LN/LT Slurry
Lithium Tantalate / Lithium Niobate Polishing Slurry, Lithium Tantalate / Lithium Niobate Wafer Polishing Slurry, Lithium Tantalate / Lithium Niobate Grinding and Polishing Slurry, LTLN Polishing Slurry
SiO2/Al2O3/CeO2/ZrO2
Características principales
- High-purity raw materials with no contamination
- Fast polishing rate with high planarization
- High removal rate, good stability, low damage layer, and excellent surface quality
Nombre del producto
Lithium Tantalate / Lithium Niobate Polishing Slurry, Lithium Tantalate / Lithium Niobate Wafer Polishing Slurry, Lithium Tantalate / Lithium Niobate Grinding and Polishing Slurry, LTLN Polishing Slurry
Product Description
A chemical mechanical polishing slurry / slurry formulation developed for the semiconductor industry and for lithium tantalate / lithium niobate crystal wafer processing, suitable for high-efficiency planarization in precision and ultra-precision applications of LiTaO₃ / LiNbO₃. It is designed to improve the material removal rate of lithium tantalate (LiTaO₃) and lithium niobate (LiNbO₃) wafers, reduce surface roughness, and achieve an ultra-smooth surface.
Características del producto
A “two-component” polishing slurry suitable for lithium tantalate (LT) and lithium niobate (LN) substrates.
The polishing slurry JZ-4904 demonstrates excellent performance under high-pressure and high-speed CMP conditions, with the following features:
Achieves higher removal rates and better planarization in a shorter time.
Suitable not only for composite substrates but also for single substrates.
Excellent particle removal, resulting in extremely low particle count after CMP, eliminating the need for additional RCA cleaning.
Features of JIZHI Electronics Lithium Niobate (LiNbO₃) Polishing Slurry
- High-performance CMP polishing slurry for large-scale manufacturing of LiNbO₃ wafers.
- Synthesized through a special process, with spherical, monodispersed nanoparticles of uniform size and narrow particle size distribution, enabling high-quality polishing precision.
- Achieves high removal rates with no subsurface damage and provides excellent stability.
- pH, particle size, and stable ion content can be customized according to requirements.
- Compatible with various polishing pads for polishing applications.
Basic Properties of JZ-4904
| Product | JZ-4904 | ||
|---|---|---|---|
| Modelo | JZ-4904A Solution | JZ-4904B Solution | |
| Appearance | Liquid – White | Transparent | |
| Densidad | 1.28g/cm³ | 1.01g/cm³ | |
| Slurry Particle Size | 50nm | / | |
| pH Value | 10 | 1.1 | |
| USE | Mixing Ratio | DI Water : Solution B : Solution A = 10 : 1.5 : 3.5 | |
| Color | Light Yellow | ||
JZ-4904 Polishing Experiment – Processing Conditions 1
| Polishing Machine | Tokyo Seimitsu CMP Equipment: Champ |
|---|---|
| Product | 4-inch LT Wafer |
| Almohadilla pulidora | 1C1400 |
| Presión | 2 psi (low pressure) |
| Platen Speed | 60 rpm |
| Polishing Time | 5 min |
| Flow Rate | 150 mL/min (one-way) |
| Tasa de eliminación | 0.42 μm/min |
| Rugosidad superficial | < 0.3 nm |
Preparation of JZ~4904 Polishing Liquid
Método de almacenamiento de la pasta de pulido de carburo de silicio SiC de JIZHI Electronics
Almacenar en un almacén bien ventilado, fresco y seco. El producto debe almacenarse a 5-35 °C, protegido de la luz solar directa y de la congelación. Si se almacena por debajo de 0 °C, puede producirse una aglomeración irreversible que inutilice el producto.
Precios de JIZHI Electronics CMP / Slurry Polishing Liquids
Los lodos de pulido de metales CMP de JIZHI Electronics se fabrican utilizando tecnologías y equipos de producción extranjeros avanzados y se formulan con composiciones químicas especializadas. La calidad de los lodos de pulido de JIZHI Electronics es comparable a la de productos importados similares.
Gracias a la producción localizada, los lodos CMP de JIZHI Electronics ofrecen plazos de entrega cortos, una alta calidad estable y precios competitivos y rentables.
¿Por qué elegir Jizhi Electronics?
10 años de experiencia en CMP de material óptico
10 años de experiencia en CMP de material óptico
Las soluciones y fórmulas de pulido se personalizan con flexibilidad
Fórmula no tóxica y biodegradable que cumple los requisitos internacionales.
Depuración gratuita de procesos
40% tiempo de procesamiento más rápido que el convencionala
Introducir tecnologías y equipos de producción extranjeros
La tasa de consumo optimizada reduce la operati
