Acier au tungstène
Ensuring surface gloss and right angles is a key challenge in tungsten steel polishing. Tungsten steel is primarily used for tools and cutting blades, so the sharpness of its edges ...
Boues de polissage des métaux - Boues de polissage des miroirs du logo Apple
The Apple Logo is highly tactile, with its sparkling mirror-like effect showcasing the charm and aesthetic of the Apple brand. The creation of a perfect Apple Logo requires polishing through ...
Boues de polissage Jade - Processus de polissage CMP pour les cadrans de montres Jade
A jade wristwatch designed by a client exudes elegance and sophistication, embodying the noble character of jade. The rough surface removal and polishing of the Hetian jade dial are achieved ...
Boues de polissage pour semi-conducteurs - Substrats en céramique, cuivre et laiton Boues de polissage DPC / Fluide de prépolissage DBC
Gizhil Electronic's ceramic copper-clad substrate grinding fluid / DPC polishing slurry / DBC grinding fluid typically involves two processes: coarse polishing and fine polishing. Depending on the customer's requirements for ...
Boues de polissage des métaux - Polissage CMP des plaques de retour des composants hydrauliques / plaques à neuf trous
The power components of hydraulic systems are driven by engines or motors, which draw oil from the hydraulic tank, generate pressurized oil, and deliver it to the actuators. Hydraulic pumps ...
Prépolissage et polissage de plaquettes de saphir
The purpose of polishing sapphire wafers is to reduce the final thickness of the substrate to the desired target value, achieving a TTV (Total Thickness Variation) of better than ±2 ...
Boues de polissage d'alliages d'aluminium - Polissage miroir de pièces en aluminium
Aluminum alloy is relatively soft and has low hardness, making it highly susceptible to mechanical damage such as scratches and abrasions during processing, as well as corrosion and poor chemical ...
Silicon Carbide Wafer Polishing Slurry
Gizhil Electronic's silicon carbide fine polishing slurry is suitable for the surface planarization of SiC silicon carbide wafer substrates during precision machining. The slurry used for wafer polishing exhibits high ...
Hard Alloy Polishing Slurry—Mirror Polishing of Tungsten Steel Blades
Hard alloy blades possess a series of excellent properties, including high hardness, good toughness, heat resistance, and corrosion resistance. Particularly, their high hardness and wear resistance allow them to maintain ...
Silicon Carbide (SiC) Polishing Process
Depending on the specific semiconductor industry processes, CMP (Chemical Mechanical Polishing) slurries can be categorized into dielectric layer CMP slurries, barrier layer CMP slurries, copper CMP slurries, silicon CMP slurries, ...
