Indium Phosphide (InP) Polishing Slurry
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries
Indium Phosphide (InP) Wafer Polishing Slurry / InP Polishing Slurry
Key Features
- High-purity raw materials with no contamination
- Fast polishing rate with high planarization
- High removal rate, good stability, low damage layer, and excellent surface quality
Product Name
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries
Product Description
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries, suitable for planarization processing of InP wafers. Designed to meet the requirements of all process stages from grinding to CMP in substrate manufacturing, it provides a high-performance and cost-effective solution for InP wafer polishing applications.
Product Features
High-purity raw materials with no contamination
Fast polishing rate with high planarization
High removal rate, good stability, low damage layer, and excellent surface quality
Features of JIZHI Electronics CMP Indium Phosphide (InP) Grinding/Polishing Slurry
1.The formulation is designed to meet the requirements of all process stages from grinding to CMP in substrate manufacturing, enabling rapid thinning and polishing of InP wafers.
2.Achieves high removal rates on InP surfaces with no subsurface damage, while providing excellent stability and reusability.
3.JIZHI Electronics sapphire slurry combinations offer high performance and cost-effective solutions.
4.Customized 1-to-1 solutions can be provided according to specific grinding and polishing requirements.
Material Properties and Application Value of InP
Core Material Properties
Indium phosphide, as an important semiconductor material, features high electron mobility and a wide bandgap, making it a key foundational material for optoelectronic and high-frequency devices.
Main Application Fields
It is widely used in optoelectronics and communication fields, with irreplaceable applications in optical communication devices, infrared detectors, and high-frequency transistors.
Importance of Polishing Process
The polishing process directly affects the surface quality and performance of indium phosphide materials, making it a critical step in improving application reliability and device performance.
Indium Phosphide (InP) Polishing Process Parameters
InP CMP Polishing Process Parameters
| InP CMP Polishing Process Parameters | |
|---|---|
| Wafer Size (inch) | 2 |
| Wafer Area (cm²) | 20.3 |
| Polishing Pressure (g/cm²) | 115 |
| Upper Platen Speed (r/min) | 80 |
| Lower Platen Speed (r/min)(Platen Diameter φ300 mm) | 110 |
| Slurry Flow Rate (ml/min) | 30 |
| InP Wafer Post-Polishing Cleaning Process |
Immediately rinse the wafer with deionized water after unloading to keep the surface wet. Rinse the wafer surface and polishing carrier evenly with deionized water for 1 minute. After rinsing, dry the wafer using high-purity nitrogen or a spin dryer. |
Experimental Data Comparison
| Experimental Data | Finished Standard Wafer | Japanese F Competitor Slurry | JIZHI Self-Developed Slurry (F-System Equivalent) |
|---|---|---|---|
| Slurry pH Value | / | 3.2 | 2.9 |
| Removal Rate (μm/min) | / | 0.21 | 0.33 |
| Surface Roughness (nm) | <0.2 | 0.2 | 0.19 |
| Usage Method | Purchased standard wafer (sample) | 1 g powder + 500 g water + 180 g polishing slurry | 1 g powder + 500 g water + 125 g polishing slurry |
Storage Method for JIZHI Electronics SiC Silicon Carbide Polishing Slurry
Store in a well-ventilated, cool, and dry warehouse. The product must be stored at 5–35 °C, protected from direct sunlight and from freezing. If stored below 0 °C, irreversible agglomeration may occur, rendering the product unusable.
Pricing of JIZHI Electronics CMP / Slurry Polishing Liquids
JIZHI Electronics’ CMP metal polishing slurries are manufactured using advanced overseas production technologies and equipment and are formulated with specialized chemical compositions. The quality of JIZHI Electronics’ polishing slurries is comparable to that of similar imported products.
Thanks to localized production, JIZHI Electronics’ CMP slurries offer short delivery lead times, stable high quality, and competitive, cost-effective pricing.
Why choose Jizhi Electronics?
10 years of experience in optical material CMP
10 years of experience in optical material CMP
Polishing solutions and formulas are flexibly customized
Non-toxic, biodegradable formula meeting internati
Free process debugging
40% faster processing time compared to conventiona
Introduce foreign production technologies and equipment
Optimized consumption rate reduces overall operati
