{"id":1905,"date":"2026-04-22T13:24:46","date_gmt":"2026-04-22T05:24:46","guid":{"rendered":"https:\/\/jeez-semicon.com\/?post_type=semiconductor&p=1905"},"modified":"2026-04-22T13:47:16","modified_gmt":"2026-04-22T05:47:16","slug":"silicon-carbide-substrate-polishing","status":"publish","type":"semiconductor","link":"https:\/\/jeez-semicon.com\/zh\/semiconductor\/silicon-carbide-substrate-polishing\/","title":{"rendered":"Silicon Carbide Substrate Polishing"},"content":{"rendered":"

\u4ea7\u54c1\u7279\u70b9<\/strong><\/h2>\n\n\n\n

JIZHI Electronics provides two-stage polishing process solutions for silicon carbide (SiC), combining different models of polishing slurries and polishing pads (rough grinding pad \/ fine grinding pad \/ rough polishing pad \/ fine polishing pad). This approach improves the surface quality of SiC substrates during polishing while significantly increasing the material removal rate.<\/p>\n\n\n\n

Process and Applications<\/strong><\/h2>\n\n\n\n

Suitable for SiC silicon carbide substrate DMP and CMP process flows, effectively improving efficiency and yield. The silicon carbide polishing slurries and polishing pads enable localized (domestic) replacement of imported products.<\/p>\n\n\n\n

Brief Overview of the Silicon Carbide Substrate Processing Flow<\/strong><\/h2>\n\n\n
\n
\"\"<\/figure>\n<\/div>\n\n\n

Silicon Carbide (SiC) Polishing Process \u2013 Rough Polishing \/ Fine Polishing<\/strong><\/h2>\n\n\n\n

Step3<\/strong>
JIZHI Electronics Silicon Carbide (SiC) Rough Polishing Process<\/p>\n\n\n\n

\n
\n\n \n \n \n \n \n \n \n \n \n \n \n
\n SiC Substrate CMP Rough Polishing Process\n <\/th>\n <\/tr>\n <\/thead>\n
Verification Equipment<\/td>\n double-sided36B<\/td>\n <\/tr>\n
Wafer<\/td>\n 6″SiC<\/td>\n <\/tr>\n
\u629b\u5149\u6ce5\u6d46<\/td>\n JZ-8010<\/td>\n <\/tr>\n
\u629b\u5149\u57ab<\/td>\n JZ-3020<\/td>\n <\/tr>\n
Pressure<\/td>\n 350g\/cm2<\/td>\n <\/tr>\n
Rotation Speed<\/td>\n 40 rpm<\/td>\n <\/tr>\n
Polishing Rate<\/td>\n 2.5um\/H<\/td>\n <\/tr>\n
Surface Roughness<\/td>\n 0.13nm<\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n<\/div>\n\n\n\n
\n
\"\"<\/figure>\n<\/div>\n\n
\n
\"\"<\/figure>\n<\/div><\/div>\n\n\n\n
\n\n \n \n \n \n \n \n \n \n
\n Rough Polishing Pad Dimensions and Specifications\n <\/th>\n <\/tr>\n <\/thead>\n\n
Model<\/td>\n JZ-3020<\/td>\n <\/tr>\n
\u539a\u5ea6<\/td>\n 1.4 mm<\/td>\n <\/tr>\n
Groove Pattern<\/td>\n \u53ef\u5b9a\u5236<\/td>\n <\/tr>\n
\u786c\u5ea6<\/td>\n Shore A 85\u00b0<\/td>\n <\/tr>\n
\u538b\u7f29\u6bd4<\/td>\n 2.94<\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n\n\n\n
\"\"<\/figure>\n<\/div>\n<\/div>\n\n\n\n

Step4<\/strong>
JIZHI Electronics Silicon Carbide (SiC) Final Polishing Process<\/p>\n\n\n\n

