Indium Phosphide (InP) Polishing Slurry
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries
Indium Phosphide (InP) Wafer Polishing Slurry / InP Polishing Slurry
Características principales
- High-purity raw materials with no contamination
- Fast polishing rate with high planarization
- High removal rate, good stability, low damage layer, and excellent surface quality
Nombre del producto
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries
Product Description
Indium Phosphide (InP) polishing slurry / CMP slurry formulation tailored for the semiconductor and optical industries, suitable for planarization processing of InP wafers. Designed to meet the requirements of all process stages from grinding to CMP in substrate manufacturing, it provides a high-performance and cost-effective solution for InP wafer polishing applications.
Características del producto
High-purity raw materials with no contamination
Fast polishing rate with high planarization
High removal rate, good stability, low damage layer, and excellent surface quality
Features of JIZHI Electronics CMP Indium Phosphide (InP) Grinding/Polishing Slurry
1.The formulation is designed to meet the requirements of all process stages from grinding to CMP in substrate manufacturing, enabling rapid thinning and polishing of InP wafers.
2.Achieves high removal rates on InP surfaces with no subsurface damage, while providing excellent stability and reusability.
3.JIZHI Electronics sapphire slurry combinations offer high performance and cost-effective solutions.
4.Customized 1-to-1 solutions can be provided according to specific grinding and polishing requirements.
Material Properties and Application Value of InP
Core Material Properties
Indium phosphide, as an important semiconductor material, features high electron mobility and a wide bandgap, making it a key foundational material for optoelectronic and high-frequency devices.
Main Application Fields
It is widely used in optoelectronics and communication fields, with irreplaceable applications in optical communication devices, infrared detectors, and high-frequency transistors.
Importance of Polishing Process
The polishing process directly affects the surface quality and performance of indium phosphide materials, making it a critical step in improving application reliability and device performance.
Indium Phosphide (InP) Polishing Process Parameters
InP CMP Polishing Process Parameters
| InP CMP Polishing Process Parameters | |
|---|---|
| Wafer Size (inch) | 2 |
| Wafer Area (cm²) | 20.3 |
| Polishing Pressure (g/cm²) | 115 |
| Upper Platen Speed (r/min) | 80 |
| Lower Platen Speed (r/min)(Platen Diameter φ300 mm) | 110 |
| Slurry Flow Rate (ml/min) | 30 |
| InP Wafer Post-Polishing Cleaning Process |
Immediately rinse the wafer with deionized water after unloading to keep the surface wet. Rinse the wafer surface and polishing carrier evenly with deionized water for 1 minute. After rinsing, dry the wafer using high-purity nitrogen or a spin dryer. |
Experimental Data Comparison
| Experimental Data | Finished Standard Wafer | Japanese F Competitor Slurry | JIZHI Self-Developed Slurry (F-System Equivalent) |
|---|---|---|---|
| Slurry pH Value | / | 3.2 | 2.9 |
| Removal Rate (μm/min) | / | 0.21 | 0.33 |
| Surface Roughness (nm) | <0.2 | 0.2 | 0.19 |
| Usage Method | Purchased standard wafer (sample) | 1 g powder + 500 g water + 180 g polishing slurry | 1 g powder + 500 g water + 125 g polishing slurry |
Método de almacenamiento de la pasta de pulido de carburo de silicio SiC de JIZHI Electronics
Almacenar en un almacén bien ventilado, fresco y seco. El producto debe almacenarse a 5-35 °C, protegido de la luz solar directa y de la congelación. Si se almacena por debajo de 0 °C, puede producirse una aglomeración irreversible que inutilice el producto.
Precios de JIZHI Electronics CMP / Slurry Polishing Liquids
Los lodos de pulido de metales CMP de JIZHI Electronics se fabrican utilizando tecnologías y equipos de producción extranjeros avanzados y se formulan con composiciones químicas especializadas. La calidad de los lodos de pulido de JIZHI Electronics es comparable a la de productos importados similares.
Gracias a la producción localizada, los lodos CMP de JIZHI Electronics ofrecen plazos de entrega cortos, una alta calidad estable y precios competitivos y rentables.
¿Por qué elegir Jizhi Electronics?
10 años de experiencia en CMP de material óptico
10 años de experiencia en CMP de material óptico
Las soluciones y fórmulas de pulido se personalizan con flexibilidad
Fórmula no tóxica y biodegradable que cumple los requisitos internacionales.
Depuración gratuita de procesos
40% tiempo de procesamiento más rápido que el convencionala
Introducir tecnologías y equipos de producción extranjeros
La tasa de consumo optimizada reduce la operati
