Damping Cloth Polishing Pad / SiC Fine Polishing Pad / Replacement for Politex and FUJIBO Polishing Pads

Épaisseur du produit

1.2–3 mm (customizable)

Diamètre du produit

φ300–φ1300 mm (customizable)

Caractéristiques du produit

JIZHI Electronics polishing pads meet the polishing requirements of low-, medium-, and high-hardness materials. For the four-step SiC polishing process, different polishing pad models are matched accordingly, including grinding pads, fine grinding pads, rough polishing pads, and fine polishing pads, offering advantages such as high removal rate, high flatness, low defects, and excellent cost performance.
Product Process and Applications: Featuring a soft surface and a special microporous structure, the pads are suitable for high-precision and high-planarization CMP processes for SiC substrates, various wafers, IC manufacturing, and other applications. They also provide cushioning and backside protection for wafers.

Features of JIZHI Electronics SiC Fine Polishing Pad

1.A composite material made of a PU foamed microporous structure combined with a special substrate base layer.
2.The PU pore design forms a unique cushioning structure with different substrates, evenly dispersing pressure across the workpiece surface.
3.Its fine surface texture and high compressibility allow the polishing slurry/grinding slurry it retains to perform effectively in the CMP process.
4.Made with special fiber materials, it is durable, wear-resistant, acid- and alkali-resistant, and highly cost-effective.

JIZHI Electronics SiC Substrate CMP Fine Polishing Process Results:

In the actual application of the SiC fine polishing process, after polishing with JIZHI Electronics SiC polishing slurry (JZ-8020) and JZ-326 fine polishing pad, the SiC surface achieved an Ra value of 0.06 nm.

SiC Substrate CMP Fine Polishing Process
Verification Equipment	Double-Sided 36B
Wafer	6″SiC
Boues de polissage	JZ-8020
Tampon de polissage	JZ-326
Pressure	300 g/cm2
Rotation Speed	40 rpm
Polishing Rate	0.25 µm/H
Surface Roughness	0.06 nm

JIZHI Electronics Damping Cloth Fine Polishing Pad Products

SiC Polishing Pad Auxiliary Material Parameters

Polishing Pad Back Adhesive:
Each JIZHI Electronics polishing pad can be supplied with back adhesive according to customer requirements, including 3M or domestic adhesive options. The adhesive provides firm bonding during use and can be easily peeled off from the platen surface after use.
Applications of Back Adhesive:
Fixing grinding cloth and grinding pads for LCD glass substrates.
Fixing grinding cloth for wafers, hard disk substrates, and other materials.
Fixing CMP pads.
Fixing rubbing cloth and other related materials.
High-Elastic Cushion Pads and Adsorption Pads:
Cushion pads and adsorption pads can be provided according to customer requirements. The cushion pad is made of high-foam silicone sponge developed through advanced polymer industrial technology. With features such as heat resistance, cold resistance, and low flammability that ordinary foam does not have, it can be laminated with polishing damping cloth to produce polishing pads of different thicknesses, thereby improving the polishing effect and better protecting the workpiece during polishing.

JIZHI Electronics SiC polishing pads offer cost-effective pricing

JIZHI Electronics polishing pads are manufactured using imported technology and can match the performance of imported polishing pads, PAD products, and damping cloth polishing pads, including Politex, Fujiba, SUBA, and Universal alternatives, with stable and reliable quality.

Choose JIZHI Electronics polishing pad products for more competitive pricing, lower costs than imported polishing pads/fine polishing pads, stable delivery times, and higher cost performance!