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Jusqu'à présent, semiconductor a créé 62 entrées de blog.

Analysis of Key Polishing and Lapping Processes for InP (Indium Phosphide) Substrates

Indium Phosphide (InP), as a core material of the third-generation semiconductor, holds an irreplaceable position in high-end fields such as optical communications, millimeter-wave radar, and quantum communications due to its ...

Par |2025-12-25T10:48:50+08:002025年12月5日|Blog, L'industrie|0 Commentaires

La “révolution des surfaces” dans la fabrication des semi-conducteurs : L'essence technique et la valeur fondamentale du polissage des plaquettes de silicium

In the precision manufacturing chain of the semiconductor industry, the creation of every high-performance chip relies on hundreds of process steps, from silicon purification to chip packaging. Among these, silicon ...

Par |2025-12-05T11:01:27+08:002025年12月5日|Blog, L'industrie|0 Commentaires

Dépasser le coût élevé et la lenteur de réaction du G804W

As the third-generation semiconductor industry accelerates its iteration today, silicon carbide (SiC), as a core material, is reshaping the technological landscape of high-end manufacturing fields such as new energy vehicle ...

Par |2025-12-05T10:57:18+08:002025年12月5日|Blog, L'industrie|0 Commentaires

Percer les secrets de la boue de polissage du verre optique dans les procédés CMP

Unlocking CMP Process: Principles and Advantages In the field of optical component processing, Chemical Mechanical Polishing (CMP) is a core technology for achieving high-precision surface planarization. Through the synergistic effects ...

Par |2025-12-05T10:50:44+08:002025年12月5日|Blog, L'industrie|0 Commentaires

Solution de polissage des miroirs 3C Product : Bouillie de polissage à la silice SiO2 sans piqûres

Why Choose CMP Over Electrochemical Polishing for 3C Product Mirror Polishing? In the 3C industry (mobile phones, laptops, smart wearables, etc.), electrochemical polishing is gradually being replaced by CMP (Chemical ...

Par |2025-12-25T10:47:48+08:002025年12月5日|Blog, Dynamique|0 Commentaires

Fonctions et efficacité de la suspension diamantée (spécialisée pour le polissage CMP)

In fields such as semiconductor manufacturing, precision optics, and hard alloy processing, the ultra-precision polishing of material surfaces directly determines product performance and reliability. Leveraging advanced R&D capabilities and mature ...

Par |2025-12-05T10:34:39+08:002025年12月5日|Blog, Dynamique|0 Commentaires

Boue de polissage CMP pour les plaquettes de silicium électroniques

I. CMP Polishing Technology: A Key Process in Semiconductor Manufacturing Chemical Mechanical Planarization (CMP) is one of the core processes in semiconductor silicon wafer manufacturing, directly impacting chip performance and ...

Par |2025-12-05T10:32:18+08:002025年12月5日|Blog, Dynamique|0 Commentaires

Caractéristiques et guide de sélection de la boue de polissage de plaquettes CMP

In the global planarization stage of wafer manufacturing, Chemical Mechanical Polishing (CMP) is a critical process. As a core consumable, CMP polishing slurry directly determines key wafer surface metrics such ...

Par |2025-12-05T10:29:53+08:002025年12月5日|Blog, Dynamique|0 Commentaires

Polissage miroir de céramiques d'alumine avec de la boue de polissage

Achieving a mirror finish on alumina ceramic sheets presents significant challenges for two main reasons: first, the high hardness of alumina makes it difficult to grind; second, its strong light-absorbing ...

Par |2025-12-16T11:46:18+08:002025年12月5日|Application|0 Commentaires
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