>\n\n<h2 id=\"why-conditioning\">1. Why Conditioning Is Non-Negotiable<\/h2>\n<p>The physics of CMP make pad degradation inevitable. Every wafer polished transfers mechanical energy and chemical species to the pad surface. Without conditioning, three concurrent degradation processes \u2014 glazing, pore clogging, and cumulative thickness loss \u2014 progressively reduce pad performance until it falls outside process specification. Conditioning interrupts these processes, restoring the pad surface to a functional state. Without it, a pad would reach end-of-life after just 20\u201350 wafers instead of 500\u20132,000.<\/p>\n\n<p>Conditioning also serves a second critical function: it breaks in a new pad. Fresh pads have a compact, smooth skin layer left over from the casting and curing process. This skin has few exposed pores and low surface roughness Ra \u2014 exactly the opposite of what is needed for efficient slurry transport and asperity-mediated polishing. Break-in conditioning removes this skin, exposing the underlying asperity-rich sub-surface and opening pores to slurry uptake. Until break-in is complete, removal rate is low and highly variable \u2014 unsuitable for production wafers.<\/p>\n\n<h2 id=\"degradation\">2. Three Pad Degradation Mechanisms<\/h2>\n<div class=\"jz-card-grid\">\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udd25<\/div>\n    <h4>Glazing (Surface Vitrification)<\/h4>\n    <p>Frictional heat at asperity contact points partially melts and re-solidifies the polyurethane surface, collapsing asperity tips into a smooth, glassy layer. MRR drops 30\u201340% within 10\u201320 unconditioned wafer passes. Conditioning abrades the glazed layer, restoring asperity geometry and surface roughness Ra.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83e\uddf1<\/div>\n    <h4>Pore Clogging<\/h4>\n    <p>Spent abrasive particles, reaction byproducts, and polished film fragments pack into pad pores and grooves, reducing slurry uptake capacity and creating locally starved zones. Clogged pores generate within-wafer non-uniformity. Conditioning removes the clogged surface layer, re-exposing open pores.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udcc9<\/div>\n    <h4>Cumulative Thickness Loss<\/h4>\n    <p>Both conditioning and polishing consume pad material. As pad thickness decreases from nominal (2.0\u20132.5 mm) toward the minimum (0.5\u20130.8 mm above backing), bulk compressibility and stiffness change \u2014 causing slow drift in WIWNU and MRR over the pad lifetime. This is the primary end-of-life driver for well-managed pads.<\/p>\n  <\/div>\n<\/div>\n\n<h2 id=\"pad-lifecycle\">3. The Three-Phase Pad Lifecycle<\/h2>\n<div class=\"jz-lifecycle\">\n  <div class=\"jz-lifecycle-phase\">\n    <div class=\"jz-lifecycle-label\">Phase 1<\/div>\n    <div class=\"jz-lifecycle-title\">Break-In<\/div>\n    <div class=\"jz-lifecycle-desc\">Skin removal, pore opening, asperity stabilization. High MRR variability \u2014 use dummy or monitor wafers only. MRR rises from low baseline to stable working level.<\/div>\n    <div class=\"jz-lifecycle-wafers\">\u26a0 ~Wafers 1\u201350 (dummy)<\/div>\n  <\/div>\n  <div class=\"jz-lifecycle-phase\">\n    <div class=\"jz-lifecycle-label\">Phase 2<\/div>\n    <div class=\"jz-lifecycle-title\">Stable Working Life<\/div>\n    <div class=\"jz-lifecycle-desc\">Consistent MRR, acceptable WIWNU, stable defect density. All production wafers should be polished in this phase. Conditioning maintains stable surface state throughout.<\/div>\n    <div class=\"jz-lifecycle-wafers\">\u2705 Wafers 51\u20131,800+ (production)<\/div>\n  <\/div>\n  <div class=\"jz-lifecycle-phase\">\n    <div class=\"jz-lifecycle-label\">Phase 3<\/div>\n    <div class=\"jz-lifecycle-title\">End-of-Life<\/div>\n    <div class=\"jz-lifecycle-desc\">MRR drift exceeds \u00b115%, WIWNU exceeds \u00b12% (1\u03c3), or pad thickness reaches minimum. Begin pad replacement planning. Stop production polishing on this pad.<\/div>\n    <div class=\"jz-lifecycle-wafers\">\ud83d\udd34 Replace \u2014 do not continue<\/div>\n  <\/div>\n<\/div>\n\n<h2 id=\"break-in\">4. Break-In Protocol: Getting the Pad Ready for Production<\/h2>\n<p>Break-in (also called seasoning or pre-conditioning) is the most critical and most frequently mishandled aspect of pad installation. Skipping or shortening break-in results in a prolonged high-variability run-in period that can span dozens of production wafers, each at elevated yield risk.