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Gizhil Electronic’s silicon carbide fine polishing slurry is suitable for the surface planarization of SiC silicon carbide wafer substrates during precision machining. The slurry used for wafer polishing exhibits high polishing efficiency and low surface roughness. After polishing with Gizhil Electronic’s SiC substrate polishing slurry, the wafer surface is free from defects such as scratches and haze, ensuring excellent flatness of the silicon carbide wafers. Developed by Gizhil Electronic, this silicon carbide polishing slurry offers a high dilution ratio and easy post-polishing cleaning, making it widely applicable in the manufacturing of semiconductor integrated circuit substrates. Gizhil Electronic’s SiC slurry for ...

Hard alloy blades possess a series of excellent properties, including high hardness, good toughness, heat resistance, and corrosion resistance. Particularly, their high hardness and wear resistance allow them to maintain significant hardness even at 1000°C. Tungsten steel workpieces made of hard alloy are considered a challenging material for many polishing processes. Currently, tungsten steel blades can be polished using CMP (Chemical Mechanical Polishing) technology combined with specialized metal polishing slurries to achieve an ideal surface finish. Hard alloy blades, also known as tungsten steel blades, often exhibit surface defects such as rust spots, scratches, and pitting on the raw workpiece. ...

Depending on the specific semiconductor industry processes, CMP (Chemical Mechanical Polishing) slurries can be categorized into dielectric layer CMP slurries, barrier layer CMP slurries, copper CMP slurries, silicon CMP slurries, tungsten CMP slurries, TSV (Through-Silicon Via) CMP slurries, shallow trench isolation CMP slurries, and others. SiC CMP slurry is one of the essential materials required in the semiconductor wafer manufacturing process. It plays a crucial role in the polishing of silicon carbide material workpieces. Factors such as the type of slurry, particle dispersion, particle size, physicochemical properties, and stability are closely related to the polishing outcome. In recent years, driven ...

Polishing the stainless steel back cover of a smart watch requires both the rough and fine polishing stages of the CMP process. Using Jizhi Electronics’ polishing slurry and pads in combination can achieve a perfect, flawless mirror finish. The workpiece is made of stainless steel, with visible texture lines before polishing. The surface to be polished on the original part has a curved shape. Unlike common flat surface polishing, curved and arched surface polishing requires designing polishing pads with different groove specifications and combining different cushioning materials. The curved surface is treated with polishing slurries of different compositions to remove ...

在氧化铝陶瓷片上实现镜面效果是一项重大挑战，主要原因有二：首先，氧化铝的硬度高，难以研磨；其次，氧化铝表面吸光性强，传统的抛光方法难以达到镜面效果。这些因素大大增加了氧化铝陶瓷抛光的难度。针对这些加工难题，吉之岛电子开发出了成熟的氧化铝陶瓷抛光技术和专用抛光浆料，为客户提供全面的抛光解决方案。对于需要镜面抛光的氧化铝陶瓷片材客户，传统工艺通常是先用铁片进行粗磨，然后再进行抛光 ...

传统的不锈钢镜面抛光工艺主要采用电化学抛光、化学抛光和机械抛光等抛光技术。随着对不锈钢镜面抛光表面质量的要求越来越高，以及提高抛光效率的需要，一种新的不锈钢抛光工艺--化学机械抛光（CMP）已被广泛采用。这种方法利用 CMP 设备、抛光浆料和抛光垫，结合化学反应和高速研磨，可获得高质量的表面。针对不锈钢的镜面处理，吉之岛电子配制了专门的 CMP 抛光浆料。这些研磨液通过化学溶液提高不锈钢的表面活性 ...