Indiumphosphid (InP) Polierschlämme
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries
Indium Phosphide (InP) Wafer Polishing Slurry / InP Polishing Slurry
Wesentliche Merkmale
- High-purity raw materials with no contamination
- Fast polishing rate with high planarization
- High removal rate, good stability, low damage layer, and excellent surface quality
Produktname
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries
Product Description
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries, suitable for planarization processing of InP wafers. Designed to meet the requirements of all process stages from grinding to CMP in substrate manufacturing, it provides a high-performance and cost-effective solution for InP wafer polishing applications.
Produktmerkmale
High-purity raw materials with no contamination
Fast polishing rate with high planarization
High removal rate, good stability, low damage layer, and excellent surface quality
Features of JIZHI Electronics CMP Indium Phosphide (InP) Grinding/Polishing Slurry
1.The formulation is designed to meet the requirements of all process stages from grinding to CMP in substrate manufacturing, enabling rapid thinning and polishing of InP wafers.
2.Achieves high removal rates on InP surfaces with no subsurface damage, while providing excellent stability and reusability.
3.JIZHI Electronics sapphire slurry combinations offer high performance and cost-effective solutions.
4.Customized 1-to-1 solutions can be provided according to specific grinding and polishing requirements.
Material Properties and Application Value of InP
Core Material Properties
Indium phosphide, as an important semiconductor material, features high electron mobility and a wide bandgap, making it a key foundational material for optoelectronic and high-frequency devices.
Main Application Fields
It is widely used in optoelectronics and communication fields, with irreplaceable applications in optical communication devices, infrared detectors, and high-frequency transistors.
Importance of Polishing Process
The polishing process directly affects the surface quality and performance of indium phosphide materials, making it a critical step in improving application reliability and device performance.
Indium Phosphide (InP) Polishing Process Parameters
InP CMP Polishing Process Parameters
| InP CMP Polishing Process Parameters | |
|---|---|
| Wafer Size (inch) | 2 |
| Wafer Area (cm²) | 20.3 |
| Polishing Pressure (g/cm²) | 115 |
| Upper Platen Speed (r/min) | 80 |
| Lower Platen Speed (r/min)(Platen Diameter φ300 mm) | 110 |
| Slurry Flow Rate (ml/min) | 30 |
| InP Wafer Post-Polishing Cleaning Process |
Immediately rinse the wafer with deionized water after unloading to keep the surface wet. Rinse the wafer surface and polishing carrier evenly with deionized water for 1 minute. After rinsing, dry the wafer using high-purity nitrogen or a spin dryer. |
Experimental Data Comparison
| Experimental Data | Finished Standard Wafer | Japanese F Competitor Slurry | JIZHI Self-Developed Slurry (F-System Equivalent) |
|---|---|---|---|
| Slurry pH Value | / | 3.2 | 2.9 |
| Removal Rate (μm/min) | / | 0.21 | 0.33 |
| Surface Roughness (nm) | <0.2 | 0.2 | 0.19 |
| Usage Method | Purchased standard wafer (sample) | 1 g powder + 500 g water + 180 g polishing slurry | 1 g powder + 500 g water + 125 g polishing slurry |
Lagerungsmethode für JIZHI Electronics SiC Siliziumkarbid-Polierschlamm
In einem gut belüfteten, kühlen und trockenen Lagerhaus aufbewahren. Das Produkt muss bei 5-35 °C gelagert werden und vor direkter Sonneneinstrahlung und Frost geschützt werden. Bei Lagerung unter 0 °C kann es zu irreversibler Agglomeration kommen, wodurch das Produkt unbrauchbar wird.
Preisgestaltung von JIZHI Electronics CMP / Slurry Polierflüssigkeiten
Die CMP-Metallpolierschlämme von JIZHI Electronics werden mit fortschrittlichen Produktionstechnologien und -anlagen in Übersee hergestellt und mit speziellen chemischen Zusammensetzungen formuliert. Die Qualität der Polierschlämme von JIZHI Electronics ist vergleichbar mit der von ähnlichen importierten Produkten.
Dank der lokalen Produktion bieten die CMP-Slurries von JIZHI Electronics kurze Lieferzeiten, eine stabile, hohe Qualität und wettbewerbsfähige, kostengünstige Preise.
Warum Jizhi Electronics wählen?
10 Jahre Erfahrung im Bereich CMP für optische Materialien
10 Jahre Erfahrung im Bereich CMP für optische Materialien
Polierlösungen und -rezepturen werden flexibel angepasst
Ungiftige, biologisch abbaubare Formel, die den internationalen
Kostenloses Prozess-Debugging
40% schnellere Bearbeitungszeit im Vergleich zu konventionellen Produkten
Einführung ausländischer Produktionstechnologien und Ausrüstungen
Optimierte Verbrauchsrate reduziert die Gesamtbetriebskosten