<\/p>\n\n<div class=\"jz-steps\">\n  <div class=\"jz-step\">\n    <div class=\"jz-step-num\">1<\/div>\n    <div class=\"jz-step-body\">\n      <h4>Install and Seat the Pad<\/h4>\n      <p>Mount the pad on the platen using the pressure-sensitive adhesive backing. Apply uniform hand pressure across the entire pad surface to ensure full adhesion with no air bubbles. Allow the PSA to seat for a minimum of 15 minutes before any conditioning or polishing. Verify pad thickness uniformity with a 5-point contact gauge \u2014 thickness variation should be &lt;0.05 mm across the pad diameter.<\/p>\n    <\/div>\n  <\/div>\n  <div class=\"jz-step\">\n    <div class=\"jz-step-num\">2<\/div>\n    <div class=\"jz-step-body\">\n      <h4>Wet the Pad Surface<\/h4>\n      <p>Flood the pad surface with DI water or dilute slurry (10\u201320% of production slurry concentration) for 2\u20133 minutes before beginning conditioning. This hydrates the polyurethane surface, initiating pore swelling and reducing the risk of thermal shock to the polymer during the first conditioning sweeps.<\/p>\n    <\/div>\n  <\/div>\n  <div class=\"jz-step\">\n    <div class=\"jz-step-num\">3<\/div>\n    <div class=\"jz-step-body\">\n      <h4>Run Break-In Conditioning Sweeps<\/h4>\n      <p>Perform 60\u2013100 conditioning sweeps using the production conditioner disk at standard sweep speed and conditioner down-force. Continue DI water or dilute slurry delivery throughout. After every 20 sweeps, pause and measure pad surface roughness Ra or observe the pad surface \u2014 a uniform matte appearance indicates skin removal is progressing. Shiny patches indicate residual skin that needs more conditioning.<\/p>\n    <\/div>\n  <\/div>\n  <div class=\"jz-step\">\n    <div class=\"jz-step-num\">4<\/div>\n    <div class=\"jz-step-body\">\n      <h4>Polish Dummy Wafers<\/h4>\n      <p>Polish a minimum of 25\u201350 dummy (non-product) wafers using the full production recipe. Monitor removal rate on each wafer. When removal rate has stabilized within \u00b18% of the target value for 5 consecutive wafers, break-in is complete. Do not allow production wafers onto the pad until this criterion is met.<\/p>\n    <\/div>\n  <\/div>\n  <div class=\"jz-step\">\n    <div class=\"jz-step-num\">5<\/div>\n    <div class=\"jz-step-body\">\n      <h4>Document and Release<\/h4>\n      <p>Record the pad installation date, lot number, initial thickness, break-in wafer count, and stable MRR achieved. This baseline data is essential for tracking pad life and identifying anomalous performance later in the pad&#8217;s life. Update the pad tracking log in the fab&#8217;s APC (advanced process control) system if available.<\/p>\n    <\/div>\n  <\/div>\n<\/div>\n\n<h2 id=\"insitu-exsitu\">5. In-Situ vs. Ex-Situ Conditioning<\/h2>\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead><tr><th>Attribute<\/th><th>In-Situ Conditioning<\/th><th>Ex-Situ Conditioning<\/th><\/tr><\/thead>\n    <tbody>\n      <tr><td><strong>Timing<\/strong><\/td><td>During wafer polishing \u2014 conditioner sweeps while wafer is on pad<\/td><td>Between wafer polishes \u2014 conditioner sweeps on empty pad<\/td><\/tr>\n      <tr><td><strong>MRR stability<\/strong><\/td><td>Excellent \u2014 continuous asperity renewal prevents glazing buildup between wafers<\/td><td>Good \u2014 but MRR may drift slightly within a polishing run before next ex-situ cycle<\/td><\/tr>\n      <tr><td><strong>Pad wear rate<\/strong><\/td><td>Higher \u2014 simultaneous polishing + conditioning doubles effective removal from pad<\/td><td>Lower \u2014 conditioning only occurs when wafer is not present<\/td><\/tr>\n      <tr><td><strong>Defect risk from conditioning debris<\/strong><\/td><td>Higher \u2014 conditioning particles can be carried under the wafer during polishing<\/td><td>Lower \u2014 debris flushed away before next wafer is loaded<\/td><\/tr>\n      <tr><td><strong>Typical application<\/strong><\/td><td>Oxide CMP, W CMP \u2014 where MRR stability is paramount and defect risk from conditioning debris is acceptable<\/td><td>Cu BEOL, low-k