Indium Phosphide (InP) Polishing Slurry

Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries

Indium Phosphide (InP) Wafer Polishing Slurry / InP Polishing Slurry

主要功能

  • High-purity raw materials with no contamination
  • Fast polishing rate with high planarization
  • High removal rate, good stability, low damage layer, and excellent surface quality

产品名称

Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries

Product Description

Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries, suitable for planarization processing of InP wafers. Designed to meet the requirements of all process stages from grinding to CMP in substrate manufacturing, it provides a high-performance and cost-effective solution for InP wafer polishing applications.

产品特点

High-purity raw materials with no contamination
Fast polishing rate with high planarization
High removal rate, good stability, low damage layer, and excellent surface quality

Indium Phosphide (InP) Polishing Slurry
Indium Phosphide (InP) Polishing Slurry

Features of JIZHI Electronics CMP Indium Phosphide (InP) Grinding/Polishing Slurry

1.The formulation is designed to meet the requirements of all process stages from grinding to CMP in substrate manufacturing, enabling rapid thinning and polishing of InP wafers.
2.Achieves high removal rates on InP surfaces with no subsurface damage, while providing excellent stability and reusability.
3.JIZHI Electronics sapphire slurry combinations offer high performance and cost-effective solutions.
4.Customized 1-to-1 solutions can be provided according to specific grinding and polishing requirements.

Material Properties and Application Value of InP

Core Material Properties

Indium phosphide, as an important semiconductor material, features high electron mobility and a wide bandgap, making it a key foundational material for optoelectronic and high-frequency devices.

Main Application Fields

It is widely used in optoelectronics and communication fields, with irreplaceable applications in optical communication devices, infrared detectors, and high-frequency transistors.

Importance of Polishing Process

The polishing process directly affects the surface quality and performance of indium phosphide materials, making it a critical step in improving application reliability and device performance.

Indium Phosphide (InP) Polishing Process Parameters

Indium Phosphide (InP) Polishing Slurry

InP CMP Polishing Process Parameters

InP CMP Polishing Process Parameters
Wafer Size (inch) 2
Wafer Area (cm²) 20.3
Polishing Pressure (g/cm²) 115
Upper Platen Speed (r/min) 80
Lower Platen Speed (r/min)(Platen Diameter φ300 mm) 110
Slurry Flow Rate (ml/min) 30
InP Wafer Post-Polishing Cleaning Process Immediately rinse the wafer with deionized water after unloading to keep the surface wet.
Rinse the wafer surface and polishing carrier evenly with deionized water for 1 minute.
After rinsing, dry the wafer using high-purity nitrogen or a spin dryer.

Experimental Data Comparison

Experimental Data Finished Standard Wafer Japanese F Competitor Slurry JIZHI Self-Developed Slurry (F-System Equivalent)
Slurry pH Value / 3.2 2.9
Removal Rate (μm/min) / 0.21 0.33
Surface Roughness (nm) <0.2 0.2 0.19
Usage Method Purchased standard wafer (sample) 1 g powder + 500 g water + 180 g polishing slurry 1 g powder + 500 g water + 125 g polishing slurry

Storage Method for JIZHI Electronics SiC Silicon Carbide Polishing Slurry

Store in a well-ventilated, cool, and dry warehouse. The product must be stored at 5–35 °C, protected from direct sunlight and from freezing. If stored below 0 °C, irreversible agglomeration may occur, rendering the product unusable.

Pricing of JIZHI Electronics CMP / Slurry Polishing Liquids

JIZHI Electronics’ CMP metal polishing slurries are manufactured using advanced overseas production technologies and equipment and are formulated with specialized chemical compositions. The quality of JIZHI Electronics’ polishing slurries is comparable to that of similar imported products.

Thanks to localized production, JIZHI Electronics’ CMP slurries offer short delivery lead times, stable high quality, and competitive, cost-effective pricing.

为什么选择集智电子?

  • 10 年光学材料 CMP 经验

    10 年光学材料 CMP 经验

  • 抛光方案和配方可灵活定制

    无毒、可生物降解配方,符合国际环保标准。

  • 免费进程调试

    40% 的处理时间比传统方法更快a

  • 引进国外生产技术和设备

    优化的消耗率降低了总体运行成本。