\n
\n\n \n \n \n \n \n \n \n \n \n \n \n
\n SiC Substrate CMP Rough Polishing Process\n <\/th>\n <\/tr>\n <\/thead>\n
Verification Equipment<\/td>\n double-sided36B<\/td>\n <\/tr>\n
Wafer<\/td>\n 6″SiC<\/td>\n <\/tr>\n
\u629b\u5149\u6ce5\u6d46<\/td>\n JZ-8020<\/td>\n <\/tr>\n
\u629b\u5149\u57ab<\/td>\n JZ-326<\/td>\n <\/tr>\n
Pressure<\/td>\n 300g\/cm2<\/td>\n <\/tr>\n
Rotation Speed<\/td>\n 40 rpm<\/td>\n <\/tr>\n
Polishing Rate<\/td>\n 0.25um\/H<\/td>\n <\/tr>\n
Surface Roughness<\/td>\n 0.06nm<\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n<\/div>\n\n\n\n
\n
\"\"<\/figure>\n<\/div>\n\n
\n
\"\"<\/figure>\n<\/div><\/div>\n\n\n\n
\n\n \n \n \n \n \n \n
\n Rough Polishing Pad Dimensions and Specifications\n <\/th>\n <\/tr>\n\n
Model<\/td>\n JZ-326<\/td>\n <\/tr>\n\n
\u539a\u5ea6<\/td>\n 1.3 mm<\/td>\n <\/tr>\n\n
Groove Pattern<\/td>\n \u53ef\u5b9a\u5236<\/td>\n <\/tr>\n\n
\u786c\u5ea6<\/td>\n Shore A 51\u00b0<\/td>\n <\/tr>\n\n
\u538b\u7f29\u6bd4<\/td>\n 10.77<\/td>\n <\/tr>\n<\/table>\n\n\n\n
\"\"<\/figure>\n<\/div>\n<\/div>\n\n\n\n

JIZHI Electronics\u2019 CMP rough and final polishing process for SiC substrates<\/strong><\/h2>\n\n\n\n

Tip 3 \u2013 Using rough polishing slurry with a lapping pad, Ra can reach 0.13 nm or lower.
Tip 4 \u2013 Using final polishing slurry with a final polishing pad, Ra can reach 0.06 nm or lower.<\/p>\n\n\n\n

Recommended Products and Parameters for Silicon Carbide Grinding \/ Polishing Processes<\/strong><\/h2>\n\n\n\n\n \n \n \n \n \n \n
Processing Method<\/th>\n Recommended Products<\/th>\n Removal Rate<\/th>\n Surface Quality<\/th>\n <\/tr>\n \n \n
<\/th>\n \u629b\u5149\u6ce5\u6d46<\/th>\n \u629b\u5149\u57ab<\/th>\n <\/tr>\n \n \n
\u629b\u5149<\/td>\n Rough Polishing<\/td>\n JZ-8010<\/td>\n JZ-3020<\/td>\n 2.5um\/H<\/td>\n 0.13nm<\/td>\n <\/tr>\n \n \n
Final Polishing<\/td>\n JZ-8020A
JZ-8020B<\/td>\n 		JZ-326<\/td>\n 0.25um\/H<\/td>\n 0.06nm<\/td>\n <\/tr>\n \n <\/table>\n\n\n\n

Storage Method for JIZHI Electronics SiC Silicon Carbide Polishing Slurry<\/strong><\/h2>\n\n\n\n

Store in a well-ventilated, cool, and dry warehouse. The product must be stored at 5\u201335 \u00b0C, protected from direct sunlight and from freezing. If stored below 0 \u00b0C, irreversible agglomeration may occur, rendering the product unusable.<\/p>\n\n\n\n

Pricing of JIZHI Electronics CMP \/ Slurry Polishing Liquids<\/strong><\/h2>\n\n\n\n

JIZHI Electronics\u2019 CMP metal polishing slurries are manufactured using advanced overseas production technologies and equipment and are formulated with specialized chemical compositions. The quality of JIZHI Electronics\u2019 polishing slurries is comparable to that of similar imported products.<\/p>\n\n\n\n

Thanks to localized production, JIZHI Electronics\u2019 CMP slurries offer short delivery lead times, stable high quality, and competitive, cost-effective pricing.<\/p>","protected":false},"excerpt":{"rendered":"

Product Features JIZHI Electronics provides two-stage polishing process solutions for silicon carbide (SiC), combining different models of polishing slurries and polishing pads (rough grinding pad \/ fine grinding pad \/ …<\/p>","protected":false},"featured_media":1295,"template":"","categories":[],"tags":[],"semicategories":[50],"class_list":["post-1905","semiconductor","type-semiconductor","status-publish","has-post-thumbnail","hentry","semicategories-polishing_slurry"],"acf":[],"_links":{"self":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/semiconductor\/1905","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/semiconductor"}],"about":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/types\/semiconductor"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/media\/1295"}],"wp:attachment":[{"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/media?parent=1905"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/categories?post=1905"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/tags?post=1905"},{"taxonomy":"semicategories","embeddable":true,"href":"https:\/\/jeez-semicon.com\/zh\/wp-json\/wp\/v2\/semicategories?post=1905"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}