Semiconductor Polishing Slurry Sapphire Polishing Slurry / Grinding Slurry

Product Description

The Sapphire Grinding Slurry / Sapphire LED Substrate Polishing Slurry / Sapphire Slurry formulation developed for the semiconductor and optical industries is suitable for the planarization of sapphire substrates, epitaxial wafers, and LEDs. Designed to meet the requirements of every substrate manufacturing stage from grinding to CMP, it provides a high-performance, cost-effective solution for sapphire substrate polishing applications.

製品の特徴

High-purity raw materials with no contamination
Fast polishing rate with high planarization
High removal rate, good stability, low damage layer, and excellent surface quality

Features of JIZHI Electronics CMP Sapphire Grinding Slurry / Polishing Slurry

1.High-performance slurry for the mass production of sapphire wafers.
2.The formulation is designed to meet the requirements of every process stage in substrate manufacturing, from grinding to CMP, and is suitable for oriented sapphire wafers, including C-plane, A-plane, and R-plane polishing.
3.It achieves a high removal rate with no subsurface damage, while providing excellent stability and reusability.
4.The JIZHI Electronics sapphire slurry product portfolio provides a high-performance and cost-effective solution.
5.Customized one-to-one solutions can be provided according to specific grinding and polishing requirements.

C-Plane Sapphire Substrate Polishing Process and Supporting Materials

Technical Specifications of Diamond Grinding Slurry

Specification	Coarse Grinding Diamond Slurry
Product Type	Polycrystalline Diamond-Like Slurry
モデル	JZ-CD06	JZ-CD04	JZ-CD02
Matching Plate / Pad	Copper Plate	Copper Plate	Copper Plate
pH Value	4-6	4-6	4-6
粒子径（D50）	5–6 μm	3–4 μm	1–2 μm
除去率	3.3 μm/min	2.6 μm/min	2.0 μm/min
表面品質	Fine grinding texture

製品の特徴

Fast removal rate / Easy to clean after polishing / Stable particle size with fine texture

Technical Specifications and Product Introduction of Alumina Polishing Slurry

Specification	Alumina Polishing Slurry
Applicable Wafer	C-plane Sapphire Substrate
Product Model	JZ-A02	JZ-A03
Matching Polishing Pad	Non-woven Pad Z-800T
Solid Content	20	20
pH Value	12-14	3-5
粒子径（D50）	0.5-1.5 μm	0.5-1.5 μm
除去率	0.13μm	0.08μm
Dilution Ratio	5–10×	5–10×

製品の特徴

High dilution ratio, reducing costs
Alkaline formulation with fast removal rate, good suspension performance, and easy redispersion
Long service life, stable particle size, and no scratching

Technical Specifications and Product Introduction of Polishing Pad

Suitable for rough polishing of sapphire and silicon carbide substrates

Resistant to strong acids, alkalis, and corrosion, with a long service life
Moderate hardness, maintaining good removal rate while reducing the risk of scratching
Made from a special polymer polyurethane and non-woven composite structure, compatible with alumina-based rough polishing slurries for over 48 hours

Backing adhesive and grooving services can be provided according to different requirements.
Standard grid groove sizes: 5×5 mm, 10×10 mm, 15×15 mm, 20×20 mm, 25×25 mm, 30×30 mm, etc.
Standard diameters: 380 mm, Φ610 mm, Φ640 mm, Φ855 mm, Φ910 mm, Φ930 mm, Φ1120 mm, Φ1180 mm, Φ1300 mm, etc.; custom sizes available.

AFM Surface Roughness Measurement

Sapphire Polishing Slurry JZ-A02

Data Performance After Candela Inspection

Data Performance After Candela Inspection

JIZHIエレクトロニクスSiC炭化ケイ素研磨スラリーの保管方法

換気の良い、涼しく乾燥した倉庫で保管すること。製品は直射日光と凍結を避け、5～35℃で保管すること。0 °C以下で保管すると、不可逆的な凝集が起こり、製品が使用できなくなることがある。.

JIZHIエレクトロニクスCMP/スラリー研磨液の価格

JIZHIエレクトロニクスのCMP用金属研磨スラリーは、海外の高度な生産技術と設備により製造され、特殊な化学組成で調合されています。輸入品と比較しても遜色のない品質です。.

現地生産により、JIZHIエレクトロニクスのCMPスラリーは、短納期、安定した高品質、競争力のある費用対効果の高い価格設定を実現しています。.