CMP \u2014 where particle contamination from conditioning debris is a yield concern<\/td><\/tr>\n      <tr><td><strong>Throughput impact<\/strong><\/td><td>None \u2014 conditioning runs in parallel with polishing<\/td><td>Small \u2014 adds conditioning time between wafer loads (typically 5\u201315 s per cycle)<\/td><\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<div class=\"jz-callout tip\">\n  <div class=\"jz-callout-icon\">\ud83d\udca1<\/div>\n  <div class=\"jz-callout-body\">\n    <strong>Hybrid Conditioning: The Best Practice at Advanced Fabs<\/strong>\n    Most advanced fabs use a hybrid approach: light in-situ conditioning (low conditioner down-force, infrequent sweeps) during polishing to prevent acute glazing, combined with more aggressive ex-situ conditioning between wafer runs to fully restore pad surface texture. The in-situ component maintains MRR stability within a run; the ex-situ component delivers a fully refreshed surface state for the next wafer. The ratio of in-situ to ex-situ intensity is a tunable process parameter that affects both pad life and within-run MRR stability.\n  <\/div>\n<\/div>\n\n<h2 id=\"conditioner-disk\">6. Conditioner Disk Selection<\/h2>\n<p>The conditioner disk is itself a consumable that must be matched to the pad material and conditioning objectives. Selecting the wrong conditioner disk for a given pad type is a common source of conditioning inefficiency and even pad damage.<\/p>\n\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead><tr><th>Conditioner Type<\/th><th>\u91d1\u521a\u77f3\u7c92\u5ea6<\/th><th>\u6700\u9002\u5408<\/th><th>Avoid For<\/th><\/tr><\/thead>\n    <tbody>\n      <tr><td><strong>Fine diamond (electroplated)<\/strong><\/td><td>40\u201380 \u00b5m (D40\u2013D80)<\/td><td>Soft PU pads, Cu BEOL, low-k CMP \u2014 minimizes conditioning debris<\/td><td>Hard pads requiring aggressive texture renewal<\/td><\/tr>\n      <tr><td><strong>Medium diamond (electroplated)<\/strong><\/td><td>80\u2013150 \u00b5m (D80\u2013D150)<\/td><td>Standard hard PU oxide CMP \u2014 industry-standard choice for IC1000-type pads<\/td><td>Very soft subpads \u2014 may cause excessive wear<\/td><\/tr>\n      <tr><td><strong>Coarse diamond (electroplated)<\/strong><\/td><td>150\u2013250 \u00b5m (D150\u2013D250)<\/td><td>SiC CMP pads, high cross-link PU requiring aggressive abrasion for break-in<\/td><td>Standard IC CMP \u2014 excess debris generation<\/td><\/tr>\n      <tr><td><strong>CVD diamond (uniform crystal)<\/strong><\/td><td>Custom, tightly controlled<\/td><td>Advanced node CMP requiring ultra-low conditioner debris and highly uniform texture<\/td><td>Cost-sensitive mature node production<\/td><\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<h2 id=\"parameters\">7. Conditioning Parameters and Their Process Effects<\/h2>\n<div class=\"jz-table-wrap\">\n  <table class=\"jz-table\">\n    <thead><tr><th>\u53c2\u6570<\/th><th>\u5178\u578b\u8303\u56f4<\/th><th>Effect of Increasing<\/th><th>Effect of Decreasing<\/th><\/tr><\/thead>\n    <tbody>\n      <tr><td><strong>Conditioner down-force<\/strong><\/td><td>2\u20138 lbf<\/td><td>More aggressive abrasion, higher Ra, faster MRR recovery \u2014 but more pad wear and debris<\/td><td>Gentler texture renewal, lower Ra, lower debris \u2014 but slower glazing removal<\/td><\/tr>\n      <tr><td><strong>Conditioner sweep speed<\/strong><\/td><td>10\u201330 mm\/s<\/td><td>More uniform radial conditioning across pad surface<\/td><td>Localized over-conditioning near sweep reversal points<\/td><\/tr>\n      <tr><td><strong>Conditioner RPM<\/strong><\/td><td>80\u2013150 rpm<\/td><td>Higher abrasion rate, more debris generation<\/td><td>Lower abrasion, less debris \u2014 may be insufficient for harder pads<\/td><\/tr>\n      <tr><td><strong>Conditioning frequency (ex-situ)<\/strong><\/td><td>Every 1\u20135 wafers<\/td><td>More stable MRR but higher pad wear rate and lower pad life<\/td><td>Longer pad life but more MRR drift between conditioning cycles<\/td><\/tr>\n      <tr><td><strong>DI water flow during conditioning<\/strong><\/td><td>200\u2013500 mL\/min<\/td><td>Better debris flushing, lower temperature, less contamination risk<\/td><td>Debris accumulation, higher pad surface temperature<\/td><\/tr>\n    <\/tbody>\n  <\/table>\n<\/div>\n\n<div