Semiconductor Polishing Slurry Sapphire Polishing Slurry / Grinding Slurry

Product Description

The Sapphire Grinding Slurry / Sapphire LED Substrate Polishing Slurry / Sapphire Slurry formulation developed for the semiconductor and optical industries is suitable for the planarization of sapphire substrates, epitaxial wafers, and LEDs. Designed to meet the requirements of every substrate manufacturing stage from grinding to CMP, it provides a high-performance, cost-effective solution for sapphire substrate polishing applications.

Caractéristiques du produit

High-purity raw materials with no contamination
Fast polishing rate with high planarization
High removal rate, good stability, low damage layer, and excellent surface quality

Features of JIZHI Electronics CMP Sapphire Grinding Slurry / Polishing Slurry

1.High-performance slurry for the mass production of sapphire wafers.
2.The formulation is designed to meet the requirements of every process stage in substrate manufacturing, from grinding to CMP, and is suitable for oriented sapphire wafers, including C-plane, A-plane, and R-plane polishing.
3.It achieves a high removal rate with no subsurface damage, while providing excellent stability and reusability.
4.The JIZHI Electronics sapphire slurry product portfolio provides a high-performance and cost-effective solution.
5.Customized one-to-one solutions can be provided according to specific grinding and polishing requirements.

C-Plane Sapphire Substrate Polishing Process and Supporting Materials

Technical Specifications of Diamond Grinding Slurry

Specification	Coarse Grinding Diamond Slurry
Product Type	Polycrystalline Diamond-Like Slurry
Model	JZ-CD06	JZ-CD04	JZ-CD02
Matching Plate / Pad	Copper Plate	Copper Plate	Copper Plate
pH Value	4-6	4-6	4-6
Particle Size (D50)	5–6 μm	3–4 μm	1–2 μm
Removal Rate	3.3 μm/min	2.6 μm/min	2.0 μm/min
Surface Quality	Fine grinding texture

Caractéristiques du produit

Fast removal rate / Easy to clean after polishing / Stable particle size with fine texture

Technical Specifications and Product Introduction of Alumina Polishing Slurry

Specification	Alumina Polishing Slurry
Applicable Wafer	C-plane Sapphire Substrate
Product Model	JZ-A02	JZ-A03
Matching Polishing Pad	Non-woven Pad Z-800T
Solid Content	20	20
pH Value	12-14	3-5
Particle Size (D50)	0.5-1.5 μm	0.5-1.5 μm
Removal Rate	0.13μm	0.08μm
Dilution Ratio	5–10×	5–10×

Caractéristiques du produit

High dilution ratio, reducing costs
Alkaline formulation with fast removal rate, good suspension performance, and easy redispersion
Long service life, stable particle size, and no scratching

Technical Specifications and Product Introduction of Polishing Pad

Suitable for rough polishing of sapphire and silicon carbide substrates

Resistant to strong acids, alkalis, and corrosion, with a long service life
Moderate hardness, maintaining good removal rate while reducing the risk of scratching
Made from a special polymer polyurethane and non-woven composite structure, compatible with alumina-based rough polishing slurries for over 48 hours

Backing adhesive and grooving services can be provided according to different requirements.
Standard grid groove sizes: 5×5 mm, 10×10 mm, 15×15 mm, 20×20 mm, 25×25 mm, 30×30 mm, etc.
Standard diameters: 380 mm, Φ610 mm, Φ640 mm, Φ855 mm, Φ910 mm, Φ930 mm, Φ1120 mm, Φ1180 mm, Φ1300 mm, etc.; custom sizes available.

AFM Surface Roughness Measurement

Sapphire Polishing Slurry JZ-A02

Data Performance After Candela Inspection

Data Performance After Candela Inspection

Storage Method for JIZHI Electronics SiC Silicon Carbide Polishing Slurry

Stocker dans un entrepôt bien ventilé, frais et sec. Le produit doit être stocké à une température comprise entre 5 et 35 °C, à l'abri de la lumière directe du soleil et du gel. S'il est stocké à une température inférieure à 0 °C, une agglomération irréversible peut se produire, rendant le produit inutilisable.

Prix des liquides de polissage CMP / Slurry de JIZHI Electronics

Les boues de polissage des métaux CMP de JIZHI Electronics sont fabriquées à l'aide de technologies et d'équipements de production avancés à l'étranger et sont formulées avec des compositions chimiques spécialisées. La qualité des boues de polissage de JIZHI Electronics est comparable à celle de produits importés similaires.

Grâce à une production locale, les boues CMP de JIZHI Electronics offrent des délais de livraison courts, une haute qualité stable et des prix compétitifs et rentables.