class=\"jz-callout warn\">\n  <div class=\"jz-callout-icon\">\u26a0\ufe0f<\/div>\n  <div class=\"jz-callout-body\">\n    <strong>Over-Conditioning: A Real and Common Problem<\/strong>\n    More conditioning is not always better. Excessive conditioner down-force or frequency on a soft PU pad dramatically increases MRR (because it generates a very rough surface with tall asperities) but simultaneously increases scratch density and accelerates pad wear. For Cu BEOL soft pads, over-conditioning is one of the top causes of scratch yield excursions. Always characterize the MRR vs. conditioning-intensity curve for your specific pad-slurry combination before setting production conditioning parameters.\n  <\/div>\n<\/div>\n\n<h2 id=\"eol\">8. End-of-Life Indicators and Monitoring<\/h2>\n<p>Identifying pad end-of-life before it causes a yield excursion requires a structured monitoring program. The following metrics, tracked over pad lifetime, provide early warning of impending end-of-life:<\/p>\n\n<div class=\"jz-card-grid\">\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udcc9<\/div>\n    <h4>MRR Trend<\/h4>\n    <p>Track mean removal rate per 10-wafer batch. An MRR decline of more than 15% from the stable-state baseline, that cannot be recovered by adjusting conditioning intensity, is a primary end-of-life signal. Plot MRR vs. cumulative wafer count to detect drift early.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udcca<\/div>\n    <h4>WIWNU Trend<\/h4>\n    <p>Within-wafer non-uniformity (1\u03c3) should remain stable throughout the stable working phase. A sustained increase of more than 2% (1\u03c3) above the break-in baseline \u2014 not correctable by recipe adjustment \u2014 indicates the pad&#8217;s mechanical response has changed beyond acceptable limits.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udccf<\/div>\n    <h4>Pad Thickness<\/h4>\n    <p>Measure pad thickness at a fixed 5-point pattern using a contact gauge at every pad installation and at regular intervals (every 200 wafers). End-of-life occurs when pad thickness reaches the minimum specification \u2014 typically 0.5\u20130.8 mm above the backing layer or PSA interface.<\/p>\n  <\/div>\n  <div class=\"jz-card\">\n    <div class=\"jz-card-icon\">\ud83d\udd2c<\/div>\n    <h4>Post-CMP Defect Density<\/h4>\n    <p>A sustained increase in scratch density or particle count from post-CMP inspection \u2014 not attributable to slurry or process recipe changes \u2014 often precedes other end-of-life metrics. Defect density trending upward by more than 20% from baseline warrants expedited pad replacement evaluation.<\/p>\n  <\/div>\n<\/div>\n\n<h2 id=\"lifespan-optimization\">9. Lifespan Optimization Strategies<\/h2>\n<p>Pad lifespan directly affects CMP consumable cost per wafer. Extending pad life by even 20% reduces pad cost contribution by the same factor \u2014 significant at high-volume fabs consuming dozens of pads per month. The following strategies extend pad life without compromising process performance.<\/p>\n\n<ul>\n  <li><strong>Optimize conditioning intensity to the minimum effective level.<\/strong> Every conditioning sweep removes pad material. Use the lowest down-force and fewest sweeps that maintain stable MRR. Characterize the conditioning response curve thoroughly during process development.<\/li>\n  <li><strong>Use ex-situ conditioning preferentially over in-situ where process allows.<\/strong> In-situ conditioning (running conditioner during polishing) approximately doubles the effective pad material removal rate compared to ex-situ alone. Switching to a predominantly ex-situ regime can extend pad life by 20\u201340% with proper recipe adjustment.<\/li>\n  <li><strong>Match conditioner disk grit to pad hardness.<\/strong> Using a coarser conditioner than necessary accelerates pad wear disproportionately. Verify grit selection for each pad type individually.<\/li>\n  <li><strong>Maintain stable slurry chemistry.<\/strong> pH excursions in slurry \u2014 even brief \u2014 can accelerate polyurethane hydrolysis, shortening pad life. Tight pH control (&lt;\u00b10.2 pH units) at the slurry delivery point is a best practice.<\/li>\n  <li><strong>Control pad surface temperature.<\/strong> Operating close to the pad&#8217;s Tg accelerates thermal degradation and glazing. Maximize cooling water flow to the platen and slurry flow rate to maintain pad surface temperature well below Tg.<\/li>\n<\/ul>\n\n<p>For information on how conditioning parameters affect the relationship between pad properties and removal rate, see: <a class=\"jz-link-chip\" href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Material-Removal-Rate-and-Pad-Parameters\/\" target=\"_blank\">CMP Material Removal Rate and Pad Parameters<\/a>.<\/p>\n\n<h2>10. Frequently Asked Questions<\/h2>\n<div class=\"jz-faq\">\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">How do I know when break-in is complete?<\/div>\n    <div class=\"jz-faq-a\">Break-in is complete when removal rate on consecutive dummy wafers has stabilized within \u00b18% of the target production MRR for at least 5 consecutive wafers. Visually, the pad surface should appear uniformly matte with no shiny patches \u2014 shiny areas indicate residual skin that has not yet been abraded away. Optionally, measure surface roughness Ra with a contact profilometer: the target Ra at break-in completion for a standard hard oxide CMP pad is typically 3\u20136 \u00b5m (conditioned state).<\/div>\n  <\/div>\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">Can a pad be re-conditioned if MRR drops significantly during production?<\/div>\n    <div class=\"jz-faq-a\">Yes, if the MRR drop is due to glazing or pore clogging \u2014 both reversible through more aggressive ex-situ conditioning. Perform 20\u201330 additional ex-situ conditioning sweeps at standard or slightly elevated conditioner down-force, then re-qualify with 5 monitor wafers before returning to production. If MRR does not recover to within 10% of baseline after this intervention, the pad has likely entered true end-of-life (insufficient pad thickness or irreversible material changes) and should be replaced.<\/div>\n  <\/div>\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">How often should conditioner disks be replaced?<\/div>\n    <div class=\"jz-faq-a\">Conditioner disk replacement interval depends on the diamond grit type, conditioning intensity, and pad hardness. As a guideline: electroplated diamond conditioners for standard oxide CMP typically last 200\u2013500 pad-equivalent conditioning hours before diamond tip flattening reduces their effectiveness. The clearest indicator of conditioner disk end-of-life is a requirement to increase conditioning down-force or frequency to maintain the same pad surface Ra \u2014 the conditioner has lost its cutting efficiency. Track conditioner disk age in wafer-hours of conditioning exposure, not calendar time.<\/div>\n  <\/div>\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">Does conditioning protocol differ for hard vs. soft pads?<\/div>\n    <div class=\"jz-faq-a\">Yes, significantly. Soft pads (Shore D 28\u201345) are much more sensitive to conditioning intensity than hard pads. A conditioning down-force that is optimal for a hard pad will dramatically over-condition a soft pad, generating a very rough surface that produces excessive scratch defects on Cu or low-k films. Soft pads require finer diamond grit conditioners (D40\u2013D80), lower down-force (2\u20134 lbf vs. 4\u20138 lbf for hard pads), and more frequent but gentler conditioning cycles. Always re-characterize the conditioning response when switching between hard and soft pad types on the same tool. For the detailed hard vs. soft comparison, see: <a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/Hard-vs-Soft-CMP-Polishing-Pads-Selection-Guide\/\" target=\"_blank\">Hard vs. Soft CMP Polishing Pads: Selection Guide<\/a>.<\/div>\n  <\/div>\n  <div class=\"jz-faq-item\">\n    <div class=\"jz-faq-q\">Does Jizhi provide conditioning protocol recommendations with pad shipments?<\/div>\n    <div class=\"jz-faq-a\">Yes. Every Jizhi CMP pad shipment includes a recommended conditioning protocol document specifying: break-in sweep count, recommended conditioner disk grit size, conditioning down-force range, sweep speed, in-situ and ex-situ frequency recommendations, and expected stable-state MRR for our standard reference recipe. These recommendations are derived from our in-house characterization and are application-specific \u2014 separate protocols are provided for hard oxide pads, soft Cu BEOL pads, and SiC-specific pads. Contact our application engineering team if your slurry system or tool differs from our reference conditions.<\/div>\n  <\/div>\n<\/div>\n\n<div class=\"jz-related\">\n  <div class=\"jz-related-title\">\ud83d\udcda Continue Reading \u2014 CMP Pad Deep Dives<\/div>\n  <div class=\"jz-related-grid\">\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">PILLAR<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Polishing-Pads-The-Complete-Guide\/\" target=\"_blank\">CMP Polishing Pads: The Complete Guide<\/a><\/div>\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">FUNDAMENTALS<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/How-CMP-Polishing-Pads-Work\/\" target=\"_blank\">How CMP Polishing Pads Work<\/a><\/div>\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">SELECTION<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/Hard-vs-Soft-CMP-Polishing-Pads-Selection-Guide\/\" target=\"_blank\">Hard vs. Soft CMP Polishing Pads: Selection Guide<\/a><\/div>\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">PROCESS<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Material-Removal-Rate-and-Pad-Parameters\/\" target=\"_blank\">CMP Material Removal Rate and Pad Parameters<\/a><\/div>\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">QUALITY<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Pad-Defect-Control-Scratches-and-Uniformity\/\" target=\"_blank\">CMP Pad Defect Control: Scratches and Uniformity<\/a><\/div>\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">ENGINEERING<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Pad-Groove-Design-and-Slurry-Distribution\/\" target=\"_blank\">CMP Pad Groove Design and Slurry Distribution<\/a><\/div>\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">TECHNOLOGY<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/Poreless-CMP-Pads-vs-Porous-Structure\/\" target=\"_blank\">Poreless CMP Pads vs. Porous Structure<\/a><\/div>\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">SOURCING<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Polishing-Pad-Brands-Comparison\/\" target=\"_blank\">CMP Polishing Pad Brands Comparison<\/a><\/div>\n    <div class=\"jz-related-item\"><div class=\"jz-related-cat\">PROCUREMENT<\/div><a href=\"https:\/\/jeez-semicon.com\/zh\/blog\/CMP-Polishing-Pad-Price-Factors-and-Buying-Guide\/\" target=\"_blank\">CMP Polishing Pad Price Factors and Buying Guide<\/a><\/div>\n  <\/div>\n<\/div>\n\n<div class=\"jz-cta-banner\">\n  <h2>Every Jizhi Pad Comes with a Conditioning Protocol<\/h2>\n  <p>Jizhi Electronic Technology includes application-specific conditioning recommendations with every pad shipment \u2014 break-in protocol, conditioner disk specification, and steady-state parameters \u2014 so your team gets stable performance from day one.<\/p>\n  <a class=\"jz-btn jz-btn-white\" href=\"https:\/\/jeez-semicon.com\/zh\/semi-categories\/polishing-pad\/\" target=\"_blank\">Browse CMP Polishing Pads<\/a>\n  <a class=\"jz-btn jz-btn-outline\" href=\"https:\/\/jeez-semicon.com\/zh\/contact\/\" target=\"_blank\">Request Application Support<\/a>\n<\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Back to CMP Polishing Pads: The Complete Guide Jizhi Electronic Technology \u2014 Operations Series Everything process engineers and fab operations teams need to know about CMP pad conditioning \u2014 break-in  &#8230;<\/p>","protected":false},"author":1,"featured_media":1812,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[9,59],"tags":[],"class_list":["post-1776","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1776","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/comments?post=1776"}],"version-history":[{"count":2,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1776\/revisions"}],"predecessor-version":[{"id":1778,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/posts\/1776\/revisions\/1778"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/media\/1812"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/media?parent=1776"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/categories?post=1776"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/tags?post=1776"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}